MICRO PITCH BGA Search Results

DIODE smd marking 22-16

Abstract: vco lm358n LM358 laser driver lm358 current limiter Zener diode smd marking code 621 adjustable zero span circuit with lm358 TRANSISTOR SMD MARKING CODE a7 j zener SMD MARK A9 TRANSISTOR SMD MARKING CODE SAW smd transistor code 621
Contextual Info: Micro SMD Qualification Package LM358, LMC6035, LM431, LM78L05, and LMC555 National’s Micro SMD – The Obvious Answer For Portable Applications Standard Surface Mount Packages vs. Micro SMD Micro SMD Package • 0.5mm Bump Pitch • 0.9mm Max Package Height

0.65mm pitch BGA

Abstract: ASTM-B-488 C17200
Contextual Info: 0.50mm and 0.65mm Pitch BGA Socket Adapter System www.advanced.com This micro-BGA Socket Adapter System in 0.50mm and 0.65mm pitch from Advanced is a breakthrough in fine pitch socket technology. The patented design alternates male and female pins in Electrical performance

PGA socket 479

Contextual Info: This document was generated on 01/11/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: Replacement Part Number: 0471719110 Obsolete 1.27mm .050" Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)

Contextual Info: HI-DENSITY SOCKET SPECIFICATIONS Mates with: YFT, YFW 1,27mm .050" micro pitch High reliability Tiger-Eye contacts _ For complete specifications see www.samtec.com?YFS YFS SERIES U iJ Insulator Material: Black Liquid Crystal Polymer Contact Material: Phosphor Bronze

Contextual Info: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required.

Contextual Info: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any pitch device on 0.40mm or larger. • Pressure mounting, no soldering required.

zif socket 1.27mm pitch

Abstract: micro pitch BGA PGA zif socket
Contextual Info: This document was generated on 01/11/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0512899592 Planned for Obsolescence 1.27mm .050" Pitch, ZIF Micro PGA Socket, 959 Circuits with Ball Grid Array (BGA) Solder, with Cover Tape, 0.30µm (12µ") Gold (Au) Plating

6-1761614-0

Abstract: 7-1761614-0
Contextual Info: High Speed Fine Pitch Connectors MICTOR, MICTOR SB, Micro-Strip and STEP-Z Interconnection Systems Table of Contents Need more information? Call Technical Support at the numbers listed below. Technical Support is staffed with specialists well versed in all Tyco Electronics

Contextual Info: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.

micro pitch BGA

Contextual Info: CSP/MICRO BGA Test & Burn-In Socket For Devices Up to 55mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. Consult Factory for QFP applications. • Any device on 0.40mm pitch or larger. • 4 Point crown insures “scrub” on solder oxides.

micro SD socket

Abstract: PGA socket 479 socket 479 mobile pentium 4
Contextual Info: This document was generated on 01/06/2010 PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION Part Number: Status: Description: 0512484792 Planned for Obsolescence 1.27mm .050" Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA) Mount, ZIF, 479 Circuits, with Pick and Place Cover, Tray Package, 0.25µm (10µ")

Contextual Info: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.

Contextual Info: CSP/MICRO BGA Test & Burn-in Socket For Devices From 14 - 27mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any pitch device on 0.50mm or larger. • Pressure mounting, no soldering required. • 4 Point crown insures “scrub” on solder oxides.

F199

Contextual Info: FACTSHEET F-199 CSB CSB CSB .050" AREA ARRAY SOCKET High reliability Tiger-Eye contacts Mates with: MSB Materials: Polarized notches CT CONTA T PATEN G PENDIN Optional polarized Alignment Pins 1,27mm .050" micro pitch Note: Some sizes, styles and options are non-standard,

Contextual Info: CSP/MICRO BGA Test & Burn-In Socket For Devices Up to 55mm Sq. FEATURES: • For Test & Burn-In of CSP, MicroBGA, DSP, LGA, SRAM, DRAM and Flash Devices. • Any device on 0.50mm pitch or larger. • 4 Point crown insures “scrub” on solder oxides. • Single Point Probes available for small land area contact pads.

132-ball

Abstract: via antipad pitch micro pitch BGA LC4256ZE MN64 4000ZE drill market LC4256ZEMN144 UMN64 stackup
Contextual Info: LOW COST BOARD LAYOUT TECHNIQUES FOR DESIGNING WITH PLDS IN BGA PACKAGES A Lattice Semiconductor White Paper July 2010 Lattice Semiconductor 5555 Northeast Moore Ct. Hillsboro, Oregon 97124 USA Telephone: 503 268-8000 www.latticesemi.com 1 Low Cost Board Layout Techniques for Designing with PLDs in BGA Packages

Recommended land pattern smd-0.5

Abstract: "x-ray machine" Lattice Semiconductor Package Diagrams 256-Ball fpBGA pcb fabrication process ultra fine pitch BGA LC4064ZE package dimension 256-FTBGA nomenclature pcb hdi of BGA Staggered Pins package BN256
Contextual Info: PCB Layout Recommendations for BGA Packages September 2010 Technical Note TN1074 Introduction As Ball Grid Array BGA packages become increasingly popular and become more populated across the array with higher pin count and smaller pitch, it is important to understand how they are affected by various board layout

BGA Solder Ball 0.35mm collapse

Abstract: BGA Solder Ball collapse BGA Package 0.35mm pitch BGA 0.56mm AN-5026 FSTD16211 FSTD32211 BGA Solder Ball 0.35mm 0.35mm BGA fanout AN500543
Contextual Info: Fairchild Semiconductor Application Note January 2001 Revised February 2001 Using BGA Packages Introduction Demanding space and weight requirements of personal computing and portable electronic equipment has led to many innovations in IC packaging. Combining the right

BGA Solder Ball collapse

Abstract: BGA Solder Ball 0.35mm collapse 1mm pitch BGA socket 0.35mm BGA fanout BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026 BGA 0.56mm
Contextual Info: Fairchild Semiconductor Application Note January 2001 Revised September 2001 Using BGA Packages Introduction TABLE 1. BGA Space Savings Compared to Surface Mount Packages Demanding space and weight requirements of personal computing and portable electronic equipment has led to

Contextual Info: Data Sheet LEADFRAME CABGA/fBGA Features ChipArray Packages Amkor’s ChipArray® Ball Grid Array CABGA packages are laminate based packages that are compatible with SMT mounting processes worldwide. The near chip size CABGA fine-pitch BGA (fBGA) offers a

BGA reflow guide

Abstract: "IR Sensor" ir heat sensor pcb thermal Design guide trace theta layout BGA PROFILING Soldering and desoldering 1mm pitch BGA BE 4X12 hot air bga paste profile
Contextual Info: Note Number AN-RC1-RW-A Development Tools And Methods RC BGA REWORK PROCEDURE APPLICATION NOTE Purpose: The purpose of this procedure is to describe the steps necessary to successfully remove and replace a ceramic ball-grid-array CBGA component on a modern printed circuit board (PCB) using

AN-1112

Abstract: ALIVH PCB design for 0.2mm pitch csp package 250 B 340 smd Transistor JESD51-3 MARKING CODE SMD IC
Contextual Info: National Semiconductor Application Note 1112 January 13, 2010 Table of Contents Introduction . 2 Package Construction . 2

JESD22-B117

Abstract: MICRO SWITCH PRESSURE PCB JEDEC JESD22-B117 JESD22-A104-A smd marking 2x5 micro pitch BGA Lead Free reflow soldering profile BGA PCB design for very fine pitch csp package JESD22-A108-A JESD22-A110
Contextual Info: VISHAY SILICONIX Power MOSFETs Application Note 835 PCB Design and Surface-Mount Assembly Guidelines for MICRO FOOT Packages By Changsheng Chen/Greg Getzan Introduction The Vishay Siliconix MICRO FOOT® product family is based on wafer-level chip scale packaging WL-CSP

ALIVH

Abstract: WLCSP smt 250 B 340 smd Transistor WLCSP stencil design AN-1112 national semiconductor pb-free marking 250 micro solder ball 9221 MARKING MARKING SMD IC CODE smd diode ED
Contextual Info: National Semiconductor Application Note 1112 September 9, 2009 Table of Contents Introduction . 2 Package Construction . 2