MOLDING Search Results

MP4007

Contextual Info: SILICON NPN EPITAXIAL TYPE POWER TRANSISTOR 4 IN 1 MP4007 HIGH POWER SWITCHING APPLICATIONS. INDUSTRIAL APPLICATIONS Unit in mm HAMMER DRIVE, PULSE MOTOR DRIVE AND INDUCTIVE 25.2 ± 0.2 LOAD SWITCHING. . Small Package by Full Molding. (SIP 10 Pin) . High Collector Power Dissipation.

mp4002

Contextual Info: MP4002 SILICON NPN EPITAXIAL TYPE DARLINGTON POWER TRANSISTOR 4 IN 1 HIGH POWER S WITCHING APPLICATIONS. HAMMER DRIVE, INDUSTRIAL APPLICATIONS Unit in mm PULSE MOTOR DRIVE AND INDUCTIVE 25.2 ±0.2 LOAD SWITCHING. . Small Package by Full Molding. (SIP 10 Pin)

MP3008

Contextual Info: MP3008 SILICON NPN EPITAXIAL TYPE_ DARLINGTON POWER TRANSISTOR 3 IN 1 INDUSTRIAL APPLICATIONS Unit in mm o HIGH POWER SWITCHING APPLICATIONS, o HAMMER DRIVE, PULSE MOTOR DRIVE AND INDUCTIVE LOAD SWITCHING. FEATURES • Small Package by Full Molding.

Contextual Info: Special Connectors Battery Connectors 2.5mm/3.0mm Pitch 2.5mm Pitch, Plug Assembly 10 Position, Part Number : 1123684-7 Material and Finish : Housing — Thermoplastic Molding Compound, UL94V-0 -32.9-28.7- rated, black Contact — Copper Alloy, Nickel-underplated all over,

PJ 969 diode

Abstract: MP4012 PJ 969
Contextual Info: MP4012 SILICON NPN EPITAXIAL TYPE_ DARLINGTON POWER TRANSISTOR 4 IN 1 HIGH POWER SWITCHING APPLICATIONS. INDUSTRIAL APPLICATIONS _Unit in mm HAMMER DRIVE, PULSE MOTOR DRIVE AND INDUCTIVE 25.2±0-2 LOAD SWITCHING. . Small Package by Full Molding.

mp3007

Contextual Info: MP3007 SILICON PNP EPITAXIAL TYPE DARLINGTON POWER TRANSISTOR 3 IN 1 INDUSTRIA) o HIGH POWER SWITCHING APPLICATIONS, APPLICATIONS Unit in mm o HAMMER DRIVE, PULSE MOTOR DRIVE AND INDUCTIVE LOAD SWITCHING. FEATURES • Small Package by Full Molding. (SIF 8 Pin)

PDR5K

Abstract: PDR5K-13
Contextual Info: PDR5K 5A GLASS PASSIVATED RECTIFIER PowerDI 5 Features Mechanical Data • • • • • • Glass Passivated Die Construction Low Leakage Current Lead Free Finish, RoHS Compliant Note 1 "Green" Molding Compound (No Br, Sb) • • NEW PRODUCT • •

Contextual Info: BC817 SERIES NPN GENERAL PURPOSE TRANSISTORS 45 Volt VOLTAGE POWER 330 mW • General purpose amplifier applications • NPN epitaxial silicon, planar design • Collector current IC = 500mA • Lead free in compliance with EU RoHS 2011/65/EU directive • Green molding compound as per IEC61249 Std. . Halogen Free

Contextual Info: < Dual-In-Line Package Intelligent Power Module > PSS35S92F6-AG PSS35S92E6-AG TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  3 phase DC/AC inverter  600V / 35A CSTBT  N-side IGBT open emitter  Built-in bootstrap diodes with current limiting resistor

Contextual Info: 2SC2411K NPN GENERAL PURPOSE SWITCHING TRANSISTOR VOLTAGE 32 Volts POWER 225mW • NPN epitaxial silicon,planar design • Collector-emitter voltage VCE=32V • Collector current IC=500mA • Lead free in comply with EU RoHS 2011/65/EU directives. • Green molding compound as per IEC61249 Std. . Halogen Free

Contextual Info: < Dual-In-Line Package Intelligent Power Module > PSS20S71F6 TRANSFER MOLDING TYPE INSULATED TYPE OUTLINE MAIN FUNCTION AND RATINGS  3 phase DC/AC inverter  600V / 20A CSTBT  N-side IGBT open emitter  Built-in bootstrap diodes with current limiting resistor

30p PVC

Abstract: 55x21 "18 AWG"
Contextual Info: part number: description: date: June 27, 2012 rev: A page: 1 of 2 10-01092 Cable, 1830 mm, 5.5x2.1 mm 50-00025 dc jack to stripped tinned, 18 AWG, 30-00007 wire Specifications: connector description dc jack, 5.5x2.1xL17.4 mm, molding style, P/N 50-00025 overmold

ZJY51R5-8P

Abstract: zjy51 FCC15 ZJYS51R5
Contextual Info: TDK Common-Mode Choke Coils 0.15A to 30A RATED VOLTAGE 50V SERIES ZJYS, DUAL-IN-LINE PACKAGE TYPE FEATURES • Excellent EMI prevention effect in high frequency optimum for prevention of radiation noises from signal cables. • Transfer molding structure of the coil provides high

MARKING CODE 3J

Contextual Info: BC858W PNP General Purpose Transistor FEATURES • Ideally suited for automatic insertion • For Switching and AF Amplifier Applications MECHANICAL DATA • Case: SOT-323 Plastic • Case material: “Green” molding compound, UL flammability classification 94V-0, No Br. Sb. CI

Contextual Info: DS520-30LED02 SURFACE MOUNT SCHOTTKY BARRIER DIODE REVERSE VOLTAGE – 30 Volts FORWARD CURRENT – 0.1 Ampere FEATURES • Low VF drop • Low Reverse Current MECHANICAL DATA • Case: QFN_1.0*0.6*0.5 package. • Case Material: “Green” molding compound, UL flammability classification 94V-0, No Br. Sb. CI

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM320 THRU FM3100 Silicon epitaxial planer type Features SMC Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.283 7.2 0.260(6.6) For surface mounted applications.

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM5817-L THRU FM5819-L Silicon epitaxial planer type Features SMA-L Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.205 5.2 0.189(4.8)

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM320-B THRU FM3100-B Silicon epitaxial planer type Features SMB Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.213 5.4 0.197(5.0) 0.016(0.4) Typ.

ISO11359-2

Abstract: 1140A1 ASTM d792 Polyphenylene sulfide OF-1008 PPS 1130a1 modulus Fortron 1140L4 1140A64 1140A6 1140L4
Contextual Info: SENSORS & CONTROLS PRODUCTS June, 2006 Bourns Manufacturers Representatives Corporate Distributor Product Managers Americas Sales Team Asia Sales Team Europe Sales Team Model EN Optical Encoder Series Material Change Sensors and Controls Division will be changing the plastic material used in molding the LED trimming

Contextual Info: Formosa MS Chip Silicon Rectifier FM4001 THRU FM4007 Glass passivated type Features SMA Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.189 4.8 0.165(4.2) 0.012(0.3) Typ. For surface mounted applications.

Contextual Info: Formosa MS Low VF Chip Schottky Barrier Diodes SL32-A THRU SL34-A Silicon epitaxial planer type Features SMA Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.189 4.8 0.165(4.2)

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM520-B THRU FM5100-B Silicon epitaxial planer type Features SMB Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.213 5.4 0.197(5.0) 0.016(0.4) Typ.

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM1020-T1 THRU FM1040-T1 Silicon epitaxial planer type Features SMC-T1 Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.272 6.9 0.248(6.3)

Contextual Info: Formosa MS Chip Schottky Barrier Diodes FM120-S THRU FM1100-S Silicon epitaxial planer type Features SMA-S Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. 0.205 5.2 0.189(4.8)