MDP 16 Search Results

72976

Abstract: 73006
Contextual Info: Model Number Index Model# 26 Page# B . . . . . . . . . . . . . . 22 HB. . . . . . . . . . . . . 22 MDP. . . . . . . . . . . . 14 MDP-S. . . . . . . . . . 14 MDP-ST. . . . . . . . . 14 MDP-X. . . . . . . . . . 14 1297. . . . . . . . . . . .13 1297. . . . . . . . . . . .25

208E

Abstract: MDP1646D04 MDP 16
Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55°C to + 125°C , MDP 1645: ± 100ppm/°C, MDP 1646: ± 250ppm/°C

Contextual Info: MDP 1645, 1646 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55°C to + 125°C , MDP 1645: ± 100ppm/°C, MDP 1646: ± 250ppm/°C

208E

Contextual Info: MDP 1645, 1646 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55°C to + 125°C , MDP 1645: ± 100ppm/°C, MDP 1646: ± 250ppm/°C

Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55°C to + 125°C , MDP 1645: ± 100ppm/°C, MDP 1646: ± 250ppm/°C

208E

Abstract: MDP1646D04 MDP 16
Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83 mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55 °C to + 125 °C , MDP 1645: ± 100 ppm/°C, MDP 1646: ± 250 ppm/°C

208E

Abstract: MDP1646D04 MDP 16
Contextual Info: MDP 45, 46 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • 0.190" [4.83 mm] maximum seated height • Rugged, molded case construction • Low temperature coefficient - 55 °C to + 125 °C , MDP 1645: ± 100 ppm/°C, MDP 1646: ± 250 ppm/°C

Contextual Info: Model Number Index Pomona r U rn U n d jiG Mane Forriotw ACCESS Page AL-B. .90533. .58 B . .90534. .55 BNC-C. .90445. .32 HB. .90535. .55 MDP. .90505. .76 MDP-S. .90505. .76

lens actuator

Abstract: MDP16
Contextual Info: SERIES MDP-16 SWITCHES PUSHBUTTON SWITCHES - MODULAR MECHANICAL SPECIFICATIONS Mechanical Life: 50,000 cycles Force: 500 grams for SPDT; 800 grams for DPDT ELECTRICAL SPECIFICATIONS APPLICATIONS / MARKETS FEATURES & BENEFITS Industrial Controls Instrumentation

SPDT pushbutton

Abstract: DPDT TOGGLE SWITCHES switches pushbutton square dpdt 8A125VAC
Contextual Info: SERIES MDP-16 SWITCHES TACT SWITCHES PUSHBUTTON SWITCHES - MODULAR Contact Rating: 5A, 250VAC; 8A, 125VAC UL and VDE Life Expectancy Mechanical : 50,000 cycles 6,000 cycles Contact Resistance: 100mΩ (initial max) Insulation Resistance: 50MΩ @ 100V min.

TWL5030

Abstract: wl1271 WL1271 datasheet Sandisk eMMC emmc socket omap3430 eMMC memory Wl1271 Solution eMMC sandisk SD
Contextual Info: PRODUCT BRIEF: Logic : Texas Instruments www.logicpd.com/ti Zoom OMAP34x-II Mobile Development Platform The Zoom OMAP34x-II Mobile Development Platform MDP is a full-featured evaluation platform built around Texas Instruments’ (TI) OMAP3430 processor.

Sandisk eMMC

Abstract: TWL5030 synaptics OMAP3630 WL1271 Camera module 8MP Toggle DDR NAND flash emmc socket capacitive touch screen 8MP camera module
Contextual Info: PRODUCT BRIEF: Logic : Texas Instruments www.logicpd.com/ti Zoom OMAP36x Mobile Development Platform The Zoom OMAP36x Mobile Development Platform MDP is a fully-featured evaluation platform built around the Texas Instruments (TI) OMAP3630 applications processor.

omap3430

Abstract: TWL5030 wl1271 Sandisk eMMC WL1271 datasheet WL1271 SOLUTION emmc socket usb 3g modem circuit synaptics eMMC
Contextual Info: PRODUCT BRIEF: Logic : Texas Instruments www.logicpd.com/ti Zoom OMAP34x-II Mobile Development Platform The Zoom OMAP34x-II Mobile Development Platform MDP is a full-featured evaluation platform built around Texas Instruments’ (TI) OMAP3430 processor.

dale mdp1603

Abstract: mdp1403 MDP1401 DALE RESISTOR NETWORKS MDP1603 MDP1405 dale mdp1401 thick film 330 resistor network dale mdp1405 MDP1403101G MDP-1401
Contextual Info: MDP 14, 16 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP, 01, 03, 05 Schematics FEATURES • 0.160" [4.06mm] maximum seated height and rugged, molded case construction. • Highly stable thick film • Low temperature coefficient - 55°C to + 125°C

dale mdp1603

Abstract: mdp1403 MDP1603 mdp1401 mdp1405 DALE RESISTOR NETWORKS resistor 270 ohm MDP14-01 2.2M ohm resistor 208E
Contextual Info: MDP 14, 16 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP, 01, 03, 05 Schematics FEATURES • 0.160" [4.06mm] maximum seated height and rugged, molded case construction. • Highly stable thick film • Low temperature coefficient - 55°C to + 125°C

Contextual Info: MDP 01, 03, 05 www.vishay.com Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • Isolated, bussed, and dual terminator schematics available Available • 0.160" 4.06 mm maximum seated height and rugged, molded case construction

AN64465

Abstract: CYWB022X OMAP 4 multiplexed ram
Contextual Info: AN64465 West Bridge Integration to Android on OMAP Zoom II MDP: RNDIS, CDC-ECM, and Mass Storage Functions Author: Dhanraj Rajput Associated Project: Yes Associated Part Family: CYWB022X Software Version: Astoria SDK, Android Kernel Release 2.6.29 Associated Application Notes: None

mdp1403

Abstract: MDP1603 MDP16-01 10R0 MDP14 MDP16 dale mdp1603 MDP1605 dale MDP14-03
Contextual Info: MDP 01, 03, 05 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • Isolated, bussed and dual terminator schematics available • 0.160" 4.06 mm maximum seated height and rugged, molded case construction • Thick film resistive elements

Contextual Info: MDP 45, 46 www.vishay.com Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • TTL/ECL translater and SCSI-BUS signal terminator schematics available Available • 0.190" 4.83 mm maximum seated height • Rugged, molded case construction

Contextual Info: MDP 01, 03, 05 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • Isolated, bussed and dual terminator schematics available • 0.160" 4.06 mm maximum seated height and rugged, molded case construction • Thick film resistive elements

Sj 47 diode

Abstract: PEPE
Contextual Info: €* Rockwell Semiconductor Systems RCVDL56DPi/SP Downloadable K56flex , V.34 Data, V.17 Fax, Voice, Speakerphone, Modem Data Pump_ Introduction Features The Rockwell RCVDL56DPi/SP is a K56flex™/V.34 modem data pump MDP family that supports receive

MD10B

Abstract: MD-10B
Contextual Info: RC32DPC fl» Rockwell RC32DPC CDPD Wireless Modem Data Pump with V.32 bis Wireline Support INTRODUCTION FEATURES The Rockwell RC32DPC modem data pump MDP provides the baseband signal processing needed to support the Cellular Digital Packet Data (CDPD) wireless system. The RC32DPC

Contextual Info: KA3017 CD PRODUCTS SPINDLE + ACTUATOR DRIVER 48-QFPH-1414 The KA3017 is a monolithic integrated circuit suitable for a 4-ch motor driver which drives the tracking actuator, focus actuator, sled motor, loading motor and 3-phase BLDC spindle motor of the MDP/CAR-MD/CAR-NAVIGATION

mdp1403

Abstract: MDP1603 mdp1405 mdp1601 dale mdp1603 MDP16-01 MDP 2011 dale mdp1405
Contextual Info: MDP 01, 03, 05 Vishay Dale Thick Film Resistor Networks, Dual-In-Line, Molded DIP FEATURES • Isolated, bussed and dual terminator schematics available • 0.160" 4.06 mm maximum seated height and rugged, molded case construction • Thick film resistive elements