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OPD3030 Datasheets Context Search

Catalog Datasheet	Type	Document Tags	PDF
Contextual Info: OPD3030 Silicon PIN Photo Diode HIGH SPEED SENSITIVITY 1. Structure 1.1 Chip Size : 3.00mm X 3.00mm 1.2 Chip thickness : 400 20um 1.3 Metallization : Top - Al, Bottom - Au 1.4 Passivation : Silicon Oxide 1.5 Bonding Pad Size - Anode top : 160um X 160um 1.6 Active Area : 2.86mm X 2.86mm	Original	OPD3030 160um 160um 000Lux	PDF
OPD3030 Abstract: ir10 Contextual Info: OPD3030 Silicon PIN Photo Diode HIGH SPEED SENSITIVITY unit : ㎛ 1. Structure 1.1 Chip Size : 3.00mm X 3.00mm 1.2 Chip thickness : 400±20um 1.3 Metallization : Top - Al, Bottom - Au 1.4 Passivation : Silicon Oxide 1.5 Bonding Pad Size - Anode top : 160um X 160um	Original	OPD3030 160um 160um 000Lux OPD3030 ir10	PDF

Catalog Datasheet

Type

Document Tags

PDF

Contextual Info: OPD3030 Silicon PIN Photo Diode HIGH SPEED SENSITIVITY 1. Structure 1.1 Chip Size : 3.00mm X 3.00mm 1.2 Chip thickness : 400 20um 1.3 Metallization : Top - Al, Bottom - Au 1.4 Passivation : Silicon Oxide 1.5 Bonding Pad Size - Anode top : 160um X 160um 1.6 Active Area : 2.86mm X 2.86mm

Original

OPD3030 160um 160um 000Lux

PDF

OPD3030

Abstract: ir10
Contextual Info: OPD3030 Silicon PIN Photo Diode HIGH SPEED SENSITIVITY unit : ㎛ 1. Structure 1.1 Chip Size : 3.00mm X 3.00mm 1.2 Chip thickness : 400±20um 1.3 Metallization : Top - Al, Bottom - Au 1.4 Passivation : Silicon Oxide 1.5 Bonding Pad Size - Anode top : 160um X 160um

Original

OPD3030 160um 160um 000Lux OPD3030 ir10

PDF