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    MIL-D-3464

    Abstract: JEDEC J-STD-033b MIL-B-81705 MILD-3464 MIL-D3464 J-STD-033B MIL-D-3464 type 2 MIL-D-3464 type 1 hic-1
    Text: ໒ଙ‫ހ‬ጎዐ‫ח‬ഘ‫ڞ‬ዂ‫ڦ‬ਸଛ ᆅჾ ࿚༶ጺ঳ ā ā֑ᆩড઻‫"ڦ‬ཚ੥"रຍ‫ހ‬ጎ૩සມଚ኱֭๕‫ހ‬ጎ ! āāణമ‫ڦ‬໒‫ހ‬๑ᆩփཞ‫ڦ‬ጀఇࣅࢇ࿿ፇ‫ׯ‬LjԈઔ࣍ᄟ DIP Lj๑ᆩհ‫ࡰރ‬ሞᆇຘ‫ۉ‬ୟӱฉྜ‫ࡰׯ‬থăDIP‫ހ‬ጎ


    Original     		PDF 240oC 28x28x3 MS011822 219oC 10oC/ 20oC/ 30oC/85 30oC/60 MIL-D-3464 JEDEC J-STD-033b MIL-B-81705 MILD-3464 MIL-D3464 J-STD-033B MIL-D-3464 type 2 MIL-D-3464 type 1 hic-1

    JEDEC J-STD-033b

    Abstract: MIL-D-3464 type 1 MIL-D-3464 MIL-D-3464 type 1 and 2 J-STD-033B MIL-B-81705 MILD-3464 LEAD FRAME SURFACE MOUNT QFP JEDEC tray MIL-D-3464 type 2
    Text: Plastic Package Moisture-Induced Cracking Introduction Problem Summary With the older “through-hole” technology packages such as the Dual In-line Package DIP , soldering to printed circuit boards was accomplished using a wave solder. The DIP leads went through holes in the printed circuit board, where


    Original     		PDF CSP-9-111S2) CSP-9-111S2. JEDEC J-STD-033b MIL-D-3464 type 1 MIL-D-3464 MIL-D-3464 type 1 and 2 J-STD-033B MIL-B-81705 MILD-3464 LEAD FRAME SURFACE MOUNT QFP JEDEC tray MIL-D-3464 type 2

    MIL-D-3464 type 1

    Abstract: MIL-D-3464 MIL-D-3464 type 1 and 2 MILD-3464 MIL-D3464 Furnace
    Text: Plastic Package Moisture-Induced Cracking Introduction With the older “through-hole” technology packages such as the Dual In-line Package DIP , soldering to printed circuit boards was accomplished using a wave solder. The DIP leads went through holes in the printed circuit board, where


    Original     		PDF