METAL MASK LAYOUT Search Results
METAL MASK LAYOUT Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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TCK401G |
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MOSFET Gate Driver IC, 2.7 to 28 V, External MOSFET Gate drive / Inrush current reducing / Auto-discharge, WCSP6E |
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TCK425G |
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MOSFET Gate Driver IC, 2.7 to 28 V, External MOSFET Gate drive / Inrush current reducing, WCSP6G |
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TCK423G |
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MOSFET Gate Driver IC, 2.7 to 28 V, External MOSFET Gate drive / Inrush current reducing, WCSP6G |
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TCK420G |
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MOSFET Gate Driver IC, 2.7 to 28 V, External MOSFET Gate drive / Inrush current reducing, WCSP6G |
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TCK424G |
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MOSFET Gate Driver IC, 2.7 to 28 V, External MOSFET Gate drive / Inrush current reducing, WCSP6G |
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METAL MASK LAYOUT Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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USP-2B02Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-2B02 •Packaging Information ■Reference Pattern Layout Dimension Unit: mm Reference metal mask design |
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USP-2B02 USP-2B02 | |
USP-8A01Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-8A01 •Packaging Information ■Reference Pattern Layout Dimension Unit: mm Reference metal mask design |
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USP-8A01 USP-8A01 | |
CL-2025Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●CL-2025 •Packaging Information ■Reference Pattern Layout Dimension Unit: mm Reference metal mask design |
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CL-2025 CL-2025 | |
USP-2B01Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-2B01 •Packaging Information ■Reference Pattern Layout Dimension Unit: mm Reference metal mask design |
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USP-2B01 USP-2B01 | |
usp-6elContextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-6EL •Packaging Information Unit: mm ■Reference Pattern Layout Dimension Note : reference metal mask design |
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USPN-6Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USPN-6 •Packaging Information Unit: mm ■Reference Pattern Layout Dimension Note : reference metal mask design |
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USP-10BContextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-10B •Packaging Information Unit: mm ■Reference Pattern Layout Dimension Note : reference metal mask design |
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USP-10B USP-10B | |
USP-4DContextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-4D •Packaging Information Unit: mm ■Reference Pattern Layout Dimension Note : reference metal mask design |
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USP-6CContextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-6C •Packaging Information Unit: mm ■Reference Pattern Layout Dimension Note : reference metal mask design |
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USP-4Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-4 Unit: mm •Packaging Information ■Reference Pattern Layout Dimension Note : reference metal mask design |
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Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●XCL205/6/7 •Packaging Information ■Reference Pattern Layout Dimension Unit: mm Reference metal mask design |
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XCL205/6/7 | |
USP-6BContextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-6B •Packaging Information Unit: mm ■Reference Pattern Layout Dimension Note : reference metal mask design |
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USPN-4Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USPN-4 •Packaging Information Unit: mm ■Reference Pattern Layout Dimension Note : reference metal mask design |
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USP-3Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-3 •Packaging Information Unit: mm ■Reference Pattern Layout Dimension Note : reference metal mask design |
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QFN-20
Abstract: qfn20
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QFN-20 QFN-20 qfn20 | |
USPN-4B02Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USPN-4B02 Unit: mm •Packaging Information 0.95±0.05 0.75±0.05 +0.02 0.38-0.03 1pin INDENT 4 3 0.4 ■Reference Pattern Layout Dimension Reference metal mask design 0.23 0.18 0.35 0.18 0.5 |
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USPN-4B02 USPN-4B02 | |
usp-8Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-8 Unit: mm •Packaging Information *The side of pins are not gilded, but nickel is used. *Pin #1 is wider than other pins. ■Reference Pattern Layout Dimension Note : reference metal mask design |
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Contextual Info: 5 LSI LO G IC C O R P O R A T IO N ' LSA2003 c5 l Tw o M icron HCMOS Structured Array 000976 General Description Arrays provide a high density of logic functionality while maintaining the flexibility of design and fast turn-around of metal mask programmable logicarrays. The use of dual layer metal interconnect |
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LSA2003 Telex-172153 | |
usp-10Contextual Info: Packaging Information / Reference Pattern Layout Dimensions ●USP-10 Unit: mm •Packaging Information ■Reference Pattern Layout Dimension Note : reference metal mask design 2. 3 0. 25 0 .2 5 0. 25 0 .2 5 9 8 7 0. 25 6 10 9 8 0. 25 7 6 4 5 0 .3 5 0. 45 |
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USP-10 usp-10 | |
7000-SERIES
Abstract: NCM70013Z NCM70015Z NCM Corporation
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7000-SERIES 70013Z NCM70013Z NCM70015Z NCM Corporation | |
NCM70013Z
Abstract: NCM70015Z NCM Corporation
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7000-SERIES 70013Z NCM70013Z NCM70015Z NCM Corporation | |
SMBJ20AContextual Info: LM30-00J0512-03E 30W,AC-DC CONVERTER LM30-00J0512-03E-a metal mask switching power supply offered by MORNSUN. It features universal input voltage, taking both DC and AC input voltage, multiplexed output, high efficiency, high reliability, low power consumption, safer isolation. It offers good EMC performance, certificate |
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LM30-00J0512-03E LM30-00J0512-03E----a IEC/EN61000-4, CISPR22/EN55022standards, 264VAC 50/60HZ 2000VAC 2nF/400VAC FL2D-10-332 SMBJ20A | |
Contextual Info: cQ ^p f'C LSI LO G IC C O R P O R A T IO N LSA 2004 c T w o M icro n H CM O S S tru ctu red A r r a y TM 000977 General Description Arrays provide a high density of logic fun ctionality while m aintaining the fle xib ility of design and fast turn-around of metal mask programmable logicarrays. The use of dual layer metal interconnect |
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LSA2004 2304-bit 2304-Bit) Telex-172153 753/1185/20K/IM/J | |
NCM3001Z
Abstract: NCM3002Z NCM3003Z
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3000-SERIES NCM3001Z NCM3002Z NCM3003Z |