NITTO CHIP Search Results

MP8000CH

Abstract: MP8000C 8361H MP800 CY7C373I-JC JESD22 nitto chip Nitto
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 000102 VERSION 1.0 March, 2000 84 Lead Plastic Leaded Chip Carrier NITTO 8000CH Molding Compound Level 3 Anam-Manila, Philippines CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director

t7778a

Abstract: LM24014H LM24014 T7778 T7900 74HC138F LF0B08 T7900 LCD LF0B09 LM2401
Contextual Info: LM24014H Dot Matrix LCD Unit LCD Data Sheet FEATURES DESCRIPTION • Display Format: 240 x 64 The SHARP LM24014H Dot Matrix LCD Unit is a 240 × 64 full dot graphic display unit which consists of gray type STN, transflective mode, positive type with an LCD controller and a CG-ROM. NITTO transflector P1 type R = 66.4% (TYP , T = 30.4% (TYP).

nitto SWT 10

Abstract: nitto SWT-20 W07 sot 23 w04 transistor sot 23 UE-111AJ W04 sot 23 transistor w07 transistor marking w08 marking W07 transistor marking w04
Contextual Info: PRODUCT CODING SYSTEM QSP0005_WEB.028 1 2.4.2007 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document. ESD EWS ID MAS MBB T&R 2 Electrostatic Sensitive Device

UE-111AJ

Abstract: nitto SWT-20 transistor marking PB nitto UE111AJ ke marking transistor 2091J Nitto marking code transistor HK mas1025 UE111
Contextual Info: 1 PRODUCT CODING SYSTEM 9.12.2004 QSP0005_WEB.026 Page 1 of 6 GENERAL AND DEFINITIONS This procedure defines the identification system for MAS products. The following abbreviations are used in this document: ESD EWS ID MBB T&R 2 Electrostatic Sensitive Device

cirocomm gps receiver

Abstract: cirocomm Cirocomm GPS
Contextual Info: AP.12B.07.0046A Specification Part No. AP.12B.07.0046A Product Name 12mm Two Stage Active GPS Patch Antenna Feature Ultra Miniature GPS active patch High performance Ultra low power consumption RoHS compliant SPE-11-8-126/B | page 1 of 13 1. Introduction This miniaturised GPS Active Antenna

CCL-HL832NX-A

Abstract: Nitto GE100LFCS Sumitomo G750 GE100LFCS GE-100-LFC CCL-HL832NX GE100LFCS nitto GE-100LFCS CCL-HL-832 CCL-HL832
Contextual Info: LAMINATE data sheet TEPBGA Features: Thermally Enhanced Plastic Ball Grid Array TEPBGA : Amkor's TEPBGA's feature a drop-in heat spreader (TEPBGA-2) and are designed for low inductance. This advanced IC package technology allows application and design engineers to optimize

Adwill D-175

Abstract: UE-111AJ lintec adwill UV tape D-175 UV tape D-175 adwill Lintec UV tape Lintec nitto UE111AJ nitto UV tape D175 lintec
Contextual Info: AN106920 Handling and processing of sawn wafers on UV dicing tape Rev. 2.0 — 13 January 2009 Application note Document information Info Content Keywords Sawn wafers, UV dicing tape, handling and processing Abstract This application note gives hints and recommendations regarding correct

SMP1302-099

Contextual Info: DATA SHEET PIN Diode Chips Supplied on Film Frame Features Designed for high-performance switch and attenuator applications ● Preferred device for module applications ● PIN diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green

Contextual Info: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high-performance, double-balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost ● Available lead Pb -free, RoHS-compliant, and Green

TAIYO PSR 4000

Abstract: manual PACE PSR 800 CCL-HL-832 fbga Substrate design guidelines JEDEC Kostat FBGA CCL-HL832 ablebond esec 3018 operation kostat bga 6mm x 6mm nitto hc100
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

MP7100

Abstract: 82c693 140C CY82C693 CY82C693-NC
Contextual Info: Qualification Report September 1996, QTP# 95432, Version 1.0 PentiumTM hyperCacheTM Chipset Peripheral Controller CY82C693, 208-Pin Plastic Quad Flatpack Pentium is a trademark of Intel Corporation hyperCache is a trademark of Cypress Semiconductor Corporation

nitto tape

Contextual Info: PIN Diode Chips Supplied on Film Frame SMP1320-099, SMP1322-099, SMP1340-099, SMP1353-099 Features • Designed for High Performance Switch Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame

TAIYO PSR 4000

Abstract: manual PACE PSR 800 HC-100-X2 Ablebond 8360 TAIYO PSR 4000 soldermask JEDEC Kostat FBGA PSR4000-AUS5 TAIYO PSR 2000 csp192 FBGA THICK TRAY
Contextual Info: National Semiconductor Application Note 1125 Shaw W. Lee and Wayne Lee June 2000 Introduction CHIP SCALE PACKAGES Laminate substrate based CSPs are an extension of National Semiconductor’s current Plastic Ball Grid Array PBGA technology and are the package of choice for portable applications. CSPs are available in two package designs: Laminate CSP and Fine Pitch Ball Grid Array (FBGA).

pin diode SMP

Abstract: SMP1302-099
Contextual Info: PIN Diode Chips Supplied on Film Frame Features • Designed for High Performance Switch and Attenuator Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame ■ Low Cost Description The SMP series of PIN diodes are designed for high

CY82C691

Abstract: CY82C691-NC 110C 130C 140C 95441
Contextual Info: Qualification Report September 1996, QTP# 95431, Version 1.0 PentiumTM hyperCacheTM Chipset System Controller CY82C691, 208-Pin Plastic Quad Flatpack Pentium is a trademark of Intel Corporation hyperCache is a trademark of Cypress Semiconductor Corporation

TSS463

Abstract: Nitto MP8000 MARKING Z86 1000 BASE Isolation Modules 5000V EOS ESD S 61.1 hmt design data book MOLDING MATERIAL MP8000 HT Q100 temic gateway EIA-556-A
Contextual Info: Qualpack TSS463 / TSS461C TSS463 VAN Van Controller Serial Interface TSS461C VAN Van Controller TSS463/TSS461C VAN Controllers 1999 January TEMIC SEMICONDUCTORS IS AN ATMEL COMPANY Rev. 2 – January 1999 1 Qualpack TS80C31X2/C32X2 1. Contents 1. Contents. 2

Carrollton Semiconductor

Contextual Info: 0 .O P IE K Emitter and Photosensor Chips Optek Technology, Inc. is widely recognized as one of the industry's leading suppliers of high quality gallium arsenide GaAs and gallium aluminum arsenide (GaAIAs) infrared emitter chips and silicon photosensor chips. In hybrid or other applications, where space forbids use

Contextual Info: OPTEK Emitter and Photosensor Chips Optek Technology, Inc. Is widely recognized as one of the industry's leading suppliers of high quality gallium arsenide GaAs and gallium aluminum arsenide (GaAIAs) infrared emit­ ter chips ana silicon photosensor chips. In hybrid or other applications, where space forbids

underfill

Abstract: with or without underfill intel C4 package underfill for good adhesion and low viscosity Low viscosity underfill for flip chip microwave oven
Contextual Info: Simultaneous Chip-Join and Underfill Assembly Technology for Flip-Chip Packaging Tom Dory, Assembly Technology Development, Intel Corp. Kenji Takahashi, Japan Package Technology Development, Intel Corp. Tomomi Kume, Japan Package Technology Development, Intel Corp.

POWER TRANSFORMER E154515

Abstract: scheme e131175 sampo E159656 foxconn e253117 e131175 XEPEX E140166 sony bando power transformer power transformer e190246 tamradio transformer e199273
Contextual Info: 10129 LIST OF COMPANY IDENTIFICATIONS The List of Company Identifications contains the trade names, trademarks, or other designations authorized for use in lieu of these Company names. ‘‘ ’’ — 2CS SRL ’’ — ACT CO LTD ‘‘ ‘‘ ’’ — 3E HK LTD

Contextual Info: PIN Diode Chips Supplied on Film Frame Features • Designed for High Performance Switch and Attenuator Applications ■ Preferred Device for Module Applications ■ PIN Diodes Supplied 100% Tested, Sawn, Mounted on Film Frame ■ Low Cost Description The SMP series of PIN diodes are designed for high

Contextual Info: DATA SHEET Schottky Diode Quad Mixer Chips Supplied on Film Frame Features 2 Designed for high performance double balanced mixers ● Three barrier heights available ● Schottky diodes supplied 100% tested, sawn, mounted on film frame ● Low cost 2 ● 1

TQ32

Abstract: ablestik amkor amkor cabga Nitto ASE LQFP 208 CABGA 6x6
Contextual Info: Atmel Lead Pb -Free Plan Jul-00 Subcontractor Oct-00 Jan-01 Apr-01 Jul-01 Package AIC(Malaysia) 32 lead TSOP AIC(Malaysia) 8 lead SOIC Amkor(Korea) 81 ball CABGA Amkor(Korea) 44 lead TQFP Amkor(Phillip.) 5 X 8 LAP (replaces 8 lead SOIC) Amkor(Korea) 64 lead 10 X 10 LQFP*

Contextual Info: 08/23/2004 RELIABILITY REPORT FOR DS80C310, D2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com