METALLIZATION Search Results
METALLIZATION Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
---|---|---|---|---|---|
TCK424G |
![]() |
MOSFET Gate Driver IC, 2.7 to 28 V, External MOSFET Gate drive / Inrush current reducing, WCSP6G |
![]() |
||
TCK425G |
![]() |
MOSFET Gate Driver IC, 2.7 to 28 V, External MOSFET Gate drive / Inrush current reducing, WCSP6G |
![]() |
||
TCK423G |
![]() |
MOSFET Gate Driver IC, 2.7 to 28 V, External MOSFET Gate drive / Inrush current reducing, WCSP6G |
![]() |
||
TCK420G |
![]() |
MOSFET Gate Driver IC, 2.7 to 28 V, External MOSFET Gate drive / Inrush current reducing, WCSP6G |
![]() |
||
TCK422G |
![]() |
MOSFET Gate Driver IC, 2.7 to 28 V, External MOSFET Gate drive / Inrush current reducing, WCSP6G |
![]() |
METALLIZATION Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
---|---|---|---|
TGF1350Contextual Info: Texas Instruments TGF1350 Low-Noise Microwave GaAs FET Features • 1.5-dB noise figure with 11 -dB associated gain at 10 GHz ■ 2.2-dB noise figure with 7-dB associated gain at 18 GHz ■ All-gold metallization ■ Recessed 1/2-^m gate structure ■ Si3N4 channel passivation |
OCR Scan |
TGF1350 TGF1350 | |
LT3973-3.3
Abstract: CDR01-CDR06 C1206 KEMET packaging PEF55801VV1.3 CDR05BX823BKW CDR31-CDR35 MIL-PRF-55681 kemet 31G-4 CDR02 LT1432-3.3
|
Original |
CHIP/MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 C0805 C1805 C1808 C1812 CDR05 LT3973-3.3 CDR01-CDR06 C1206 KEMET packaging PEF55801VV1.3 CDR05BX823BKW CDR31-CDR35 MIL-PRF-55681 kemet 31G-4 CDR02 LT1432-3.3 | |
55CUContextual Info: 0105 - 12 12 Watts, 28 Volts, Class AB Defcom 100 - 500 MHz GENERAL DESCRIPTION CASE OUTLINE The 0105-12 is a double input matched COMMON EMITTER broadband transistor specifically intended for use in the 100-500 MHz frequency band. It may be operated in Class AB or C. Gold metallization and silicon diffused |
Original |
||
MIL-PRF-55681
Abstract: C180 cdr01 capacitors kemet capacitor c1206 CDR02 CDR03 CDR31 CDR32 CDR33 CDR01-CDR06
|
Original |
CHIP/MIL-PRF-55681 CDR01 CDR02 CDR03 CDR04 C0805 C1805 C1808 C1812 CDR05 MIL-PRF-55681 C180 cdr01 capacitors kemet capacitor c1206 CDR02 CDR03 CDR31 CDR32 CDR33 CDR01-CDR06 | |
rt6010
Abstract: 2200uf, 63v electrolytic capacitor j453 transistor x 313 63v 2200uF 200B MDS140L 25-mils J345 1030 PULSED 32uS MODE-S
|
Original |
MDS140L MDS140L rt6010 2200uf, 63v electrolytic capacitor j453 transistor x 313 63v 2200uF 200B 25-mils J345 1030 PULSED 32uS MODE-S | |
MS2205Contextual Info: MS2205 RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS Features • • • • • • 1025-1150 MHz GOLD METALLIZATION INFINITE VSWR CAPABILITY @ RATED CONDITIONS Pout = 4 W MINIMUM GP= 10 dB COMMON BASE CONFIGURATION .280 2LFL M220 Epoxy Sealed DESCRIPTION: |
Original |
MS2205 MS2205 400mW | |
88-108 mhz w power
Abstract: 88-108 an power 88-108 mhz 55ht fm emitter 88-108 mhz Power w 88-108mhz fm transistor
|
Original |
100Ma 88-108 mhz w power 88-108 an power 88-108 mhz 55ht fm emitter 88-108 mhz Power w 88-108mhz fm transistor | |
TAN15Contextual Info: TAN15 15 Watts, 40 Volts, Pulsed Avionics 960 - 1215 MHz GENERAL DESCRIPTION The TAN15 is a COMMON BASE bipolar transistor. It is designed for pulsed systems in the frequency band 960-1215 MHz. The device has gold thin-film metallization and diffused ballasting for proven highest MTTF. The transistor |
Original |
TAN15 TAN15 25oC2 | |
SD2941-10
Abstract: EE-19 transformer SD2931-10 VK200
|
Original |
SD2941-10 175MHz SD2941-10 SD2931-10. EE-19 transformer SD2931-10 VK200 | |
1035 transistor
Abstract: M.P transistor
|
Original |
25oC2 1035 transistor M.P transistor | |
G200
Abstract: f 0952
|
Original |
P4525-ND P5182-ND 1-877-GOLDMOS 1522-PTF G200 f 0952 | |
55ay
Abstract: DME150
|
Original |
25oC2 DME150 55ay DME150 | |
1N3891 equivalent
Abstract: 12v diode 10A
|
OCR Scan |
457mm) 1N3889, 1N3890, 1N3891, 1N3892 C-122 1N3891 equivalent 12v diode 10A | |
Di 762 transistor
Abstract: transistor a015 transistor npn a 1930 wacom connector wacom 33w NPN 13MM PH1920-33
|
Original |
PH1920-33 lN4245 73050258-S Di 762 transistor transistor a015 transistor npn a 1930 wacom connector wacom 33w NPN 13MM PH1920-33 | |
|
|||
Contextual Info: -Ætttrun Ä \Y Ä [L VERY HIGH VOLTAGE, FAST SWITCHING Devices. Inc. NPN TRIPLE DIFFUSED PLANAR POWER TRANSISTOR CHIP NUM BER (FORMERLY 42 CONTACT METALLIZATION B ase a n d emitter: > 30,000 A Aluminum Collector: Gold (Polished silicon or "C hrom e Nickel S ilver" also available) |
OCR Scan |
83mra) 203mm) JAN2N3902, JAN2N5157, SDT401, SDT430, 2N5466, 2N5468 | |
2N4307Contextual Info: C o n t ra n Devices. Inc LOW TO MEDIUM VOLTAGE, FAST SWITCHING CHIP NUMBER NPN EPITAXIAL PLANAR POWER TRANSISTOR* * CONTACT METALLIZATION Base and emitter: > 30,000 A Aluminum Collector: Gold Polished silicon or "Chrome Nickel Silver" also available Also available on: |
OCR Scan |
203mm) 2N4307 | |
Contextual Info: -Æ tttran MEDIUM VOLTAGE, FAST RECOVERY Devices. Inc. CHIP NUMBER PIM EPITAXIAL FAST RECOVERY PLANAR POWER DIODE dfì CONTACT METALLIZATION Anode: > 50,000 A Aluminum Cathode: Gold Polished silicon or "Chrom e Nickel Silver" also available Mso available on: |
OCR Scan |
305mm) C-125 | |
NPN Transistor 50A 400V
Abstract: 1200PF
|
OCR Scan |
470mm 938mm 938mm) 508mm) 700mm) 524mm) 203mm) 10MHz NPN Transistor 50A 400V 1200PF | |
SDT13301-SDT13305Contextual Info: C ^ isnuxmr ©ättail o n tra n Devices. Inc VERY HIGH VOLTAGE, FAST SWITCHING CHIP NUMBER _ IMPIM TRIPLE DIFFUSED PLANAR POWER TRANSISTOR CONTACT METALLIZATION B a se and emitter: > 50,000 A Aluminum Collector: Gold Polished silicon or "Chrom e Nickel Silver” also availab le |
OCR Scan |
305mm) SDT13301-SDT13305 | |
1N3902Contextual Info: ^ ©mKSTT ©ÄTTÄtL© =Æutnm MEDIUM TO HIGH VOLTAGE Devices. Inc. CHIP NUMBER PIM EPITAXIAL PLANAR POW ER DIODE CONTACT METALLIZATION Anode: > 50,000 A Aluminum Cathode: Gold Polished silicon or "Chrom e Nickel Silver" also available Also availab le on: |
OCR Scan |
457mm) 1N3899. 1N3900, 1N3901, 1N3902 C-123 1N3902 | |
Transistors high frequency Bipolar NPNContextual Info: Temic S e m i <; <> n ! u c t o r s Features Benefits • Full range of matrices up to 1000 com ponents The Series A arrays are excellently suitable for the • Single-level metallization, second level possible production o f c u s to m e r specific integrated circuits |
OCR Scan |
144pF Transistors high frequency Bipolar NPN | |
Contextual Info: Contran Ä ¥Ä 1L© M E D IU M VOLTAGE, FAST SW ITCHING, HIGH GAIN Devices. Inc MONOLITHIC N P N EPITAXIAL PLANAR POWER DARLINGTON TR A N S IS TO R * (FORMERLY 0 3 ] CHIP NUMBER c -n CONTACT METALLIZATION B a se and emitter: > 30,000 A Aluminum Collector: Gold |
OCR Scan |
203mm) | |
2N6261Contextual Info: -Jiolitron [ ^ » © T ©ATTM.©' Devices. Inc MEDIUM VOLTAGE CH IP N UM BER NPN SINGLE DIFFUSED MESA TRANSISTOR FORMERLY 06 CONTACT METALLIZATION B ase, Emitter a n d Collector Solder C o ated 95/5% le ad /tin . ASSEMBLY RECOMMENDATIONS It is ad v isa b le that: |
OCR Scan |
2N3054, 2N3441, 2N6260, 2N6261. 2N6263 C-110 2N6261 | |
Contextual Info: K J iä \ß t U l i Semiconductors Intermittent- and Wipe/Wash Control for Wiper Systems Description With the U264xB, TEMIC Semiconductors developed a generate ”x” versions using different metallization family of intermittent- and wipe/wash control circuits for masks. Thus, it is easy to verify a broad range of time sewindshield or backlite wiper systems with identical basic quences which can be set independently of each other, |
OCR Scan |
U264xB, D-74025 02-Dec-97 |