MQFP 14X14 Search Results

ipc-SM-782

Abstract: 14x14-64 MQFP 14X14 AN49 fairchild 245
Contextual Info: www.fairchildsemi.com Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to

ipc-SM-782

Abstract: 128 QFP 14x20 footprint jedec mo-108 RAYTHEON Raytheon Electronics MQFP 80 PACKAGE qfp 64 land pattern qfp land pattern QFP-10X10-44 Raytheon Company
Contextual Info: Electronics Semiconductor Division Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to

microprocessors architecture of 8251

Abstract: microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251 DS4812 CLA200
Contextual Info: CLA200 Series CMOS Gate Arrays Advance Information DS4812 - 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

8251 uart vhdl

Abstract: microprocessors interface 8086 to 8251 microprocessors architecture of 8251 DS4812 8048 8251 8086 microprocessor kit manual
Contextual Info: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

zarlink clt

Abstract: 8251 uart vhdl microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Zarlink CLA200 CLA200 Series UART 8251 DS4812 zarlink asic
Contextual Info: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

Contextual Info: CLA200 Series M IT E L CMOS Gate Arrays Advance Information SEMICONDUCTOR DS4812 -1 .3 July 1997 IN TR O D U C TIO N The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

FPQ 208 0.5 10

Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
Contextual Info: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch

Contextual Info: SiI 2022 Fibre Channel SerDes Silicon Image's SiI 2022 serializer/deserializer SerDes is capable of transmitting and receiving data at 1.0625 and 2.125 gigabits-per-second (Gbps). Targeted at Fibre Channel applications, the SiI 2022 SerDes is designed for power, performance and price. Making use of a robust,

MCHC908AB32CFUR2

Contextual Info: Page 1 of 3 MCHC908AB32CFUR2 Information General information Package information Environmental and Compliance information Replacement Parts Information Manufacturing and Qualification information Ordering information Product/Process Change Notice PCN Operating Characteristics

EIA 481 QFN pin 1

Abstract: smd transistor 5c sot-23 TB347 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1
Contextual Info: Tape and Reel Specification for Integrated Circuits Technical Brief January 5, 2007 TB347.10 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged

MC14513

Abstract: DS00784 D52015 MCP1525 TC7135 DM7447A TC7660 74C04 AN784 DS0078
Contextual Info: TC7135 4-1/2 位 A/D 转换器 特性 概述 • • • • • • • • • • • • • TC7135 4-1/2 位 A/D 转换器（A/D Converter，ADC） 的分辨率为 50 ppm （20,000 分之一），最大非线性误 差为 1 个计数。自动调零周期将零误差和零漂移分别降

MC9S12Dx256

Abstract: tray qfp 14x14 1.4 tray qfp 14x14 PEAK TRAY qfp 14x14 MC9S12A256CFUE 1K79X peak mqfp 14x14 EAR99 HCS12 HCS12 1k79x
Contextual Info: Page 1 of 4 MC9S12A256BCFU Information General information Package information Environmental and Compliance information Replacement Parts Information Manufacturing and Qualification information Ordering information Product/Process Change Notice PCN Operating Characteristics

tqfp 7X7X1.4mm

Abstract: 14x14x1.4mm wlcsp inspection MO-169 TB347 TQFP 48-1 PACKAGE
Contextual Info: Tape and Reel Specification for Integrated Circuits Technical Brief April 13, 2009 TB347.12 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

MD300-10A

Abstract: P32C-100-600A p20d100 C-PGA176-S15U-2 CDIP28 LA-0543A tray bga P-TQFP100-14X20-0 0x20010 P14DH-100-300A2-1
Contextual Info: Find tool 1. Click button in the Toolbar. 2. Search dialog box is displayed. 3. Enter a NEC code to be searched and click Find . Caution Don't use the wild card *) when entering a NEC code. Ex.) Find Find What P22C-100-300A-1 Match Whole Word Only Match Case

TQFN 48 7X7

Abstract: QFN 5X5 tqfp 7x7 40 TQFN 5x5 LGA 4x5 bga 10x10 35x35 bga qfn 68 10x10 TQFP 14X20 qfn 8x8 reel
Contextual Info: TAPE AND REEL PACKAGING DEVICE TYPE BODY SIZE PIN COUNT TAPE WIDTH TAPE PITCH REEL SIZE QUANTITY PER REEL ORIENTATION IN TAPE SOIC .150 8 12mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 14 16mm 8mm 13 inch 2500 FIGURE 2 SOIC .150 16 16mm 8mm 13 inch 2500 FIGURE 2

d2zd

Contextual Info: — z VA RIA TIO N S D D1 - D2- - s L MIN. MAX. MIN. D A 3.00 O fU 3.00 0.10 0.25 0.10 0.25 2.55 2.75 2.55 2.75 17.20 BSC. 17.20 BSC. 14.00 BSC. 14.00 BSC. 12.00 BSC. 12.00 BSC. 1.00 REF. 1.00 REF. 17.20 BSC. 17.20 BSC. 14.00 BSC. 14.00 BSC. 12.00 BSC.

14x14x1.4mm

Contextual Info: CS7410 CD/MP3/WMA Audio Controller Features Description Super on-chip Integration for low cost and low count bill of materials 32-Bit RISC Processor performs audio decode and system management functions 16-bit DSP for audio special effects 80 Kbytes internal SRAM, and 256 Kbytes internal ROM

MB89371A

Abstract: mb89371AH mb89371 MB89195A 8 bit dip switch nec 16f MB90P263PF MB90P263 MB2142-01 detailed vfd circuit diagram for motor
Contextual Info: To Top / Lineup / Index Product Line-up Microcomputers Microcontrollers 8-bit Proprietary F2MC-8L Family Support tools 16-bit Proprietary F2MC-16L Family F2MC-16LX Family F2MC-16F Family Support tools 32-bit FR Family Support tools Microcontroller product list

Contextual Info: Technical Brief 347 Tape and Reel Specification for Integrated Circuits Introduction Many Surface Mounted Devices SMDs are being packaged for shipment in embossed tape and wound onto reels. The Intersil tape and reel specifications are in compliance with

T444

Abstract: 100-PIN CS7410 CS7410-CM CS7410-CQ
Contextual Info: CS7410 CD/MP3/WMA Audio Controller Description Features l Super on-chip Integration for low cost and low count bill of materials l 32-Bit RISC Processor performs audio decode and system management functions l 16-bit DSP for audio special effects l 80 Kbytes internal SRAM, and 256 Kbytes internal ROM

100-PIN

Abstract: CS7410 CS7410-CM CS7410-CQ
Contextual Info: CS7410 CD/MP3/WMA Audio Controller Features Description Super on-chip Integration for low cost and low count bill of materials 32-Bit RISC Processor performs audio decode and system management functions 16-bit DSP for audio special effects 80 Kbytes internal SRAM, and 256 Kbytes internal ROM

JSTD-020

Abstract: DM035 26438
Contextual Info: RELIABILITY MONITOR DS1232L JAN '01 MONITOR REVISION DATE CD LOT NUMBER PINS PACKAGE 0051 DK038265AAC 8 C2-L SOIC PROCESS Single Poly, Single Metal 0.8 µm Standard Process DEVICE DS1232 WIDTH ASSEMBLY SITE 150x1.4 ATP Anam, PI JOB NO DESCRIPT Cf: 60% Ea: 0.7

1f1-1717-a19

Abstract: 153FBGA BGA 6x6 tray FBGA tray kostat tray bga 6x6 169fbga-12.0x16.0-8x16-0 78BOC-11 78BOC ePAK BGA 5x5 tray 153FBGA-9
Contextual Info: Jul. 2010 Packing Tray Material Line-up Quantity Bake Temp. 8.1*15.1 8*12 ,256M DDR 5G 60WMBG Package 8*12 130℃ MAX 60M/54WBGA-8.10X15.10-8X12-A TR_MARKING LA69-00635A Material Code Material Spec 48TBGA,10.0*9.0(8*16) 8*16 130℃ MAX 48-TBGA-10.0X9.0-8X16-O