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    OUTLINE OF THE HEAT SINK FOR JEDEC Search Results

    OUTLINE OF THE HEAT SINK FOR JEDEC Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ221KN4AE01J
    Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ102MA4B
    Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ332MB4B
    Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GCM31CD70J226KE02L
    Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    GRM022C81C682KE01L
    Murata Manufacturing Co Ltd Chip Multilayer Ceramic Capacitors for General Purpose Visit Murata Manufacturing Co Ltd

    OUTLINE OF THE HEAT SINK FOR JEDEC Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    smd transistor M7A

    Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
    Contextual Info: CONTENTS 1. STANDARDIZATION OF PACKAGES 1.1 EIAJ Standards 1.2 JEDEC Standards 1.3 IEC Standards 2. NAME'S OF NEC'S PACKAGES 3. PACKAGE CODES BY EIAJ 3.1 Construction of package code 4. DIMENSION SYMBOL AND EXAMPLE DIMENSIONS 4.1 Example of dimensions of packages


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    PD41265L-12-E1 PD41256L PD23C32000AGX-$ PD23C32000A smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747 PDF

    MO-166

    Abstract: powerso-20 and pcb footprint POWERSO20 MULTIWATT15 heat sink solder voids to263 TDA7350 ppt on ic fr4 metal slug D94AN008 microelectronics ppt
    Contextual Info: APPLICATION NOTE A New High Power IC Surface Mount Package: PowerSO-20 Power IC Packaging from Insertion to Surface Mounting by P. Casati and C. Cognetti A new, high power IC surface mount package family is introduced in this note. It is called PowerSO family and has the Jedec registration


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    PowerSO-20TM MO-166. PowerSO-20 MO-166 MO-166 powerso-20 and pcb footprint POWERSO20 MULTIWATT15 heat sink solder voids to263 TDA7350 ppt on ic fr4 metal slug D94AN008 microelectronics ppt PDF

    78L05 equivalent

    Abstract: TO-92 78L05 voltage regulator pin configuration 78l12 transistor 78L12A 78l02ac 12QHz transistor 78L15a 78L06C 78L05C 78L05A
    Contextual Info: FEATURES ABSOLUTE MAXIMUM RATINGS • OUTPUT CURRENT UP TO 100mA . NO EXTERNAL COMPONENTS • INTERNAL THERMAL OVERLOAD PRO­ TECTION . INTERNAL SHORT CIRCUIT CURRENT LIMITING • AVAILABLE IN JEDEC TO-92 ANO LOW PROFILE TO-39 PACKAGES . OUTPUT VOLTAGES OF 2.6V, 5V, 6.2V,


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    100mA 78L00-AC) 78L00C) 78L05 equivalent TO-92 78L05 voltage regulator pin configuration 78l12 transistor 78L12A 78l02ac 12QHz transistor 78L15a 78L06C 78L05C 78L05A PDF

    HI-8592

    Abstract: outline of the heat sink for JEDEC HI-3584
    Contextual Info: HI-8592, HI-8593, HI-8594 February, 2011 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


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    HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 whi03 outline of the heat sink for JEDEC HI-3584 PDF

    Contextual Info: HI-8592, HI-8593, HI-8594 June, 2010 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


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    HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 PDF

    arinc 429 serial transmitter

    Abstract: HI-8592 HI-8593PS AN-300 HI-3584 HI-8570 HI-8571 SOIC-8 8593 8594C
    Contextual Info: HI-8592, HI-8593, HI-8594 October, 2010 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


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    HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 ver76) arinc 429 serial transmitter HI-8593PS AN-300 HI-3584 HI-8570 HI-8571 SOIC-8 8593 8594C PDF

    PQFP 132 PACKAGE DIMENSION intel

    Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
    Contextual Info: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on


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    HI-8592

    Abstract: HI-8593PS TA 1753 T INVERTER CIRCUITS DS8592 AN-300 arinc 429 serial transmitter HI-3584 HI-8570 HI-8571 HI-8592P
    Contextual Info: HI-8592, HI-8593, HI-8594 July, 2010 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


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    HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 versio76) HI-8593PS TA 1753 T INVERTER CIRCUITS DS8592 AN-300 arinc 429 serial transmitter HI-3584 HI-8570 HI-8571 HI-8592P PDF

    A7647

    Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
    Contextual Info: 13 Pinned Packaging 13.1 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package


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    124 008r

    Abstract: B13W
    Contextual Info: HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 March 2007 ARINC 429 Differential Line Driver GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186, HI-3187 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus


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    HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 124 008r B13W PDF

    124 008r

    Abstract: B13W ESD 138C
    Contextual Info: HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 September 2007 ARINC 429 Differential Line Driver GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus specifications. In addition to being functional upgrades of Holt's HI-8382


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    HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 HI-3184, 124 008r B13W ESD 138C PDF

    k0319

    Abstract: HI-3183 HI-3185 HI-3182 HI-3184 HI-3186 HI-3188 HI-8382 HI-8383 HS-3182
    Contextual Info: HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 March 2008 ARINC 429 Differential Line Driver GENERAL DESCRIPTION The HI-3182, HI-3183, HI-3184, HI-3185, HI-3186 and HI-3188 bus interface products are silicon gate CMOS devices designed as a line driver in accordance with the ARINC 429 bus specifications. In addition to being functional upgrades of Holt's HI-8382


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    HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 HI-3184, k0319 HI-3183 HI-3185 HI-3182 HI-3184 HI-3186 HI-3188 HI-8382 HI-8383 HS-3182 PDF

    Contextual Info: u OM9022SC QM9023SC OM9024SC OM9Q25SC FULL WAVE, SINGLE PHASE RECTIFIER BRIDGE IN HERMETIC MQ-078AA PACKAGE FEATURES • • • • • • • Very Low Forward Voltage Very Fast Recovery Time Hermetic 5-Pin Metal Package, JEDEC M0-078AA Outline Low Thermal Resistance


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    OM9022SC QM9023SC OM9024SC OM9Q25SC MQ-078AA M0-078AA PDF

    Holt an-300

    Abstract: 05-BOTTOM
    Contextual Info: HI-8592, HI-8593, HI-8594 November, 2012 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


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    HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 Holt an-300 05-BOTTOM PDF

    Contextual Info: OM5257SA/RA/DA OM5259SA/RA/DA OM5258SA/RA/DA OM526QSA/RA/DA HERMETIC JEDEC TO-254AA HIGH EFFICIENCY, CENTER-TAP RECTIFIER FEATURES • • • • • • • • Very Low Forward Voltage Very Fast Switching Time Hermetic Metal Package, JEDEC TO-254AA Outline


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    OM5257SA/RA/DA OM5259SA/RA/DA OM5258SA/RA/DA OM526QSA/RA/DA O-254AA MIL-S-19500, appli00° OM5257XX OM5258XX PDF

    Datasheet of IC 7432

    Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
    Contextual Info: CHAPTER 1 CHAPTER 1 1.1 PACKAGE OUTLINES AND EXPLANATION PACKAGE OUTLINES AND EXPLANATION Types of Packages 1.1.1 Classification of IC packages The following figure classifies the packages for semiconductor products: SDIP DIP QUIP SIP ZIP Through hole mount type


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    Contextual Info: OM5257SC/RC/DC OM5259SC/RC/DC OM5258SC/RC/DC OM526QSC/RC/DC HERMETIC JEDEC TO-258AA HIGH EFFICIENCY, CENTER-TAP RECTIFIER FEATURES • • • • • • • Very Low Forward Voltage Very Fast Switching Time Hermetic Metal Package, JEDEC TO-258AA Outline


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    OM5257SC/RC/DC OM5259SC/RC/DC OM5258SC/RC/DC OM526QSC/RC/DC O-258AA MIL-S-19500, OM5257XX OM5258XX OM5259XX PDF

    HI-8586 thermal

    Abstract: HI-3282 HI-6010 HI-8282 HI-8585 HI-8586 HI-8588 8586 HI-858 HI-8585PSI-N
    Contextual Info: HI-8585, HI-8586 ARINC 429 Line Driver September 2011 DESCRIPTION PIN CONFIGURATION The HI-8585 and HI-8586 are CMOS integrated circuits designed to directly drive the ARINC 429 bus in an 8-pin package. Two logic inputs control a differential voltage between the output pins producing a +10 volt One, a


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    HI-8585, HI-8586 HI-8585 HI-8586 bypass97 381min) HI-8586 thermal HI-3282 HI-6010 HI-8282 HI-8588 8586 HI-858 HI-8585PSI-N PDF

    Contextual Info: OM9Û22SC OM9Q23SC OM9024SC OM9Q25SC FULL WAVE, SINGLE PHASE RECTIFIER BRIDGE IN HERMETIC MQ-078AA PACKAGE 10 Amp, 50 To 200 Volts, 35 ns trr FEATURES • • • • • • • Very Low Forward Voltage Very Fast Recovery Time Hermetic 5-Pin Metal Package, JEDEC M0-078AA Outline


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    OM9Q23SC OM9024SC OM9Q25SC MQ-078AA M0-078AA PDF

    FBGA-484 datasheet

    Abstract: 84 FBGA outline FBGA-484 asme y14.5m MS 034 AGX52014-1 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152
    Contextual Info: 14. Package Information for Arria GX Devices AGX52014-1.0 Introduction This chapter provides package information for Altera Arria GX devices, including: • ■ ■ Device and package cross reference Thermal resistance values Package outlines Tables 14–1 shows which Altera Arria GX devices, respectively, are


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    AGX52014-1 EP1AGX20 EP1AGX35 EP1AGX50 EP1AGX90 EP1AGX60 152-pin FBGA-484 datasheet 84 FBGA outline FBGA-484 asme y14.5m MS 034 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152 PDF

    HI8585PSIN

    Abstract: HI-8586 thermal HI-3282 HI-6010 HI-8282 HI-8585 HI-8586 HI-8588 HI-8585PSI-N INTERFACE TECHNOLOGY ARINC 429
    Contextual Info: HI-8585, HI-8586 ARINC 429 Line Driver June 2009 DESCRIPTION PIN CONFIGURATION The HI-8585 and HI-8586 are CMOS integrated circuits designed to directly drive the ARINC 429 bus in an 8-pin package. Two logic inputs control a differential voltage between the output pins producing a +10 volt One, a


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    HI-8585, HI-8586 HI-8585 HI-8586 381min) HI8585PSIN HI-8586 thermal HI-3282 HI-6010 HI-8282 HI-8588 HI-8585PSI-N INTERFACE TECHNOLOGY ARINC 429 PDF

    Contextual Info: HI-8592, HI-8593, HI-8594 September, 2013 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs


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    HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 24-PIN PDF

    FBGA-484 datasheet

    Abstract: arria MS-034 AGX52014-1
    Contextual Info: Section VII. PCB Layout Guidelines This section provides information for board layout designers to successfully layout their boards forArria GX devices. These chapters contain the required PCB layout guidelines and package specifications. This section contains the following chapters:


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    152-pin FBGA-484 datasheet arria MS-034 AGX52014-1 PDF

    SF1154

    Abstract: A430 A430A A430B A437A A437B A570 A570A A570B A596
    Contextual Info: RECTIFIERS 183 750 TO 1500 AMPERES GE TYPE JEDEC SPECIFICATIONS_ . Max. average forward current FM A V (1 phase operation) (A) A437 A 596 A430 A 540 A 696 A 570 A 640 - - - - - - - 750 1000 1000 1000 1500 1500 65 126 100 - 80 80 750 -j >T c - (°C)


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    A437A A430A A570A A437B A430B A570B A437C A430C A570C A437D SF1154 A430 A570 A570B A596 PDF