OF FTSH Search Results

Contextual Info: FOR FTSH SURFACE REV. EP A -NO. OF POS. X .050 + .156 + . [1.27 + 3.96 + .20] .078 + .003 [1.98 + . OF POS. X .050 - .0500 M .2 7 - 1. S. .058 .0290 [.74] DIA NON PLA7ED 7HRU HOLE .029 .050 MISC\MKTG\FOOTPRNT FTSH —EP 810 PROGRESS BLVD. PLOT SCALE: 1 =

TMS320C80

Abstract: VME64 FT-C80-PCI intel I860 processor
Contextual Info: SHARC Technology Systems from TEL: 603-891-2750 http://www.alacron.com FT-SHARC-PCI, FT-SHARC-VME and FT-SHARC-DC The FT-SHARC-PCI, FT-SHARC-VME, and FTSHARC-DC are member’s of Alacron's family of high performance computing subsystems based on Analog Device's ADI-2106x SHARC Super Harvard Architecture

Contextual Info: FTSH-1XX-XX-XXX-DV-XXX REVISION EC NOTES: No OF POSITIONS 1. C REPRESENTS A CRITICAL DIMENSION. -02 THRU -50 2. PARTS MAY BE CUT TO POSITION. 3. MAXIMUM CUT FLASH: .010 [0.25] PER ROW 4. MINIMUM PUSHOUT FORCE: 1.0 LB. LEAD STYLE 5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.

Contextual Info: FTSH-1XX-XX-XXX-DV-XXX REVISION EE NOTES: No OF POSITIONS 1. C REPRESENTS A CRITICAL DIMENSION. -02 THRU -50 2. PARTS MAY BE CUT TO POSITION. 3. MAXIMUM CUT FLASH: .010 [0.25] PER ROW 4. MINIMUM PUSHOUT FORCE: 1.0 LB. LEAD STYLE 5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.

Contextual Info: FTSH-1XX-XX-XXX-DV-XXX REVISION EC NOTES: No OF POSITIONS 1. C REPRESENTS A CRITICAL DIMENSION. -02 THRU -50 2. PARTS MAY BE CUT TO POSITION. PER ROW 3. MAXIMUM CUT FLASH: .010 [0.25] 4. MINIMUM PUSHOUT FORCE: 1.0 LB. LEAD STYLE 5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.

PT-FTSH007-DV-K-P

Abstract: PT-FTSH004-DV-EX-A-P-M
Contextual Info: FTSH-1XX-XX-XXX-DV-XXX REVISION EG NOTES: No OF POSITIONS 1. C REPRESENTS A CRITICAL DIMENSION. -02 THRU -50 2. PARTS MAY BE CUT TO POSITION. 3. MAXIMUM CUT FLASH: .010 [0.25] PER ROW 4. MINIMUM PUSHOUT FORCE: 1.0 LB. LEAD STYLE 5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.

PT-FTSH006-DV-EJC-K-P

Contextual Info: FTSH-1XX-XX-XXX-DV-XXX REVISION DZ NOTES: No OF POSITIONS 1. C REPRESENTS A CRITICAL DIMENSION. -02 THRU -50 2. PARTS MAY BE CUT TO POSITION. 3. MAXIMUM CUT FLASH: .010 [0.25] PER ROW 4. MINIMUM PUSHOUT FORCE: 1.0 LB. LEAD STYLE 5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.

Contextual Info: FTSH-1XX-XX-XXX-DV-XXX REVISION DY NOTES: No OF POSITIONS 1. C REPRESENTS A CRITICAL DIMENSION. -02 THRU -50 2. PARTS MAY BE CUT TO POSITION. 3. MAXIMUM CUT FLASH: .010 [0.25] PER ROW 4. MINIMUM PUSHOUT FORCE: 1.0 LB. LEAD STYLE 5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.

PT-FTSH002-DV-A-P-M

Abstract: PT-FTSH007-DV-K-P
Contextual Info: FTSH-1XX-XX-XXX-DV-XXX REVISION EH NOTES: No OF POSITIONS 1. C REPRESENTS A CRITICAL DIMENSION. -02 THRU -50 2. PARTS MAY BE CUT TO POSITION. 3. MAXIMUM CUT FLASH: .010 [0.25] PER ROW 4. MINIMUM PUSHOUT FORCE: 1.0 LB. LEAD STYLE 5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.

Contextual Info: FTSH-1XX-XX-XXX-DV-XXX REVISION EB NOTES: No OF POSITIONS 1. C REPRESENTS A CRITICAL DIMENSION. -02 THRU -50 2. PARTS MAY BE CUT TO POSITION. 3. MAXIMUM CUT FLASH: .010 [0.25] PER ROW 4. MINIMUM PUSHOUT FORCE: 1.0 LB. LEAD STYLE 5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.

Contextual Info: FTSH-1XX-XX-XXX-DV-XXX REVISION EI NOTES: No OF POSITIONS 1. C REPRESENTS A CRITICAL DIMENSION. -02 THRU -50 2. PARTS MAY BE CUT TO POSITION. 3. MAXIMUM CUT FLASH: .010 [0.25] PER ROW 4. MINIMUM PUSHOUT FORCE: 1.0 LB. LEAD STYLE 5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.

Contextual Info: FTSH-1XX-XX-XXX-DV-XXX REVISION EF NOTES: No OF POSITIONS 1. C REPRESENTS A CRITICAL DIMENSION. -02 THRU -50 2. PARTS MAY BE CUT TO POSITION. 3. MAXIMUM CUT FLASH: .010 [0.25] PER ROW 4. MINIMUM PUSHOUT FORCE: 1.0 LB. LEAD STYLE 5. MEASURED AT BEND RADIUS, NOT AT END OF PIN.

Contextual Info: FTSH REV. EL A NO OF POSITIONS X .0 5 0 + .1 5 3 [5.89] OF POSITIONS X .0500) - .0500 .0 5 8 -Q. I .0 5 0 .0 6 8 + - .0290 L-74J DIA NON PLATED THRU [1 .73 + HOLE 003 000 .00 .029 MISC\MKTG\FOOTPRNT C LP—FTSH 810 PROGRESS BLVD. PLOT SCALE: 1 = .1 PHONE (8 1 2 )

Y000

Contextual Info: RECOMMENDED REV. C 095 .050 [1.27] TYP P.C. B OARD L A Y O U T ROR RTSH- DH NO. OF POS x .050 - .100 2.54 03g+-003 r g g + . 0 7 6 'u o y-.000 L - a a x .000 —A OPTION 1 .070 1.78 TYP .050 [.70] (TYP) No OF POS. x .050 050 llSC\MKTG\FOOTPRNT FTSH -D H

Contextual Info: RECOM MEN DED REV. P.C. BOARD L A Y O U T EOR RTSH SUR RAO E M O U N T DOUBUE D OF POS .050 x £ 02 110 .270 01 S T A K E D OR M O F D E D A L I G N M E N T FIN OPTION 03 .038 + .029 .050 .003 .000 .965+' 0 0 - . OF POS. MISC\MKTG\FOOTPRNT FTSH -D V 810 PROGRESS BLVD.

Contextual Info: AN698 PCB DESIGN WITH AN EMBER EM35 X Formerly document 120-5060-000 Silicon Labs provides a ZigBee product designer a number of paths towards the successful design of a ZigBeecompliant solution based upon Silicon Labs’ EM300 Family of System on Chip (SoC) platforms. The lowest risk

EIA364

Abstract: EIA-364
Contextual Info: JUNE 30,1997 TEST REPORT #97236 QUALIFICATION TESTING FLE/FTSH SAMTEC CORPORATION APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was

ld12 st

Abstract: LD12 Regulator 20 pin diagram of zigbee STML75 D0805 R0805 10K LIR2430 SM671 R0805 BATERY protection
Contextual Info: UM0458 User manual STEVAL-IFS009V1 extension for SN250 network processor Introduction This user manual describes the STEVAL-IFS009V1 ZigBee extension hardware. It includes a block diagram, schematics of the extension, and a bill of material and assembly

R14 P1F

Abstract: toshiba MLC nand flash SLC nand hamming code 512 bytes ST M240 pj3d toshiba toggle NAND
Contextual Info: TOSHIBA Original CMOS 32-Bit Microcontroller TLCS-900/H1 Series TMP92CZ26AXBG Semiconductor Company Preface Thank you very much for making use of Toshiba microcomputer LSIs. Before use this LSI, refer the section, “Points of Note and Restrictions”. TMP92CZ26A

R14 P1F

Abstract: N-333 PP7F 1BE3 P53 transistor A1-U1-U17-A17 3LH30 zz12
Contextual Info: TOSHIBA Original CMOS 32-Bit Microcontroller TLCS-900/H1 Series TMP92CF26AXBG Semiconductor Company Preface Thank you very much for making use of Toshiba microcomputer LSIs. Before use this LSI, refer the section, “Points of Note and Restrictions”. TMP92CF26A

TWR-K40X256

Abstract: TWR-K60N512 AN3863 FTSH-105-01-L-DV-K ftsh-105-01-l-dv capacitive touch sensor pcb guideline FTSH-110-01-L-DV KINETIS512 AN3934 LPT I2C
Contextual Info: Freescale Semiconductor Users Guide KQRUG Rev. 0, 11/2010 Kinetis Peripheral Module Quick Reference A Compilation of Demonstration Software for Kinetis Modules This collection of code examples, useful tips, and quick reference material has been created to help you speed the

PIN DIAGRAM OF ZIGBEE

Abstract: BLOCK DIAGRAM OF ZIGBEE R0805 10K pcb layout of zigbee 20 pin diagram of zigbee LD24 LD25 LIS302DL SN260 SPZB260
Contextual Info: UM0456 User manual STEVAL-IFS010V1 STR9 ZigBee demonstration board for SN260 network processor Introduction This user manual describes the STEVAL-IFS010V1 STR9 ZigBee® demonstration board hardware. As well as the block diagram and schematics of the demonstration board, a bill of

FOLC-120-02-S-Q

Contextual Info: DECEMBER 22,1997 TEST REPORT #97676 VOLTAGE RATING SAMTEC APPROVED BY: MAX PEEL PRESIDENT AND DIRECTOR OF ADVANCED RESEARCH CONTECH RESEARCH, INC. Contech Research CERTIFICATION This is to certify that the evaluation described herein was designed and executed by personnel of Contech Research, Inc.

Contextual Info: REVISION ER FTSH-1XX-XX-XXX-DV-XXX NOTES: 1. C REPRESENTS A CRITICAL DIMENSION. No OF POSITIONS 2. PARTS MAY BE CUT TO POSITION. -02 THRU -50 3. MAXIMUM CUT FLASH: .015[0.38], PER ROW LOOSE FLASH MUST BE REMOVED. 4. MINIMUM PUSHOUT FORCE: 1.0 LB. LEAD STYLE