OUTLINE OF THE HEAT SINK FOR JEDEC Search Results
OUTLINE OF THE HEAT SINK FOR JEDEC Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
---|---|---|---|---|---|
DE6B3KJ221KN4AE01J | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
![]() |
||
DE6E3KJ102MA4B | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
![]() |
||
DE6E3KJ332MB4B | Murata Manufacturing Co Ltd | Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive |
![]() |
||
GCM31CD70J226KE02L | Murata Manufacturing Co Ltd | Chip Multilayer Ceramic Capacitors for Automotive |
![]() |
||
GRM022C81C682KE01L | Murata Manufacturing Co Ltd | Chip Multilayer Ceramic Capacitors for General Purpose |
![]() |
OUTLINE OF THE HEAT SINK FOR JEDEC Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
---|---|---|---|
smd transistor M7A
Abstract: ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747
|
Original |
PD41265L-12-E1 PD41256L PD23C32000AGX-$ PD23C32000A smd transistor M7A ED-7304-1 smd m7a uPD4011BG ED730 EIA and EIAJ tape standards ED-7417 EIA and EIAJ standards ED-7409 IEC-Publication-747 | |
MO-166
Abstract: powerso-20 and pcb footprint POWERSO20 MULTIWATT15 heat sink solder voids to263 TDA7350 ppt on ic fr4 metal slug D94AN008 microelectronics ppt
|
Original |
PowerSO-20TM MO-166. PowerSO-20 MO-166 MO-166 powerso-20 and pcb footprint POWERSO20 MULTIWATT15 heat sink solder voids to263 TDA7350 ppt on ic fr4 metal slug D94AN008 microelectronics ppt | |
78L05 equivalent
Abstract: TO-92 78L05 voltage regulator pin configuration 78l12 transistor 78L12A 78l02ac 12QHz transistor 78L15a 78L06C 78L05C 78L05A
|
OCR Scan |
100mA 78L00-AC) 78L00C) 78L05 equivalent TO-92 78L05 voltage regulator pin configuration 78l12 transistor 78L12A 78l02ac 12QHz transistor 78L15a 78L06C 78L05C 78L05A | |
HI-8592
Abstract: outline of the heat sink for JEDEC HI-3584
|
Original |
HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 whi03 outline of the heat sink for JEDEC HI-3584 | |
Contextual Info: HI-8592, HI-8593, HI-8594 June, 2010 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs |
Original |
HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 | |
arinc 429 serial transmitter
Abstract: HI-8592 HI-8593PS AN-300 HI-3584 HI-8570 HI-8571 SOIC-8 8593 8594C
|
Original |
HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 ver76) arinc 429 serial transmitter HI-8593PS AN-300 HI-3584 HI-8570 HI-8571 SOIC-8 8593 8594C | |
PQFP 132 PACKAGE DIMENSION intel
Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
|
Original |
||
HI-8592
Abstract: HI-8593PS TA 1753 T INVERTER CIRCUITS DS8592 AN-300 arinc 429 serial transmitter HI-3584 HI-8570 HI-8571 HI-8592P
|
Original |
HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 versio76) HI-8593PS TA 1753 T INVERTER CIRCUITS DS8592 AN-300 arinc 429 serial transmitter HI-3584 HI-8570 HI-8571 HI-8592P | |
A7647
Abstract: A7647-01 A7190-01 socket 615-PIN socket s1 REFLOW FCPGA JEDEC Thin Matrix Tray outlines outline of the heat sink for Theta JC A719-0 A7646-01 BGA PACKAGE TOP MARK intel
|
Original |
||
124 008r
Abstract: B13W
|
Original |
HI-3182, HI-3183, HI-3184, HI-3185 HI-3186, HI-3187, HI-3188 124 008r B13W | |
124 008r
Abstract: B13W ESD 138C
|
Original |
HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 HI-3184, 124 008r B13W ESD 138C | |
k0319
Abstract: HI-3183 HI-3185 HI-3182 HI-3184 HI-3186 HI-3188 HI-8382 HI-8383 HS-3182
|
Original |
HI-3182, HI-3183, HI-3184 HI-3185, HI-3186, HI-3188 HI-3184, k0319 HI-3183 HI-3185 HI-3182 HI-3184 HI-3186 HI-3188 HI-8382 HI-8383 HS-3182 | |
Contextual Info: u OM9022SC QM9023SC OM9024SC OM9Q25SC FULL WAVE, SINGLE PHASE RECTIFIER BRIDGE IN HERMETIC MQ-078AA PACKAGE FEATURES • • • • • • • Very Low Forward Voltage Very Fast Recovery Time Hermetic 5-Pin Metal Package, JEDEC M0-078AA Outline Low Thermal Resistance |
OCR Scan |
OM9022SC QM9023SC OM9024SC OM9Q25SC MQ-078AA M0-078AA | |
Holt an-300
Abstract: 05-BOTTOM
|
Original |
HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 Holt an-300 05-BOTTOM | |
|
|||
Contextual Info: OM5257SA/RA/DA OM5259SA/RA/DA OM5258SA/RA/DA OM526QSA/RA/DA HERMETIC JEDEC TO-254AA HIGH EFFICIENCY, CENTER-TAP RECTIFIER FEATURES • • • • • • • • Very Low Forward Voltage Very Fast Switching Time Hermetic Metal Package, JEDEC TO-254AA Outline |
OCR Scan |
OM5257SA/RA/DA OM5259SA/RA/DA OM5258SA/RA/DA OM526QSA/RA/DA O-254AA MIL-S-19500, appli00° OM5257XX OM5258XX | |
Datasheet of IC 7432
Abstract: 7415 ic pin details data sheet IC 7432 DATASHEET OF IC 7401 7401 ic configuration IC 7409 draw pin configuration of ic 7402 INFORMATION OF IC 7424 BGA and QFP Package mounting EIA and EIAJ standards
|
Original |
||
Contextual Info: OM5257SC/RC/DC OM5259SC/RC/DC OM5258SC/RC/DC OM526QSC/RC/DC HERMETIC JEDEC TO-258AA HIGH EFFICIENCY, CENTER-TAP RECTIFIER FEATURES • • • • • • • Very Low Forward Voltage Very Fast Switching Time Hermetic Metal Package, JEDEC TO-258AA Outline |
OCR Scan |
OM5257SC/RC/DC OM5259SC/RC/DC OM5258SC/RC/DC OM526QSC/RC/DC O-258AA MIL-S-19500, OM5257XX OM5258XX OM5259XX | |
HI-8586 thermal
Abstract: HI-3282 HI-6010 HI-8282 HI-8585 HI-8586 HI-8588 8586 HI-858 HI-8585PSI-N
|
Original |
HI-8585, HI-8586 HI-8585 HI-8586 bypass97 381min) HI-8586 thermal HI-3282 HI-6010 HI-8282 HI-8588 8586 HI-858 HI-8585PSI-N | |
Contextual Info: OM9Û22SC OM9Q23SC OM9024SC OM9Q25SC FULL WAVE, SINGLE PHASE RECTIFIER BRIDGE IN HERMETIC MQ-078AA PACKAGE 10 Amp, 50 To 200 Volts, 35 ns trr FEATURES • • • • • • • Very Low Forward Voltage Very Fast Recovery Time Hermetic 5-Pin Metal Package, JEDEC M0-078AA Outline |
OCR Scan |
OM9Q23SC OM9024SC OM9Q25SC MQ-078AA M0-078AA | |
FBGA-484 datasheet
Abstract: 84 FBGA outline FBGA-484 asme y14.5m MS 034 AGX52014-1 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152
|
Original |
AGX52014-1 EP1AGX20 EP1AGX35 EP1AGX50 EP1AGX90 EP1AGX60 152-pin FBGA-484 datasheet 84 FBGA outline FBGA-484 asme y14.5m MS 034 MS-034 bt 146 FBGA PACKAGE thermal resistance FBGA1152 | |
HI8585PSIN
Abstract: HI-8586 thermal HI-3282 HI-6010 HI-8282 HI-8585 HI-8586 HI-8588 HI-8585PSI-N INTERFACE TECHNOLOGY ARINC 429
|
Original |
HI-8585, HI-8586 HI-8585 HI-8586 381min) HI8585PSIN HI-8586 thermal HI-3282 HI-6010 HI-8282 HI-8588 HI-8585PSI-N INTERFACE TECHNOLOGY ARINC 429 | |
Contextual Info: HI-8592, HI-8593, HI-8594 September, 2013 Single-Rail ARINC 429 Differential Line Driver GENERAL DESCRIPTION PIN CONFIGURATION TOP VIEW The HI-8592 bus interface product is a silicon gate CMOS device designed as a line driver in accordance with the ARINC 429 bus specifications. The part includes a negative voltage converter allowing it to operate from a single +5V supply using only two external capacitors. The part also features high-impedance outputs |
Original |
HI-8592, HI-8593, HI-8594 HI-8592 HI-8593 HI-8594 24-PIN | |
FBGA-484 datasheet
Abstract: arria MS-034 AGX52014-1
|
Original |
152-pin FBGA-484 datasheet arria MS-034 AGX52014-1 | |
SF1154
Abstract: A430 A430A A430B A437A A437B A570 A570A A570B A596
|
OCR Scan |
A437A A430A A570A A437B A430B A570B A437C A430C A570C A437D SF1154 A430 A570 A570B A596 |