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    MVP/ID/8165 Search Results

    MVP/ID/8165 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    54121-108081650LF
    Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Single Row, 8 Positions, 2.54mm (0.100in) Pitch. Visit Amphenol Communications Solutions
    10131318-1652100LF
    Amphenol Communications Solutions Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Black Color, 16 Positions, Non GW Compatible Nylon66, Tray Packing. Visit Amphenol Communications Solutions
    10131318-165110PLF
    Amphenol Communications Solutions Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Natural Color, 16 Positions, Non GW Compatible Nylon66, Tray Packing, With Pegs. Visit Amphenol Communications Solutions
    10131318-1651100LF
    Amphenol Communications Solutions Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Natural Color, 16 Positions, Non GW Compatible Nylon66, Tray Packing. Visit Amphenol Communications Solutions
    10131318-16522G0LF
    Amphenol Communications Solutions Minitek® Pwr 4.2 HCC, Dual Row, Right Angle Through Hole Header, 100u\\ Matte Tin plating, Black Color, 16 Positions, LCP, GW Compatible, Tray Packing. Visit Amphenol Communications Solutions