NDS SPEC Search Results

Contextual Info: NDS Series Right Angle or Straight Solder Type Receptacle ORDERING INFORMATION P/N: NDS*-00*-BS 2: Right Angle Solder Type Terminal 4: Straight Solder Type Terminal Pin Count Features: Low insertion/extraction force featuring bellows type contacts. CHARACTERISTICS

Contextual Info: NDS Series Board-to-Board 90° Solder Dip and SMT Comb. Socket (1.27 Pitch) Part Number (Details) NDS 050 - 007 - BS Specifications Insulation Resistance: 500MΩ min. at 500 V DC Withstanding Voltage: 500 V AC rms for 1 minute Contact Resistance: 35mΩ max. at 10mA

Contextual Info: NDS Series Board-to-Board 180° SMT Type Socket - Center Flange (1.27mm Pitch) Part Number (Details) NDS 100 - 005 - BS 1 Specifications Insulation Resistance: 500MΩ min. at 500 V DC Withstanding Voltage: 500 V AC rms for 1 minute Contact Resistance: 35mΩ max. at 10mA

Contextual Info: NDS Series Board-to-Board 180° SMT Type Socket - Center Flange (1.27mm Pitch) Part Number (Details) NDS 148 - 015 - BS 1 Specifications Insulation Resistance: 500MΩ min. at 500 V DC Voltage Rating: 250 V AC Withstanding Voltage: 500 V AC rms for 1 minute

RTM 866 480

Abstract: 80206 MPEG TS 656 10bit dac i2c FPT-208P-M06 iso 13818-2 Pal programming MB86H21 MB87L2250 arc risc
Contextual Info: Product Profile MB86H21 SmartMPEG November 2003 Edition 0.55 MPEG-2 Decoder with Integrated NDS ICAM INTRODUCTION: FEATURES This SmartMPEG is an integrated MPEG-2 settop-box decoder which includes the hardware extensions required to support the NDS Conditional Access system.

nds 40

Abstract: 09nds
Contextual Info: NDS,DP,DA SERIES DIMENSIONS NDS R General Tolerance：±0.2mm DA General Tolerance：±0.2mm DP(L) General Tolerance：±0.2mm HOW TO ORDER □ □ □ - □ □ □ □ - □ - □ Package： □ = Tube Soldering： V = RoHS & Lead Free Solderable Q=Halogen Free(Only for Black)

videoguard

Abstract: nds videoguard nagravision ISO7816 73S8023C nds 40 73S8024RN-IL/F multi sim cards reader iso7816-3 73S8024
Contextual Info: 73S8024RN/C/73S8023C Product Brief STB/POS and General Purpose Smart Card Interface Description The 73S8024RN, 73S8024C and 73S8023C are single smart card interface ICs, compliant to the electrical requirements of ISO-7816-3, EMV 4.0 and NDS Both 8024RN and 8023C are NDS certified electrical specifications. The host processor handles handling the ISO7816 UART and associated protocol layers. The 73S802x

Contextual Info: 73S8024C Smart Card Interface Simplifying System Integration DATA SHEET April 2009 DESCRIPTION FEATURES The Teridian 73S8024C is a single smart card interface IC. It provides full electrical compliance with ISO-7816-3, EMV 4.0 and NDS specifications1. •

smart card tda8004

Contextual Info: 73S8024C Smart Card Interface Preliminary DATA-SHEET October 2004 DESCRIPTION FEATURES The TDK 73S8024C is a single smart card interface IC. It provides full electrical compliance with ISO-7816-3, EMV 4.1 EMV2000 and NDS specifications1. • Card Interface:

8024C

Abstract: ISO7816 TDA8004 ISO-7816-3
Contextual Info: 73S8024C Smart Card Interface Simplifying System Integration DATA SHEET April 2009 DESCRIPTION FEATURES The Teridian 73S8024C is a single smart card interface IC. It provides full electrical compliance with ISO-7816-3, EMV 4.0 and NDS specifications1. •

IEC68-2-27

Abstract: NDS02ZG-M6 NDS03ZA-M6 NDS03ZB-M6 NDS03ZD-M6 NDS03ZE-M6 20a 30mm ceramic fuse
Contextual Info: Product Specifications Nov 2001 NDS Series: 10W / 3.0A DC/DC Converters 36-75V Input 1.5V, 1.8V, 2.5V, 3.3V and 5.0V Outputs Features • • • • • • • • • • Applications • • • • • Distributed power architectures Telecommunications equipment

NDS040-004-BS

Abstract: NDS100-004-BS nds 40 NDS036-004-BS NDS050-004-BS NDS060-004-BS NDS068-004-BS NDS080-004-BS NDS120-004-BS NDS128-004-BS
Contextual Info: NDS Series Board-to-Board 180° Solder Dip Socket (1.27mm Pitch) Part Number (Details) Specifications Insulation Resistance: 500MΩ min. at 500 V DC Withstanding Voltage: 500 V AC rms for 1 minute Contact Resistance: 35mΩ max. at 10mA Current Rating:

Contextual Info: ST8024 Smartcard interface Features • Designed to be compatible with the NDS conditional access system ■ IC card interface ■ 3 or 5 V supply for the IC VDD and GND ■ Three specifically protected half-duplex bidirectional buffered I/O lines to card contacts

IEC68-2-27

Abstract: NDS02ZG-M6 NDS03ZA-M6 NDS03ZB-M6 NDS03ZD-M6 NDS03ZE-M6 20a 30mm ceramic fuse
Contextual Info: Product Specifications Sep 2002 NDS Series: 10W / 3.0A DC/DC Converters 36-75V Input 1.5V, 1.8V, 2.5V, 3.3V and 5.0V Outputs Features • • • • • • • • • • • Applications • • • • • Distributed power architectures Telecommunications equipment

NDS036-002-BS

Abstract: LM3905 NDS040-002-BS NDS050-002-BS NDS060-002-BS NDS068-002-BS NDS080-002-BS NDS100-002-BS NDS120-002-BS NDS128-002-BS
Contextual Info: NDS Series Board-to-Board 90° Solder Dip Socket (1.27mm Pitch) Part Number (Details) Specifications Insulation Resistance: 500MΩ min. at 500 V DC Withstanding Voltage: 500 V AC rms for 1 minute Contact Resistance: 35mΩ max. at 10mA Current Rating: 0.5A

8014b

Contextual Info: 19-5669; Rev 2; 12/11 73S8014BN Smart Card Interface DS_8014BN_057 DESCRIPTION APPLICATIONS The 73S8014BN is a single smart card ICC interface circuit designed to provide full electrical compliance with ISO 7816-3, EMV 4.2, and NDS specifications. It is derived from the

ST8024C

Abstract: ISO7816 JESD97 ST8004 ST8024 ST8024CDR ST8024CTR TSSOP28
Contextual Info: ST8024 Smartcard interface General features • Designed to be compatible with the NDS conditional access system ■ IC card interface ■ 3 or 5V supply for the IC VDD and GND ■ Three specifically protected half-duplex bidirectional buffered I/O lines to card contacts

Contextual Info: NDS Series Board-to-Board 180° SMT Type Socket (1.27mm Pitch) Part Number (Details) Specifications Insulation Resistance: 500MΩ min. at 500 V DC Withstanding Voltage: 500 V AC rms for 1 minute Contact Resistance: 35mΩ max. at 10mA Current Rating: 0.5A

Contextual Info: AN10794 Application with TDA8034 - Demonstration boards description Rev. 1.0 — 6 December 2012 Application note Document information Info Content Keywords TDA8034, Cake8034, Smart Card Interface, Pay TV, STB, ISO 7816-3, NDS Abstract The application note describes the Cake8034_01_D Cake8034_02_D

S7582

Contextual Info: ATM 25MBPS FILTER/MAGNETIC MODULES AND TRANSFORMER P/N:S7582 DATA SHEET Pag1/1 Feature l l For UTP and STP Surface mount applications Designed to meet ATM 25.6 PHY specifications including low frequency cutoff IC grade transfer-molded package withsta nds 235℃ peak

ST8024C

Abstract: ST8024 st8024CDR ISO7816 R100K ST8004 ST8024CTR TSSOP28 ISO-7816 NDS
Contextual Info: ST8024 Smartcard interface Features • Designed to be compatible with the NDS conditional access system ■ IC card interface ■ 3 or 5 V supply for the IC VDD and GND ■ Three specifically protected half-duplex bidirectional buffered I/O lines to card contacts

RJ45 TO DB25

Abstract: MG5000 ETS16P ETS16PS LAT-ETS16 RS-423 DB9 female to RJ45 cable DB25 to RJ45 Flash Cable rj45 to db9 aui rj45 connect
Contextual Info: Compact desktop design TCP/IP and optional LAT support NDS Netware Directory Services Compliant Downloadable Software Upgrades (Flash ROM) Network Enable and Remotely Manage Serial Devices The ETS8PS and ETS16PS Terminal Servers provide remote management of networking equipment and

NDS-08

Contextual Info: NDS-DP-DA series DIP switches Distinctive features and specifications UG1212-A-R1 ❑ Standard, piano and right angle models ❑ 1 to 12 positions ❑ Top tape sealing option ELECTRICAL SPECIFICATIONS MATERIALS • Current/voltage rating : 25mA 24VDC • Initial contact resistance : 50mΩ max.

MC92314

Abstract: alps tuner OFDM USING FFT IFFT METHODS MC92307 ifft alps tuner tv digital dvb-c demodulator dvb-t transmitters ofdm modulator ic MC92309 ofdm modulator
Contextual Info: Freescale Semiconductor, Inc. Freescale Semiconductor, Inc. MC92314 DVB-T Single Chip Demodulator Application Note Authors Christoph Patzelt Freescale , Adrian Turner (NDS) (Single Chip DVB-T Demodulator) Rev. 1.3 Date: November 30, 1998 3:37 pm Freescale Semiconductor, Inc., 2004. All rights reserved.