MICRON CMOS 1987 Search Results

MCR 22-8 transistor power

Abstract: Transistor motorola 418 10146 1987 carrier A022H on 5295 equivalents HDC031 Mustang 300 HDC011 HDC016 HDC049
Contextual Info: Order this data sheet by HDC/D MOTOROLA SEMICONDUCTOR TECHNICAL DATA HIGH PERFORMANCE TRIPLE LAYER METAL HDC SERIES CMOS ARRAYS 1.0 MICRON CMOS ARRAYS Built on a 1.0 micron, triple-layer metal CMOS process, the HDC Series represents a significant advancement in microchip technology.

IBM 286 schematic

Abstract: MX3232 MX32 MX48 MX68 matra
Contextual Info: MATRA DESIGN SEMICONDUCTOR syiraamMiD^ dMü Btküiü MX SERIES 1.55-MICRON 2-LAYER METAL SILICON GATE CMOS GATE ARRAYS Advance Information September 1987 FEATURES • Advanced 1.55u 2-layer metal CMOS technology • High perlbmance -1 .5ns delay through 2-input NAND gate

Contextual Info: MX SERIES 1.55-MICRON 2-LAYER METAL SILICON GATE CMOS GATE ARRAYS MATRA DESIGN SEMICDNDUCIDR Advance Information September 1987 FEATURES • Advanced 1.55u 2-layer metal CMOS technology • High perfomance - 1 .5ns delay through 2-input NAN D gate Ta= 25 deg C, VDD = 5V, fanout= 3 + 1OOOum

CRCW

Abstract: RS232 MAX232 EIA232 MAX232 TFDU4100 TFDU4300 XT49S 2T11
Contextual Info: TOIM4232 VISHAY Vishay Semiconductors SIR Endec for IrDA Applications Integrated Interface Circuit ULC Technology: High performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 µm . Description 18080

ic 293D

Abstract: MAXIM MAX232 SO16L
Contextual Info: TOIM4232 VISHAY Vishay Semiconductors SIR Endec for IrDA Applications Integrated Interface Circuit ULC Technology: High performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 µm . Description 18080

TOIMx232

Abstract: CRCW 75c211 82546 293D105X9016A CRCW1206-20R0FRT1 TFDS420x crcw12060 1206A220
Contextual Info: TOIM4232 VISHAY Vishay Semiconductors SIR Endec for IrDA Applications Integrated Interface Circuit ULC Technology: High performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 µm . Description 18080

uart with bit parity

Contextual Info: VISH A Y ▼ TOIM3232 _ Vishay Telefunken Integrated Interface Circuits ïiyWÂîr: ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 |xm Description

bc815

Abstract: "Infrared TRANSCEIVER" DATASHEET bc815 transistor capacitor Vishay VJ 1206 EIA232 MAX232 SO16L TFDS4000 TFDS4500 TFDS4500 IC
Contextual Info: TOIM3232 Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3232 IC provides proper pulse shaping for

10R0

Abstract: 293D SO16L TFDS4000 TOIM3000 mhs ulc
Contextual Info: TOIM3000 Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM300 IC provides the proper timing for the

bc815

Abstract: tfds*4000 4000SERIES csac368mg 1N4148 1206 EIA232 MAX232 TD232 TFDS4000 9600 baud rate converter
Contextual Info: TOIM3232 ¥18HAY _ ▼ Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 ^m Description The TOIM3232 1C provides proper pulse shaping for

TTL RS232 Level Converter

Abstract: maxim 1987 MAX3232CSE maxim max 1987 4000 Series Integrated Infrared Transceiver Cannon connectors CMOS RS232 Level Converter sub-d9 "Infrared TRANSCEIVER" DATASHEET capacitor Vishay VJ 1206
Contextual Info: TOIM4232 Vishay Semiconductors SIR Endec for IrDA Applications Integrated Interface Circuits ULC Technology: High-performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 mm Description The TOIM4232 Endec IC provides proper pulse

TFDU4500

Abstract: TFDS4100 1N4148 1206 CRCW maxim 1987 maxim max 1987 EIA232 MAX232 TFDS4000 TFDU4100
Contextual Info: TOIM4232 Vishay Telefunken SIR Endec for IrDA Applications Integrated Interface Circuits ULC Technology: High-performance gate array package using multiple metal layer CMOS technology featuring sub-micron channel lengths 0.35 mm Description The TOIM4232 Endec IC provides proper pulse

"GE Solid state"

Contextual Info: 7 7 fi ISP9520/ISP9521 GE Solid State Multilevel Pipeline Register GENERAL DESCRIPTION FEATURES The ISP9520 and ISP9521 are multilevel pipeline regis­ ters implemented using Intersil’s 1.5 micron CMOS AVLSI technology. This high performance process allows the

9600 baud rate converter

Abstract: CSAC3.68MGC TFDS400 4000 Series Integrated Infrared Transceiver EIA232 MAX232 TD232 TFDS4000 transceiver EIA232 max232 4000-Series
Contextual Info: TOIM3232 VI SHAY Vishay Telefunken ▼ Integrated Interface Circuits SSIBS ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 ^m Description The TOIM3232 1C provides proper pulse shaping for

baud rate converter

Abstract: 9600 baud rate converter max232 16 pin diagram with pin function MAX232 Telefunken led TFDS400 4000-Series Infrared Transceiver tc 1627
Contextual Info: TOIM3232 vm & w f Vishay Telefunken ▼ Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 |xm Description The TOIM3232 1C provides proper pulse shaping for

bc815

Abstract: bc815 transistor MAX232 for level converter ic 293D EIA232 MAX232 SO16L TFDS4000 TFDS4500 capacitor Vishay VJ 1206
Contextual Info: TOIM3232 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3232 is using a crystal clock 3.6864 MHz for

BC815-25

Abstract: bc815 CRCW 1n4145 Temic ulc ic 293D
Contextual Info: TOIM3232 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3232 is using a crystal clock 3.6864 MHz for

TFDS4000

Abstract: infrared transmitter receiver rs232 10R0 293D SO16L CRCW-1206-10R0-F-RT1 tfds*4000
Contextual Info: TOIM3000 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3000 IC provides the proper timing for the

tfds*4000

Abstract: TOIM3000
Contextual Info: TOIM3000 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3000 IC provides the proper timing for the

Contextual Info: TOIM3000 vm & w f Vishay Telefunken ▼ Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 |xm Description The TOIM300 1C provides the proper timing for the

infrared transmitter receiver rs232

Abstract: SO16L TOIM3000 10R0 293D TFDS4000
Contextual Info: TOIM3000 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3000 IC provides the proper timing for the

TFDS4000

Abstract: infrared transmitter receiver rs232 TFDS3000 Infrared transmitter
Contextual Info: TOIM3000 VI SHAY Vishay Telefunken ▼ Integrated Interface Circuits SSIBS ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 ^m Description The TOIM300 1C provides the proper timing for the

TFDS4000

Contextual Info: TOIM3000 ym M f ▼ Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 |xm Description The TOIM300 1C provides the proper timing for the

CRCW

Abstract: ic 293D 4000-Series
Contextual Info: TOIM3232 Not for new designs Vishay Telefunken Integrated Interface Circuits ULC Technology: High-performance gate array package using dual metal layer CMOS technology, featuring sub-micron channel length 0.8 mm Description The TOIM3232 is using a crystal clock 3.6864 MHz for