MM GAGES Search Results

SMES-152

Abstract: EIA-364-31 LR19980
Contextual Info: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the following A. 2.50 mm centerline pitch 0.64 mm square pin headers B. 2.54 mm centerline (pitch) 0.64 mm square pin headers when mated with either printed circuit board (PCB) connectors or connectors terminated with 22 to 28

EP-08-031DE-120

Abstract: EP-08-250BG-120 10 35L VISHAY EK 03 125BZ 10C CEA-XX-125UN-350 EP-08-500BL-350 WK-XX-250AF-350 EP-08-125BT-120 CEA-XX-250UW-10C EP-08-125AD-120
Contextual Info: Linear Patterns Vishay Micro-Measurements General Purpose Strain Gages - Linear Patterns FEATURES • Gage patterns designed for measuring strain in a single direction • Single-grid and parallel dual-grid patterns • Gage lengths from 0.008 in 0.20 mm to 0.500 in (12.7 mm)

SM5108

Abstract: Silicon Microstructures low PRESSURE die pressure sensor die mm
Contextual Info: SM5108 SILICON MICROSTRUCTURES INCORPORATED • • Ultra-Small, Low-Cost, OEM Pressure Die For Extremely High-Volume Applications Ultra-Small, Low Cost OEM Pressure Die DESCRIPTION The SM5108 is a extremely small 0.65 mm x 0.65 mm silicon micromachined

pin diagram for IC cd 1619 cp

Abstract: cd 1619 CP connection diagram IC cd 1619 CP cd 1619 CP pin configuration of IC 1619 cp cd 1619 CP diagram pin configuration of cd 1619 cp pin diagram for IC cd 1619 BAV199Ls pin configuration of IC cd 1619 cp
Contextual Info: Precision Instrumentation Amplifier with Signal Processing Amplifiers AD8295 FEATURES CONNECTION DIAGRAM Saves board space Includes precision in-amp, 2 op amps, and 2 matched resistors 4 mm x 4 mm LFCSP No heat slug for more routing room Differential output fully specified

SMES-152

Abstract: EIA-364-31 EIA-364-65 LR19980 UCP2008-0956
Contextual Info: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 2.54 mm .100 inch centerline (pitch) 0.64 mm (.025) square pin headers when mated with either printed circuit board (PCB) connectors or connectors terminated with 22 to 28 AWG wire using crimp technology.

Contextual Info: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 2.54 mm .100 inch centerline (pitch) 0.64 mm (.025) square pin headers when mated with either printed circuit board (PCB) connectors or connectors terminated with 22 to 28 AWG wire using crimp technology.

pin diagram for IC cd 1619 cp

Abstract: pin configuration of IC cd 1619 cp IC cd 1619 CP pin configuration of cd 1619 cp
Contextual Info: Precision Instrumentation Amplifier with Signal Processing Amplifiers AD8295 CONNECTION DIAGRAM FEATURES Saves board space Includes precision in-amp, 2 op amps, and 2 matched resistors 4 mm x 4 mm LFCSP No heat slug for more routing room Differential output fully specified

pin diagram for IC cd 1619 cp

Abstract: pin configuration of cd 1619 cp pin configuration of IC cd 1619 cp IC cd 1619 CP cd 1619 CP AD8295 AD8295ACPZ cd 1619 CP diagram AD7690 pin configuration of IC 1619 cp
Contextual Info: Precision Instrumentation Amplifier with Signal Processing Amplifiers AD8295 FEATURES CONNECTION DIAGRAM Saves board space Includes precision in-amp, 2 op amps, and 2 matched resistors 4 mm x 4 mm LFCSP No heat slug for more routing room Differential output fully specified

smes-152

Abstract: EIA-364-65 42625 molex EIA-364-31 LR19980 molex kk 2695
Contextual Info: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 2.54 mm .100 inch centerline (pitch) 0.64 mm (.025) square pin headers when mated with either printed circuit board (PCB) connectors or connectors terminated with 22 to 28 AWG wire using crimp technology.

Contextual Info: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 2.54 mm .100 inch centerline (pitch) 0.64 mm (.025) square compliant pin terminal headers, when mated with either printed circuit board (PCB) connectors or connectors terminated with 22 to 28 AWG wire using crimp technology.

69308

Abstract: 77138-001 69764
Contextual Info: M INITEK is a crimp-to-wire type 2,00 mm 0.079 in. pitch connector system consisting of fem ale terminal, housing, headers and card connector. Its 2,00 mm (0.079 in.) center distance and com pact housing are ideal for dense packaging wire-to-board interconnection

Contextual Info: B G D splay iLD Series $ MADE IN USA ߜ BIG Bright 2.25" 57.2 mm or 4.00" (101.6 mm) LED Digits ߜ Program to Change Colors: RED, AMBER, GREEN ߜ Many Input Choices ߜ Optional Relays for Alarm and Full PID Control ߜ Communications Via Ethernet, RS-232, RS-485,

EGP-5-120 strain Gages

Abstract: EGP-5-350 EGP-5-120 EMBEDMENT GAGES concrete 322-DJV Strain Sensing
Contextual Info: Embedment Gages Vishay Micro-Measurements Special Purpose Sensors - Embedment Gages The EGP-Series Embedment Strain Gage is specially designed for measuring mechanical strains inside concrete structures. The sensing grid, constructed of a nickel-chromium alloy similar to Karma , has an active gage length of 4 in (100 mm) for

RY43

Abstract: KFG-02-120-C1-11L3M3R
Contextual Info: OMEGA STRAIN GAGES SPECIFICATIONS CHART c a a b b c b a a b c c a Foil strain gages are constructed by embedding a foil measuring element into a carrier. Foil measuring grid Carrier Substrate thickness Cover thickness Connection dimensions in mm [in] Nominal resistance

LY-43

Abstract: SG13/GR116
Contextual Info: TRANSDUCER-QUALITY STRAIN GAGES To Order Specify Model Number TYPE SERIES MODEL NO. PRICE PER PKG FOIL OF 5 MATERIAL DIMENSIONS [MM] GRID CARRIER TEMP. COEF.* MAX TERM EXC PADS Ω A B C D SS SS 350 350 3.3 6.3 1.5 3.9 8.2 12 4.0 7.8 10 15 TP-2 TP-3 LY SERIES

Contextual Info: PRODUCT SPECIFICATION VERTICAL MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.27 mm .050 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin-lead plating. 2.0 PRODUCT DESCRIPTION

LR19980

Abstract: PE-76 UCP2008-0143 SMES-152
Contextual Info: PRODUCT SPECIFICATION INVERTED RIGHT ANGLE MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.02 mm .040 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin plating. 2.0 PRODUCT DESCRIPTION

EIA-364-65

Abstract: smes-152 EIA-364-31A-83 eia-364-21 PS-45240-001 UCP2004-0139 EIA-364-41 EIA-364-28D-99 EIA-364-23A-85 EIA-364-23A
Contextual Info: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 0.65 mm .026 inch centerline (pitch) printed circuit board (PCB) connector series with select gold (over nickel) plated contacts, and select tin/lead (over nickel) plated solder surfaces.

EIA-364-28

Abstract: LR19980 PE-76 UCP2009-1545 IEC 60603-7 vibration PCB separation EIA364-28
Contextual Info: PRODUCT SPECIFICATION LOW PROFILE VERTICAL MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.27 mm .050 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin plating. 2.0 PRODUCT DESCRIPTION

Contextual Info: PRODUCT SPECIFICATION LOW PROFILE VERTICAL MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.27 mm .050 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin-lead plating. 2.0 PRODUCT DESCRIPTION

LR19980

Abstract: PE-76 UCP2008-0143
Contextual Info: PRODUCT SPECIFICATION LOW PROFILE RIGHT ANGLE MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.27 mm .050 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin plating. 2.0 PRODUCT DESCRIPTION

SMES-152

Contextual Info: PRODUCT SPECIFICATION INVERTED RIGHT ANGLE MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.02 mm .040 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin-lead plating. 2.0 PRODUCT DESCRIPTION

LR19980

Abstract: PE-76 UCP2008-0143 PCB separation iec60603-7
Contextual Info: PRODUCT SPECIFICATION LOW PROFILE RIGHT ANGLE MODULAR JACKS 1.0 SCOPE This Product Specification covers the 1.27 mm .050 inch centerline (pitch) printed circuit board (PCB) modular jack connector series with selective gold and tin plating. 2.0 PRODUCT DESCRIPTION

SMES-152

Abstract: 1050C 300C 500C LR19980 UCP2005-2745 molex 41791
Contextual Info: PRODUCT SPECIFICATION 1.0 SCOPE This Product Specification covers the 3.96 mm .156 inch centerline (pitch) Trifurcon Connectors terminated with 18 to 26 AWG wire using crimp technology when mated with 1.14mm (.045) square pin headers. 2.0 PRODUCT DESCRIPTION