MLF 132 Search Results

Contextual Info: PA5131-MD Data Sheet 48 pin MLF socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction This adapter allows programming of an Atmel AT89C5131 in the 48 pin MLF package using the 40 pin DIP footprint specified by Atmel. The adapter is made up of 2 sub-assemblies. They assemble via

BGA676

Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
Contextual Info: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18

DUAL ROW QFN leadframe

Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Contextual Info: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This

amkor

Abstract: amkor exposed pad
Contextual Info: LEADFRAME data sheet FusionQuad Features FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Contextual Info: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses

Contextual Info: What HEWLETTÍ mLfíM PACKARD Up to 6 GHz Medium Power Silicon Bipolar Transistor Technical Data AT-42010 Features functions. The 20 emitter finger interdigitated geometry yields a • High Output Power: 12.0 dBm Typical PxdB at 2.0 GHz medium sized transistor with

Contextual Info: Whpl HEW LETT mLfíM PACKARD 2.5 mW 14 Pin DIL Cooled Laser Module Technical Data LSC2110-622 Features Description • 2.5 M illiwatt Peak Optical Power Output LSC2110-622 laser modules are highly reliable fiber optic light sources operating in the 1300 nanometer band. The internal

IDT5V41

Abstract: IDT5V412 IDT5V41236 1236n pcb of pcie X1 edge connector 5V41236 5V41236PGGI pcie X1 pcb of edge connector MO-220C
Contextual Info: DATASHEET IDT5V41236 4 OUTPUT PCIE GEN1/2/3 SYNTHESIZER Recommended Applications Features/Benefits Four output synthesizer for PCIe Gen1/2/3 • 20-pin TSSOP/MLF packages; small board footprint • Spread-spectrum capable; reduces EMI • Outputs can be terminated to LVDS; can drive a wider

IEC-6000-4-2

Abstract: 5M MARKING CODE DIODE SMC
Contextual Info: NZMM7V0T4 EMI Filter with ESD Protection This device is scheduled for availability in Q4 2000. Please contact your nearest ON Semiconductor sales representative for further information. http://onsemi.com Features: • • • • • • • • • 4 x 4 mm Lead Less MLF Surface Mount Package

IDT5V41235

Abstract: mark R5B
Contextual Info: DATASHEET IDT5V41235 2 OUTPUT PCIE GEN1/2/3 SYNTHESIZER Recommended Applications Features/Benefits 2 Output synthesizer for PCIe Gen1/2/3 and Ethernet • 16-pin TSSOP and MLF packages; small board footprint • Spread-spectrum capable; reduces EMI • Outputs can be terminated to LVDS; can drive a wider

IDT5V41235

Abstract: 5V41235NLG pcie X1 edge connector PCB 5V41235NLG8 IDT package marking
Contextual Info: DATASHEET IDT5V41235 2 OUTPUT PCIE GEN1/2/3 SYNTHESIZER Recommended Applications Features/Benefits 2 Output synthesizer for PCIe Gen1/2/3 and Ethernet • 16-pin TSSOP and MLF packages; small board footprint • Spread-spectrum capable; reduces EMI • Outputs can be terminated to LVDS; can drive a wider

DC/DC Converter

Contextual Info: P10SG-xxxxE/Z H30 MLF PM5-SERIES Rev.11-2008 2 Watt Regulated DIP24 Metal Case 1 - 3 kV DC I/O Isolation Single and Dual Output Continuous Short Circuit Prot. Full SMD Technology Mainzer Straße 151–153 D-55299 Nackenheim Tel. +49 6135 7026-0 Fax: +49 6135 931070

Contextual Info: P22TG-xxxxE/Z2:1 H35 MLF PMD-SERIES Rev.11-2008 5 Watt 2:1 Wide Input Reg. Single and Dual Output 1.5 to 3.5 kV DC I/O Isolation DIP24 Metal Case Continuous Short Circuit Prot. Full SMD Technology Mainzer Straße 151–153 D-55299 Nackenheim Tel. +49 6135 7026-0

amkor exposed pad

Abstract: exposed QFP 128 amkor exposed QFP 144
Contextual Info: LEADFRAME data sheet FusionQuad Features: FusionQuad®: Amkor’s FusionQuad® technology represents a breakthrough in leadframe-based plastic packaging through the effective integration of ExposedPad TQFP and MLF® technologies. The novel integration of bottom lands in a QFP provides a cost-effective platform for increased lead count in a small

Contextual Info: Product Specifications PART NO.: VL51B5263A-K9S REV: 1.0 General Information 4GB 512Mx72 DDR3 SDRAM ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5263A is a 512Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module consists of eighteen CMOS 256Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, and a 2K EEPROM in an 8-pin MLF

DQ56

Abstract: K4B1G0846E A6211 DDR3-1333 PC3-10600 DDR3 miniDIMM JEDEC NC177
Contextual Info: Product Specifications PART NO.: VL51B5263A-K9S REV: 1.0 General Information 4GB 512Mx72 DDR3 SDRAM ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5263A is a 512Mx72 DDR3 SDRAM high density Mini-DIMM. This memory module consists of eighteen CMOS 256Mx8 bits with 8 banks DDR3 Synchronous DRAMs in BGA packages, and a 2K EEPROM in an 8-pin MLF

tray 8 x 8

Abstract: shinon ST-bg0 FBGA package tray dwg 25A1 D257 SECTION tray 25 x 25 ST-BG080810TJ-1 ASTM-D-257
Contextual Info: Package Information Vishay Siliconix FBGA MLF 8 x 8 MM PACKAGE TRAY C 322.6 315.0 ST-BG080810TJ-1 PPE 92.1 B A 12.7 * 150 °C MAX. 10.35 12.80 FBGA 8 x 8 1.0 mm A TRAY MADE IN JAPAN 135.9 * SHINON B see Detail 25.4 3.8 1 2.5 11.0 8.25 7.40 7.0 6.1 20° (3°) 3

Contextual Info: Product Specifications PART NO.: VL41B5263A-K9S/F8S/E7S-S1 REV: 1.0 General Information 4GB 512MX72 DDR3 SDRAM ECC SO-UDIMM 204 PIN Description The VL41B5263A is a 512Mx72 DDR3 SDRAM high density SO-UDIMM. This memory module consists of eighteen CMOS 256M x 8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages and a 2K EEPROM in an 8-pin MLF

VL41B5663A-K9S

Abstract: DDR3-1066 DDR3-1333 PC3-10600
Contextual Info: Product Specifications PART NO.: VL41B5663A-K9S/F8S/E7S-S1 REV: 1.0 General Information 2GB 256MX72 DDR3 SDRAM ECC SO-UDIMM 204 PIN Description The VL41B5663A is a 256Mx72 DDR3 SDRAM high density SO-UDIMM. This memory module consists of eighteen CMOS 128Mx8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages and a 2K EEPROM in an 8-pin MLF

Contextual Info: Product Specifications PART NO.: VL41B5663A-K9S/F8S/E7S-S1 REV: 1.0 General Information 2GB 256MX72 DDR3 SDRAM ECC SO-UDIMM 204 PIN Description The VL41B5663A is a 256Mx72 DDR3 SDRAM high density SO-UDIMM. This memory module consists of eighteen CMOS 128Mx8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages and a 2K EEPROM in an 8-pin MLF

K4B2G0846C-HCH9

Abstract: roundup DDR3 miniDIMM JEDEC K4B2G0846CHCH9 VL51B5763F VL51B5763F-F8S A6211 DDR3-1066 80 pin miniDIMM K4B2G0846C-HC
Contextual Info: Product Specifications PART NO.: VL51B5763F-F8S REV: 1.1 General Information 2GB 256Mx72 DDR3 SDRAM ULP ECC UNBUFFERED Mini-DIMM 244-PIN Description The VL51B5763F is a 256Mx72 DDR3 SDRAM high density Mini-UDIMM. This memory module consists of nine CMOS 256Mx8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages, and a 2K EEPROM in an 8-pin MLF

samsung DDR3 SDRAM 2GB

Abstract: DDR3-1066 DDR3-1333 PC3-10600 VL41B5263A-K9
Contextual Info: Product Specifications PART NO.: VL41B5263A-K9S/F8S/E7S-S1 REV: 1.0 General Information 4GB 512MX72 DDR3 SDRAM ECC SO-UDIMM 204 PIN Description The VL41B5263A is a 512Mx72 DDR3 SDRAM high density SO-UDIMM. This memory module consists of eighteen CMOS 256M x 8 bits with 8 banks DDR3 synchronous DRAMs in BGA packages and a 2K EEPROM in an 8-pin MLF

Contextual Info: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF

DDR2-667

Abstract: DDR2-800 PC2-5300 PC2-6400
Contextual Info: Product Specifications PART NO: REV: 1.1 VL493T2863E-E7S/E6S General Information 1GB 128MX72 DDR2 SDRAM VLP ECC 200 PIN SO-RDIMM Description Features The VL493T2863E is a 128Mx72 Double Data Rate DDR2 SDRAM high density SO-RDIMM. This memory module consists of nine CMOS 128Mx8 bit DDR2 Synchronous DRAMs in BGA packages, a 25-bit Registered buffer in BGA package, a zero delay PLL clock in BGA package, and a 2K EEPROM in an 8-pin MLF