MQFP 52 PACKAGE Search Results

on 5295

Abstract: on 5295 transistor MQFP 52 PACKAGE
Contextual Info: a 0.95 0.0374 0.80 (0.0315) 0.65 (0.0256) 52-Lead MQFP Package (S-52) Dimensions shown in millimeters and (inches) 13.45 (0.5295) 13.20 (0.5197) SQ 12.95 (0.5098) 2.45 (0.0965) MAX 39 27 40 SEATING PLANE 26 7.80 (0.3071) REF 10.11 (0.3980) 10.00 (0.3937) SQ

S-52

Contextual Info: a 1.03 0.88 0.73 52-Lead Plastic Quad Flatpack Package [MQFP] S-52 Dimensions shown in millimeters 13.45 13.20 SQ 12.95 2.45 MAX 39 27 40 SEATING PLANE 26 7.80 REF 10.20 10.00 SQ 9.80 TOP VIEW (PINS DOWN) VIEW A PIN 1 52 14 1 0.23 0.11 13 0.65 BSC 2.20 2.00

52LEAD

Abstract: S-52
Contextual Info: a 1.03 0.88 0.73 52-Lead Metric Quad Flat Package [MQFP] S-52 Dimensions shown in millimeters 14.15 13.90 SQ 13.65 2.45 MAX 39 27 40 SEATING PLANE 26 7.80 REF 10.20 10.00 SQ 9.80 TOP VIEW (PINS DOWN) VIEW A PIN 1 52 14 1 0.23 0.11 13 0.65 BSC 2.10 2.00 1.95

MS-022-AC

Abstract: s52-1 S521
Contextual Info: a 52-Lead Metric Quad Flat Package [MQFP] S-52-1 Dimensions shown in millimeters 1.03 0.88 0.73 13.45 13.20 SQ 12.95 2.45 MAX 39 SEATING PLANE 27 40 26 7.80 REF TOP VIEW 10؇ 6؇ 2؇ 2.20 2.00 1.80 0.25 0.10 VIEW A ROTATED 90؇ CCW 10.20 10.00 SQ 9.80 (PINS DOWN)

s522

Contextual Info: a 52-Lead Metric Quad Flat Package [MQFP] S-52-2 Dimensions shown in millimeters 1.03 0.88 0.73 14.15 13.90 SQ 13.65 2.45 MAX 39 SEATING PLANE 27 40 26 7.80 REF TOP VIEW 10.20 10.00 SQ 9.80 (PINS DOWN) 10؇ 6؇ 2؇ 2.10 2.00 1.95 0.25 MIN VIEW A 0.23 0.11

E1 396

Abstract: 0537
Contextual Info: Package Information Drawing M2 – 52-Pin Metric Quad Flatpack MQFP (Package Type M) D D1 D3 52 1 2 3 Index Mark E3 E1 E C A2 B e1 A α A1 L Family: Metric Quad Flatpack Package Millimeters Symbol Min Max α 0° A Inches Min Max 7° 0° 7° – 3.05 –

Bt864AKRF

Abstract: Bt865AKRF conexant bt864 100138-004 BT856 mallory tsc CCIR601 CCIR656 YC16 Bt864A
Contextual Info: Bt864A/Bt865A YCrCb to NTSC/PAL Digital Video Encoder Data Sheet 100138C February 2003 Ordering Information Model Number Description Package Bt864AKRF YCrCb to NTSC/PAL Digital Video Encoder without Macrovision 52-Pin MQFP Bt865AKRF YCrCb to NTSC/PAL Digital Video Encoder with Macrovision

CS42888

Abstract: CS42448
Contextual Info: MULTICHANNEL CODECS CS424XX CS42448/888 64-pin LQFP Package –95 / –98 DACs; –95 / –98 ADCs 192 Multichannel CODEC, 6/8 DACs, 4/6 ADCs, TDM I/F 52 MQFP 192 SingleVA = 3.3 or 5; Ended or MultiDifferential VD = 3.3 or 5; channel VL = 1.8 to 5

MQUAD

Contextual Info: MECHANICAL DATA MMQF010 – OCTOBER 1994 METAL QUAD MQUAD FLATPACK MEP (S-MQFP-G208) 156 105 104 157 0,27 0,17 0,08 M 0,50 53 208 1 0,16 NOM 52 25,50 TYP 27,74 SQ 27,54 Gage Plane 30,80 SQ 30,40 0,25 0,25 MIN 3,30 TYP 0°– 7° ā 0,60 0,40 Seating Plane

MQUAD

Contextual Info: MECHANICAL DATA MMQF010 – OCTOBER 1994 METAL QUAD MQUAD FLATPACK MEP (S-MQFP-G208) 156 105 104 157 0,27 0,17 0,08 M 0,50 53 208 1 0,16 NOM 52 25,50 TYP 27,74 SQ 27,54 Gage Plane 30,80 SQ 30,40 0,25 0,25 MIN 3,30 TYP 0°– 7° ā 0,60 0,40 Seating Plane

Contextual Info: MECHANICAL DATA MMQF009 – OCTOBER 1994 METAL QUAD MQUAD FLATPACK (DIE-DOWN) MEO (S-MQFP-G208) 156 105 104 157 0,27 0,17 0,08 M 0,50 53 208 1 0,16 NOM 52 25,50 TYP 27,74 SQ 27,54 Gage Plane 30,80 SQ 30,40 0,25 0,25 MIN 3,30 TYP 0°– 7° 0,60 0,40 Seating Plane

MO-112

Abstract: MS-029 MATRIX TRAY MS-022 LD240
Contextual Info: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced

MO-112

Abstract: MS-022 MS-029 DS250G JEDEC standard 033
Contextual Info: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package portfolio enables the designer, specifier or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date,

LD 337

Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
Contextual Info: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material

ICL7109

Abstract: PDIP-40 ICL7109CPL icl7109cqh icl7109ejl
Contextual Info: Maxim Integrated Products 1 For pricing, delivery, and ordering information, please contact Maxim/Dallas Direct! at 1-888-629-4642, or visit Maxim’s website at www.maxim-ic.com. Package Information

CRM-1076DJ-G

Abstract: CRM*1076 CRM-1076 SUMITOMO g600f CRM1076DJ sumitomo crm 1076dj ABLEBONd 84-1 sumitomo crm
Contextual Info: 52-Lead Quad Flat Pack QFP Package Change & Transfer Product Change Notice PCN1103 (v1.0) December 01, 2011 Overview This notice describes the package changes to the 52 Lead Quad Flat Pack (QFP) Package for all of Holt’s ARINC 429, MILSTD 1553, and LCD Display Driver family of devices.

CXD1160aq

Abstract: VL82C486-FC2 VL82C486FC NCR53C720 vl82c486 cxd1160 74HC125 EPM7128 d75304gf A1280
Contextual Info: Issued March 1997 232-5109 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.

MD300-10A

Abstract: QFN tray tray datasheet bga SIP 400B TSOP TRAY 40 PIN BGA package tray 64 NEC A39A 240 TSOP package tray 6-tsop TRAY DIMENSIONS 132 PGA
Contextual Info: CHAPTER 4 CHAPTER 4 4.1 PACKING STYLES AND NOTES 4.1.1 Packing Styles 4.1.2 Notes on Handling 4.2 PACKING OF IC PACKAGES 4.2.1 List of Packing 1 DIP (2) SIP, V-DIP, ZIP (3) QUIP, Piggyback (4) PGA (5) SOP, SSOP (6) TSOP (I) (II) (7) QFP, QFP (FP) (8) SVP

VL82C486-FC2

Abstract: NCR53C720 XCS3201FN SN74ACT8818 NCR53C700 cxd1160 VL82C316 CL-GD6440 xc3042-100pq100c CXD1160AQ
Contextual Info: Issued November 1994 018-994 Data Pack H Surface mount test clips Manufacturers device number to RS stock number cross reference Data Sheet N.B. Some devices have the same basic type numbers but are available in several package styles. Before selecting a test clip ensure that the package type matches that of the device to be tested.

JESD51-7

Abstract: 100L JESD51-2 STATS ChipPAC Techpoint
Contextual Info: MQFP Metric Quad Flat Pack • 10 x 10mm to 32 x 32mm body sizes • 44 to 240 lead counts • Lead pitch range from 0.80mm to 0.50mm FEATURES DESCRIPTION • Body Sizes: 10 x 10mm to 32 x 32mm STATS ChipPAC’s Metric Quad Flat Pack MQFP is a leadframe based, plastic encapsulated package with gull

MO-108

Contextual Info: QFP/MQFP PACKAGE 2.00 mm. Nom. Body Thickness JEDEC Variation SYMBOL N A A1 A2 b c D D1 D2 E E1 E2 e L θ ccc AA-1 MIN / MAX 44 - / 2.70 0.25 / 0.50 1.80 / 2.20 0.29 / 0.45 0.11 / 0.23 13.20 BASIC 10.00 BASIC 8.00 Ref. 13.20 BASIC 10.00 BASIC 8.00 Ref.

ADUC836

Abstract: MQFP MQFP 52 PACKAGE AD7706 AD7731 AD7853
Contextual Info: uCONVETERS MODEL ADuC812 ADuC831 ADuC832 ADuC824 ADuC834 ADuC816 ADuC814 ADuC814 ADuC836 Core Core Processor A/D 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 8051/52 Date Printed 8/20/02 AD7853 8ch AD7853 8ch AD7853 8ch AD7731+AD7706 AD7731+AD7706

HI-7159

Abstract: ICL7135 HI3276 HI-5701 HI5714 HI5746 HI-574A HI5766 HI5767 ISL51002
Contextual Info: Data Converters 5 2008 P RODUCT S ELECTION GUIDE Data Converters pg. 5-1 1-Channel (ADCs) (pg. 5-2) 1-Channel (DACs) (pg. 5-4) 2-Channel (ADCs) (pg. 5-3) 2-Channel (DACs) (pg. 5-5) Integrating Display Output (A-D) Data Converters (pg. 5-3) Non-Volatile DACs

g796

Abstract: DIAGRAM IC an 7582 MT9075 MT9075AP MO-112 MT9075AL PCM30 pcm ami
Contextual Info: MT9075  E1 Single Chip Transceiver Advance Information Features Combined PCM 30 framer, Line Interface Unit LIU and link controller in a 68 pin PLCC or 100 pin MQFP package Selectable rate data link access with optional Sa bits HDLC controller (HDLC0) and channel