OPTO NAND Search Results

ASM3161

Abstract: tcon oz9950 "LED Driver" HIMAX asm3166 T-con hx8819 CG7002 OZ9* inverter controller digital photo frame
Contextual Info: Ceramate Digital Photo Frame Block SDRAM NAND Flash Unity OPTO Himax IRM MIM3388 SERIES MIM538B SERIES T-CON HX8817/8834-A ASMedia Bluetooth ESD Protection T-CON HX8819/8834-A CDA12T1G CPT Digital Panel Himax Analogic e-Conn Card Reader Analog Panel Himax

ARM9

Abstract: Flash LINK JTAG driver soc toshiba TOSHIBA flash memory -NAND Electronics Workbench software free download Toshiba NOR FLASH JTAG via rs232 BMSKTOPAS910 Toshiba Europe NAND Flash Memory jtag cortex schematic
Contextual Info: BMSKTOPAS910, Microcontrollers, Products, Toshiba Electronic Components Page 1 of 3 Main Menu Home Page Applications Products ASIC & Foundry Displays & Devices Driver LSI Memory Microcontroller Microprocessor Opto Power SoC Home, Microcontroller, BMSKTOPAS910

HX8819

Abstract: Himax TCON HA1202 HX8817 himax tcon HIMAX hx8819 CERAMATE TECHNICAL T-CON 8834
Contextual Info: Ceramate Digital Photo Frame Block 4Mb SDRAM 8Mb NAND Flash Unity OPTO Himax IRM MIM3388 SERIES MIM538B SERIES T-CON HX8817/8834 Bluetooth HAIRERIC or NOR Flash CPT Analog Panel Himax CPT T-CON HX8819/8824/8834 Digital Panel USB I/O ESD Protection CDA12T1G

IC 74ls244 latch

Contextual Info: MME D SIEMENS CMPNTSn OPTO S I E M E M B SB3b3Sb 000553b 5 HISIEX “T - 4 1 - •an HIGH EFFICIENCY RED S GREEN YELLOW IPD2545 IPD2547 IPD2548 .25" 4 Character 5x7 Dot Matrix, X-Y Stackable Industrial Alphanumeric Programmable Display with Built-in CMOS Control Functions

CTX03 15256

Abstract: opto nand MAX5021EUA MAX5021 MAX5021EPA MAX5021EUT MAX5022 optocoupler NAND OPTOCOUPLER dc 72VDC
Contextual Info: 19-2066; Rev 1; 9/01 ABLE KIT AVAIL N IO T A U L EVA Current-Mode PWM Controllers for Isolated Power Supplies Features ♦ Available in a Tiny 6-Pin SOT23 Package An undervoltage lockout UVLO circuit with large hysteresis coupled with low startup and operating current

CTX03 15256

Abstract: CTX03 MAX5021EPA MAX5021EUA MAX5021EUT MAX5022 MAX5021 optO NAND
Contextual Info: 19-2066; Rev 1; 9/01 ILABLE N KIT AVA IO T A U L A V E Current-Mode PWM Controllers for Isolated Power Supplies Features The MAX5021/MAX5022 current-mode PWM controllers contain all the control circuitry required for the design of wide input voltage range isolated power supplies.

optocoupler NAND

Abstract: opto nand POWER optocoupler 24V 3A MAX5021 MAX5021EUA MAX5021EPA MAX5021EUT MAX5022 low side pwm drive optocoupler high side MOSFET G opto transistor specifications
Contextual Info: 19-2066; Rev 1; 9/01 ILABLE N KIT AVA IO T A U L A V E Current-Mode PWM Controllers for Isolated Power Supplies Features The MAX5021/MAX5022 current-mode PWM controllers contain all the control circuitry required for the design of wide input voltage range isolated power supplies.

MAX5021EUA

Contextual Info: 19-2066; Rev 1; 9/01 ABLE KIT AVAIL N IO T A U L EVA Current-Mode PWM Controllers for Isolated Power Supplies Features ♦ Available in a Tiny 6-Pin SOT23 Package An undervoltage lockout UVLO circuit with large hysteresis coupled with low startup and operating current

6 pin flyback transformer

Abstract: MAX5021EUA
Contextual Info: 19-2066; Rev 0; 6/01 ABLE KIT AVAIL N IO T A U L EVA Low-Power, Current-Mode PWM Controllers for Isolated Power Supplies Features ♦ Available in a Tiny 6-Pin SOT23 Package An undervoltage lockout UVLO circuit with large hysteresis coupled with low startup and operating current

Contextual Info: 0.6 µm BiCMOS Process Family XB06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular BiCMOS Technology Description The XB06 Series is X-FAB‘s 0.6 Micron BiCMOS Technology. Main target applications are RF circuits and high precision analog applications mixed with

MOS RM3

Abstract: mos rm3 data XO035 Silicon Image 1364 cmos transistor 0.35 um analog devices transistor tutorials "X-Fab" Core cell library 6E-08 opto mos application ESD "p-well" n-well"
Contextual Info: 0.35 µm CMOS Process Family XO035 MIXED-SIGNAL FOUNDRY EXPERTS 0.35 Micron Modular CMOS Technology For Fast Optical Applications Description XO035 is X-FAB’s specialized process for optoelectronic and high speed RF applications. It is especially suited for applications needing

D201O

Contextual Info: I E M E N S C M P N T S n O 4 P T O S IE M E N S 4 E D Ö E 3 b 3 2 L D G Q 4 Ô 0 3 fl S I E X MPD 2545 g r e e n MPD 2547 YELLOW MPD 2548 HIGH EFFICIENCY RED .25" 4-Character, 5x 7 Dot Matrix, X-Y Stackable, HI-REL/Military Alphanumeric Programmable Display"

MOS RM3

Contextual Info: 0.35 µm CMOS Process Family XO035 MIXED-SIGNAL FOUNDRY EXPERTS 0.35 Micron Modular CMOS Technology For Fast Optical Applications Description XO035 is X-FAB’s specialized process for optoelectronic and high speed RF applications. It is especially suited for applications needing

nmos transistor 0.35 um

Abstract: npn pnp rf transistor bipolar cross reference l24c using a zener diode as a varicap NMOS depletion pspice model bsim3 model for 0.18 micron technology for hspice bsim3 model MOS RM3 QS 100 NPN Transistor analog devices transistor tutorials
Contextual Info: 0.6 µm BiCMOS Process Family XHB06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular HV BCD Technology Description The XHB06 is X-FAB's 0.6 Micron High-Voltage Bipolar CMOS DMOS BCD Technology, optimized for applications requiring operating voltages of 5V to 30V. Main target applications are power

0.6 um cmos process

Abstract: bsim3 Trench MOS Schottky Rectifier MICRON POWER RESISTOR Mos BSIM3 SOI pmos 60V-20 MICRON RESISTOR Mos MOS RM3 P-Channel Depletion Mosfets
Contextual Info: 0.6 µm Process XT06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Trench Isolated SOI CMOS Technology Description The XT06 Series completes X-FAB's 0.6 Micron Modular Mixed Signal Technology. XT06 uses dielectric isolation on SOI wafers. This allows unrestricted 60 V high and low side operation

RJ63YC100

Abstract: LR36B15 LR36b03 LR38627 RJ2321 LR388H3 IR2E67M pq1cx41h2zpq RJ2341 sharp RJ63YC100
Contextual Info: CONTENTS Sharp Efforts Towards a Green Society . 2 Developing Devices with High Environmental Performance. 4 Raising the Level of Environmental Performance in Factories . 5 TFT LCD 6 LSI REG PACKAGES 32 CSP Chip Size Package .

CMOS

Abstract: hv 102 mos fet transistor varactor diode model in ADS bsim3 ADS varactor diode 0.18 micron 1.8V pspice model BSIM3V3 bsim3 model bsim3 model for 0.18 micron technology for hspice N-Channel jfet 100V depletion
Contextual Info: 0.6 m CMOS Process XC06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Mixed Signal Technology Description Key Features The XC06 Series completes X-FAB‘s 0.6 Micron Modular Mixed Signal Technology with embedded Non Volatile Memory and High Voltage options.

LR36B03

Abstract: LR35504 smoke alarm ic 555 PCB layout LQ080Y5DW30 LQ050T5DG01 LK400d3 LQ080Y5DW01 LQ080Y5DE30 453 8pin opto SHARP BS2F7VZ7395
Contextual Info: CONTENTS Sharp Efforts Towards a Green Society . 2 TFT OPTOELECTRONICS LCD Modules . 8 LSI REG RF Analog CMOS IMAGE SENSORS CMOS Camera Modules Road Map . 13

XH035

Abstract: mos rm3 data nmos transistor 0.35 um MOS RM3 "X-Fab" Core cell library bsim3v3 jfet wn 428 PHVC polysilicon resistor bsim3
Contextual Info: 0.35 µm CMOS Process Family XH035 MIXED-SIGNAL FOUNDRY EXPERTS 0.35 Micron Modular Analog Mixed Signal Technology with RF capability and HV Extensions Description The XH035 series is X-FAB’s 0.35-micron Modular RF capable Mixed Signal Technology. Main target

1791d-8b8p

Abstract: 1791D-16BO 1791D-16B0 1791D-4B4P 1791D-8V8P 1791D-4CMCBL 1791D-IN001A-EN-P Allen-Bradley 1485 DeviceNet cable 1791D-0B8P gv300
Contextual Info: Technical Data CompactBlock I/O for DeviceNet 1791D The 1791D CompactBlock I/O modules contain I/O circuits, a built-in power supply, and a built-in DeviceNet I/O adapter. CompactBlock I/O modules are ideal for applications restricted by space limitations

spice model Tunnel diode

Abstract: dpsN TUNNEL DIODE spice model
Contextual Info: 0.6 µm Process XT06 MIXED-SIGNAL FOUNDRY EXPERTS 0.6 Micron Modular Trench Isolated SOI CMOS Technology Description The XT06 Series completes X-FAB's 0.6 Micron Modular Mixed Signal Technology. XT06 uses dielectric isolation on SOI wafers. This allows unrestricted 60 V high and low side operation

CMOS spice model

Abstract: MOS RM3 Spice model inductor BSIM3v3.2 XH035 XH035 library w10 jfet mos rm3 data PMOS "X-Fab" Core cell library
Contextual Info: 0.35 µm CMOS Process Family XH035 MIXED-SIGNAL FOUNDRY EXPERTS 0.35 Micron Modular Analog Mixed Signal Technology with RF capability and HV Extensions Description The XH035 series is X-FAB’s 0.35-micron Modular RF capable Mixed Signal Technology. Main target

DIGITAL IC TESTER

Abstract: ic tester LinearMaster ttl IC TESTER
Contextual Info: Analogue and Digital Handheld IC Testing State of the Art Technology Very large scale integration allows advanced functionality and ease of use to be combined in the Compact Range’s hand-held, battery operated units. The 2 line x 16 character dot matrix LCD shows

HP 2602

Abstract: A 2631 optocoupler 101J 74S140 E55361 HCPL-2602 HCPL-2612 RS-423 MK SYSTEM PIN PHOTO DIODE optocoupler NAND
Contextual Info: I'HM P A C K A R D Wha% HEW LETT t High CMR Line Receiver Optocoupler Technical Data HCPL-2602 HCPL-2612 Features • Internal Shield for High Common Mode Rejection CMR HCPL-2602: 10,000 V/ns at VCM = 50 V (Typical) HCPL-2612:15,000 V/ns at VCM = 300 V (Typical)