MQFP 14X20 Search Results

MS-022

Contextual Info: Plastic Packages for Integrated Circuits Metric Plastic Quad Flatpack Packages MQFP D MDP0055 D1 14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT SPREADER) 3.2mm FOOTPRINT 128 PIN 1 ID 1 SYMBOL 20.000 ±0.100 (E1) 19.870 ±0.100 18.500 REF E1 E 12.500 REF C0.600x0.350

tip 220

Abstract: MS022 MS-022 r025 14X20MM
Contextual Info: Plastic Packages for Integrated Circuits Metric Plastic Quad Flatpack Packages MQFP D MDP0055 D1 14x20mm 128 LEAD MQFP (WITH AND WITHOUT HEAT SPREADER) 3.2mm FOOTPRINT 128 PIN 1 ID 1 DIMENSIONS (MILLIMETERS) A Max 3.40 20.000 ±0.100 (E1) 19.870 ±0.100

ipc-SM-782

Abstract: 14x14-64 MQFP 14X14 AN49 fairchild 245
Contextual Info: www.fairchildsemi.com Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to

ipc-SM-782

Abstract: 128 QFP 14x20 footprint jedec mo-108 RAYTHEON Raytheon Electronics MQFP 80 PACKAGE qfp 64 land pattern qfp land pattern QFP-10X10-44 Raytheon Company
Contextual Info: Electronics Semiconductor Division Application Note 49 Land Patterns for Surface Mount Metric Quad Flat Pack MQFP Devices The use of MQFP packaged devices has increased over the last several years. Along with the increase comes the need for standard package outlines and standard sets of data to

QFP JEDEC tray

Abstract: JEDEC TRAY QFP QFP 14 14 tray SSD-A-H5899-1 QFp Package tray JEDEC tray standard
Contextual Info: TRAY CONTAINER 105.0 150°C MAX A' 27.00 18.6 21.00 MQFP 14x20 2.7mm A 15.45 24.6 22.50 270.0 315.0 322.6 SECTION A – A' 24.6 Applied Package 4.82 6.35 19.6 7.62 135.9 UNIT : mm Quantity (pcs) MQFP 14 × 20 2.7mm Tray Carbon PPE 64-pin Plastic QFP (2.7mm thick)

QFP JEDEC tray

Abstract: QFP 14 14 tray qfp tray standard
Contextual Info: 105.0 150°C MAX A' 27.00 18.6 21.00 MQFP 14x20 2.7mm A 15.45 24.6 22.50 270.0 315.0 322.6 SECTION A – A' 24.6 4.82 6.35 19.6 7.62 135.9 UNIT : mm Applied Package Quantity (pcs) Tray 64-pin Plastic QFP (2.7mm thick) MAX. 66 Material 80-pin Plastic QFP (2.7mm thick)

2701 NEC

Abstract: nec 2701
Contextual Info: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 64 65 41 40 detail of lead end S C D R Q 25 24 80 1 F J G H I P M K M N S L NOTE ITEM 1. Controlling dimension

NEC 2701

Abstract: 2701 NEC JEDEC tray dimension SC-581-A LA-044A-1 r-2524
Contextual Info: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 80 pin QFP 14 × 20 Terminal Spacing Linear = 0.8 A B 41 40 64 65 detail of lead end S C D Q R 25 24 80 1 F G J H I M K P M N S L S NOTE 1. Controlling dimension

NEC 2701

Abstract: NEC D 582 2701 NEC LA-1244A-1 transistor NEC D 582 QFP JEDEC tray 1802M
Contextual Info: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 detail of lead end 33 32 C D S R Q 64 1 20 19 F G H I M P J K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of

NEC 2701

Abstract: 2701 NEC P100GF-65-3BA1-3
Contextual Info: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 51 50 80 81 detail of lead end C D S R Q 31 30 100 1 F J G H I M P K M N L NOTE Each lead centerline is located within 0.15 mm (0.006 inch) of

S64GF

Contextual Info: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 64 pin QFP 14 × 20 Terminal Spacing Linear = 1.0 A B 51 52 33 32 detail of lead end C D S R Q 64 1 20 19 F J G H I M P K M N L NOTE ITEM Each lead centerline is located within 0.20 mm (0.008 inch) of

S100GF-65-JBT-1

Contextual Info: Mounting Pad Packing Name LA-2244A-1 NEC Tray LA-1244A-1 LA-044A-1 JEDEC Tray MQFP 14x20 2.7mm 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 80 81 51 50 detail of lead end C S D R Q 31 30 100 1 F G H I M J K P M N NOTE ITEM Each lead centerline is located within 0.13 mm (0.005 inch) of

Contextual Info: Packing Name LA-2244A-1 Mounting Pad NEC Tray LA-1244A-1 JEDEC Tray MQFP 14x20 2.7mm LA-044A-1 100 pin QFP 14 × 20 Terminal Spacing Linear = 0.65 A B 51 50 80 81 detail of lead end C D S Q R 31 30 100 1 F G H I J M P K M N NOTE ITEM Each lead centerline is located within 0.15 mm (0.006 inch) of

microprocessors architecture of 8251

Abstract: microprocessors interface 8086 to 8251 Mitel Semiconductor process flow 8251 uart vhdl UART 8251 DS4812 CLA200
Contextual Info: CLA200 Series CMOS Gate Arrays Advance Information DS4812 - 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

zarlink clt

Abstract: 8251 uart vhdl microprocessors architecture of 8251 microprocessors interface 8086 to 8251 Zarlink CLA200 CLA200 Series UART 8251 DS4812 zarlink asic
Contextual Info: CLA200 Series CMOS Gate Arrays Advance Information DS4812 ISSUE 1.3 July 1997 INTRODUCTION The CLA200 Series Arrays from Zarlink Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

Contextual Info: CLA200 Series M IT E L CMOS Gate Arrays Advance Information SEMICONDUCTOR DS4812 -1 .3 July 1997 IN TR O D U C TIO N The CLA200 Series Arrays from Mitel Semiconductor offer designers the capability to integrate designs of more than 2 million gates. There are 14 fixed arrays optimised for low to

Arm processor vlsi technology

Abstract: PC302 QFP 128 bonding
Contextual Info: VLSI T e ch n o lo g y o.5-m ic r o n in c. _ PRELIMINARY ASIC PRODUCT FAMILY GENERAL SPECIFICATIONS FEATURES BENEFITS • 0.5-micron 0.45-micron effective two- and three-layer metal CMOS technology. Typical 2-input NAND (FO=2) spec

PC MOTHERBOARD ibm rev 1.5

Abstract: rev 1.5 ibm motherboard ibm xt MOTHERBOARD CIRCUIT diagram "LPC I/O" LPC47M172 PC MOTHERBOARD CIRCUIT diagram motherboard ibm rev 1.5 free circuit diagram of motherboard IBM Rev 1.6 MOTHERBOARD CIRCUIT diagram free circuit diagram of pc motherboard pd down
Contextual Info: LPC47M172 Advanced I/O Controller with Motherboard GLUE Logic Data Brief Product Features ƒ ƒ ƒ 3.3V Operation 5V tolerant LPC Interface − Multiplexed Command, Address and Data Bus − Serial IRQ Interface Compatible with Serialized IRQ Support for PCI Systems

FPQ 208 0.5 10

Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
Contextual Info: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch

EIA 481 QFN pin 1

Abstract: smd transistor 5c sot-23 TB347 SMD 504 5E smd transistor 5d sot-23 MO-169 fbga196 TQFP 48-1 PACKAGE WLCSP 7x7x1
Contextual Info: Tape and Reel Specification for Integrated Circuits Technical Brief January 5, 2007 TB347.10 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged

Contextual Info: h a r r H C -5506 i s S E M I C O N D U C T O R Ê ADVANCE INFORMATION È \J DSLIC Dual Subscriber Line Interface Circuit June 1994 Features Description • Integration of Two SLlCs in One Package T h e H C -550 6 is a Dual Subscriber Line Interface Circuit

tqfp 7X7X1.4mm

Abstract: 14x14x1.4mm wlcsp inspection MO-169 TB347 TQFP 48-1 PACKAGE
Contextual Info: Tape and Reel Specification for Integrated Circuits Technical Brief April 13, 2009 TB347.12 Author: Laszlo Nemeth Introduction • EIA-481 for the. . . . . . . . . . . . . . . . 8, 12, 16, 24, 32, 44 and 56mm Wide Tape Many surface mounted devices SMD are being packaged

21x21

Abstract: MM554 tray bga 45x45 bga X13769XJ2V0CD00 CPGA132 LA010 P14DH-100-300A2-1
Contextual Info: 検索ツール 1. ツールバーの アイコンをクリックしてください。 2. ［検索］のダイアログ・ボックスが表示されます。 3. 検索したいパッケージのNECコードを入力して， 検索 F をクリックしてください。

QFn 64 tape carrier

Abstract: Techwell 7x7x1 TB347 MO-169 1748 QFN
Contextual Info: Technical Brief 347 Author: Laszlo Nemeth Tape and Reel Specification for Integrated Circuits Introduction Many surface mounted devices SMD are being packaged for shipment in embossed tape and wound onto reels. The Intersil Tape and Reel specifications are in compliance with