MICROWAVE LAMINATE BOARD Search Results

NASA SP-R-0022A

Abstract: Arlon ASTM D5470 Tower Mounted Amplifiers TC350 microwave laminate board electronics nasa mtbf antenna thermal conductivity wilkinson power divider
Contextual Info: MICROWAVE MATERIALS TC350 Enhanced Thermal Conductivity Ceramic Filled PTFE/ Woven Fiberglass Laminate for Microwave Printed Circuits Boards Features: • “Best in Class” Thermal Conductivity and Dielectric Constant Stability across Wide Temperatures • Very Low Loss Tangent provides Higher

Arlon

Abstract: 90E24
Contextual Info: TC350 Enhanced Thermal Conductivity Ceramic Filled PTFE/Woven Fiberglass Laminate for Microwave Printed Circuits Boards Arlon’s TC350 is a woven fiberglass reinforced, ceramic filled, PTFE-based composite for use as a printed circuit board substrate. TC350 is designed to provide enhanced heat-transfer

HMC414

Contextual Info: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com THIS PAGE INTENTIONALLY LEFT BLANK v00.0103 HMC414MS8G PRODUCT NOTE Designing w/ The HMC414MS8G PA Utilizing a Low Cost Laminated Printed Circuit Board

Contextual Info: MicroAmp MB-13 Circuit Board For Hittite VCOs in LP4E Packages FEATURES • Fits Hittite Microwave VCOs with LP4E packages • Usable with HMC384-386, 388-391, 416, 429-431, 466, 505, 506, 532 VCOs • VCOs frequencies from 2-8 GHz • Uses standard SMD passive parts

GETEK FR4

Abstract: FR4 dielectric constant at 2.4 Ghz Rogers 4350 r04350 FR4 substrate height and thickness FR4 dielectric constant vs temperature relative permittivity of fr4 HMC414MS8G RO4350 loss tangent of FR4
Contextual Info: v00.0103 HMC414MS8G PRODUCT NOTE Designing w/ The HMC414MS8G PA Utilizing a Low Cost Laminated Printed Circuit Board General Description The HMC414MS8G is a high efficiency GaAs InGaP Hetrojunction Bipolar Transistor HBT MMIC power amplifier, which operates between 2.2 - 2.8 GHz. The amplifier is packaged in a low cost, surface mount 8

Contextual Info: TECHNICAL DATA SHEET PTFE ED 1205 www.cif.fr TECHNICAL DATA SHEET PTFE BOARDS Item Code ABT … This document contains manufacturer’s information, protected through copyright. All rights reserved. This document can not be copied, reproduced or translated without written agreement from C.I.F

Contextual Info: MicroAmp MB-15 Circuit Board For Hittite Multipliers in LP4E Packages FEATURES • Fits Hittite Microwave frequency multipliers with LP4E packages • Usable with HMC 370, 443-445, 575, 695 multipliers • Output frequencies in X and Ku band • Uses standard SMD passive parts

Contextual Info: MicroAmp MB-16 Circuit Board For Hittite Tunable Filters in SP4E Packages FEATURES • Fits Hittite Microwave tunable filters with LP4E packages • Usable with HMC895-898 tunable bandpass filters • Uses standard SMD passive parts • RO-4350 board material

1000 watts amplifier schematic diagram with part

Abstract: MRF844 UNELCO MICA CAPACITORS schematic diagram 800 watt power amplifier AN-578 transistor Common Base configuration uhf motorola glass capacitor MICA Microwave mini electrolytic
Contextual Info: MOTOROLA Freescale Semiconductor, Inc. Order this document by EB105/D SEMICONDUCTOR ENGINEERING BULLETIN EB105 A 30 WATT, 800 MHz AMPLIFIER DESIGN Freescale Semiconductor, Inc. Prepared by: Alan Wood Semiconductor Product Sector INTRODUCTION CIRCUIT DESCRIPTION

Contextual Info: V01.0512 Thermal Management for Surface Mount Components Thermal Management for Surface Mount Components General Application Note 2012 Hittite Microwave Corporation, All Rights Reserved. 2 Elizabeth Drive Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

RO4350

Abstract: QFN-68 RO-4350 automatic gain control ic microstrip microwave laminate MAX3940 MAX3950 10gbps clock and data recovery
Contextual Info: Design Note: HFDN-7.2 Rev 1; 01/01 Circuit Card Layout Considerations for 10Gbps Current Mode Logic Inputs on the MAX3950 EV Kit MAXIM High-Frequency/Fiber Communications Group Maxim Integrated Products 7ahfdn72.doc 01/04/01 Circuit Card Layout Considerations for 10Gbps

HMC408

Abstract: QFN PACKAGE Junction to PCB thermal resistance HMC408LP3 RO4350 SN63
Contextual Info: v00.0703 APPLICATION NOTES THERMAL MANAGEMENT FOR SURFACE MOUNT COMPONENTS Introduction As the power dissipation and availability of surface mount RF power amplifiers has increased, the need for careful thermal management of the next higher level assembly has become increasingly important. Previous generation

Contextual Info: MicroAmp MB-8 Circuit Board For Mini-Circuits LTCC Filters FEATURES • Fits Mini-Circuits LFCN, HFCN, and BFCN filters in FV1206 package • Lowpass, highpass, bandpass filters • Many filters to choose from • RO-4350 board material • Fits MicroAmp MH-series housings

Contextual Info: MicroAmp MB-11 Circuit Board For Hittite SOT-23 Prescalers FEATURES • Fits Hittite 6-pin SOT-23 prescaler packages • Divide by 2/4/8 configurations • Input frequencies up to 8 GHz • DC blocks on input and output • RO-4350 board material • Fits MicroAmp MH-series housings

FR4 microstrip stub

Abstract: fr4 loss tangent 10GHz FR4 substrate 10GHz AN1756 APP1756 MAX2648
Contextual Info: Maxim > App Notes > WIRELESS, RF, AND CABLE Keywords: rf, lna, 5ghz, rfic, wlan, 802.11a, rf ics, integrated circuits Sep 27, 2002 APPLICATION NOTE 1756 Designing with the MAX2648 5GHz LNA for High-Frequency Stability Abstract: RF input and output matching networks are critical factors in determining the performance of a 5GHz

dlva

Abstract: transmission line model orcad pspice 24 GHz Microwave Sensor surface mount htcc capture and electronic packaging E8257C manual 86142B 8703A E4407B Flip Chip on flex
Contextual Info: SC090624 RF & MW DAR060930 RF & Microwave Packaging Capabilities & Engineering Services Approved for Export DAR 6/30/09 12964 Panama Street • Los Angeles, CA 90066 • Phone: 310.822.8229 FAX: 310.822.3573 • microelectronics@teledyne.com • www.teledynemicro.com

intel 3003

Abstract: FR4 Prepreg XEB60009 XEB72353 N5V2 mcb C20 j1 3003 testing of mcb circuit diagram HCB CONNECTORS Rogers 3003
Contextual Info: XEK66700 XFP Reference Design Kit Preliminary Datasheet Product Features • ■ ■ XFP Reference Design Kit in compliance with the XFP specification - Appendix A consisting of: — Host System Compliance Test Board — Module Compliance Test Board Fully characterised compliance test kit for

RO4350

Abstract: RO-4350 microstrip MAX3950
Contextual Info: Design Note: HFDN-7.2 Rev3; 04/08 Circuit Card Layout Considerations for 10Gbps Current Mode Logic Inputs on the MAX3950 EV Kit Maxim Integrated Products Circuit Card Layout Considerations for 10Gbps Current Mode Logic Inputs on the MAX3950 EV Kit 1 Introduction

Rogers 4350

Abstract: Rogers 4350 datasheet GETEK FR4 Rogers microstrip 3003 rogers laminate materials rogers MTC1204 3003 Multilink Technology Corporation ROSENBERGER
Contextual Info: MIXED SIGNAL INTEGRATED CIRCUIT PRODUCTS Multilink Tech Note - 102 Printed Circuit Board Design Considerations for the MTC1207/MTC1204 The MTC1207 Multiplexer/Clock Multiplier Unit and MTC1204 Demultiplexer/Clock and data Recovery chip are SONET/SDH OC-192/STM-64 mixed signal integrated circuits which contain 10

RO4350

Abstract: RO-4350
Contextual Info: Design Note: HFDN-7.2 Rev 2; 11/01 Circuit Card Layout Considerations for 10Gbps Current Mode Logic Inputs on the MAX3950 EV Kit MAXIM High-Frequency/Fiber Communications Group Maxim Integrated Products 9HFDN72.doc 11/13/01 Circuit Card Layout Considerations for 10Gbps

KGV-68B

Abstract: Rockwell Collins mechanical Filters rockwell collins connector rafale kopin Northrop Grumman Electronic Systems My12E Rockwell Collins transceiver raytheon ltcc Rockwell Collins GPS
Contextual Info: SC100712 TMT Overview DAR090709 Microelectronic Technologies Approved for Export DAR 07/14/10 1 12964 Panama Street • Los Angeles, CA 90066 • Phone: 310.822.8229 FAX: 310.574.2045 • microelectronics@teledyne.com • www.teledynemicro.com SC100712 TMT Overview

VMMK-2303

Abstract: VMMK-2503 microwave propagation VMMK-2203 VMMK-2403 ka band gaas fet Package E-band mmic ka band lna VMMK-2103 VMMK-2x03
Contextual Info: GaAs-Based Surface Mount Wafer Scale Package MMICs for DC to 45 GHz Applications White Paper By: Henrik Morkner I. Introduction Packaging has always been the “Achilles Heal” of extracting the maximum microwave performance out of any IC technology. The inherent parasitic capacitance and inductance associated with bond wires, lead frames, and

Contextual Info: CII High Frequency, Low Signal Relays Table of Contents CII MW3 / MW4 / MW6 / MW3HP / MW4HP / MW6HP Series Relays Double Pole, Electrically Held, 1 Amp and Less Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2-2

common base amplifier

Abstract: motorola rf device
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA The RF Line Microwave Long Pulse Power Transistor MRF10031 Designed for 960-1215 MHz long or short pulse common base amplifier applications such as JTIDS and Mode-S transmitters. • Guaranteed Performance @ 960 MHz, 36 Vdc