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    OZ 9966 Search Results

    OZ 9966 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    101019966912A
    		Amphenol Communications Solutions Micro SD Express Sockets, Input Output Connectors, 17 Position, None Push, 1.55mm Height, 30u\\ Gold, LCP Black Visit Amphenol Communications Solutions
    67996-630
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 30 Positions, 2.54 mm (0.100in) Pitch Visit Amphenol Communications Solutions
    67996-620
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in) Pitch Visit Amphenol Communications Solutions
    67996-606LF
    		Amphenol Communications Solutions BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch Visit Amphenol Communications Solutions
    51939-966LF
    		Amphenol Communications Solutions PwrBlade®, Power Connectors, 1P 8S 1P Right Angle Header, Solder To Board Visit Amphenol Communications Solutions

    OZ 9966 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: 14-4904-18 REPLACEMENT FOR SN74LS12 DIP 14 PACKAGE FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		SN74LS12 C36000 ASTM-B16085 MIL-P-81728 QQN-290. PDF

    Contextual Info: 14-4904-18 REPLACEMENT FOR SN74LS12 DIP 14 PACKAGE FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		SN74LS12 C36000 ASTM-B16085 MIL-T-10727 MIL-P-81728 QQ-N-290. PDF

    OZ 9966

    Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. OZ 9966 PDF

    Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. PDF

    75als162

    Abstract: OZ 9966 18071
    Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. OZ 9966 18071 PDF

    Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. PDF

    Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		MC68HC11E9 C36000 ASTM-B16-00. SAEAMS-QQ-N-290. PDF

    MC68HC11E9

    Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		MC68HC11E9 C36000 ASTM-B16-85. MIL-P-81728 QQ-N-290. PDF

    Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. PDF

    sdip-29

    Abstract: amp plcc socket dsip
    Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		MC68HC11E9 C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. sdip-29 amp plcc socket dsip PDF

    Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. PDF

    Contextual Info: 1111903 24Pin SOWIC IC to 22Pin .4 CTR DIP Adapter for 75ALS162 and other IC’s FEATURES: • A cost effective means of upgrading to SOIC without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		24Pin 22Pin 75ALS162 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. PDF

    Contextual Info: ADAPTER FOR MOTOROLA MC145158-2 FROM 16 PIN SOIC DW PACKAGE TO PLCC 20 PIN PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		MC145158-2 C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. 20-301550-X0 1112610-T 1112578-T 1112610-T PDF

    Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		C36000 ASTM-B-16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. PDF

    Contextual Info: 4121-106-18-N 64 PIN .5MM TQFP TO .65MM QFP ADAPTER FEATURES: • A cost effective means of upgrading without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		4121-106-18-N C36000 ASTM-B16085 MIL-P-81728 QQN-290. PDF

    sdip-29

    Contextual Info: 1109252 52 PIN PLCC PACKAGE MOTOROLA MC68HC11E9 TO 56 PIN SDIP PACKAGE FEATURES: • Allows placing an PLCC package part on a board laid out for a shrink dip. SPECIFICATIONS: • Board material is .062 [1.58] thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		MC68HC11E9 C36000 ASTM-B16-85. MIL-T-10727 MIL-P-81728 QQ-N-290. sdip-29 PDF

    Contextual Info: ADAPTER FOR MOTOROLA MC145158-2 FROM 16 PIN SOIC DW PACKAGE TO PLCC 20 PIN PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		MC145158-2 C36000 ASTM-B-16-00. SAE-AMS-QQ-N-290. 20-301550-X0 1112610-T 1112578-T 1112610-T PDF

    Contextual Info: SSOP TO SOWIC ADAPTER FEATURES: • A cost effective means of upgrading to SSOP without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides. • Pins are Brass Alloy 360 1/2 hard per UNS C36000


    Original     		C36000 ASTM-B-16-00. SAE-AMS-QQ-N-290. PDF

    OZ 9966

    Contextual Info: 1111841-X .5MM 8 AND 10 PIN MSOP TO .3 DIP ADAPTERS FEATURES: • A cost effective means of upgrading to MSOP .5MM package SOIC. without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		1111841-X C36000 ASTM-B16085 MIL-T-10727 MIL-P-81728 QQ-N-290. OZ 9966 PDF

    Contextual Info: ADAPTER FOR MOTOROLA MC145158-2 FROM PLCC 20 PIN FN PACKAGE TO SOIC DW PACKAGE. FEATURES: • A cost effective means of upgrading to SOJ or SOIC . without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		MC145158-2 C36000 ASTM-B-16-85. MIL-P-81728 QQN-290. 20-301550-X0 1109639-T 1109901-T PDF

    OZ 9966

    Abstract: QQN-290
    Contextual Info: 1111841-X .5MM 8 AND 10 PIN MSOP TO .3 DIP ADAPTERS FEATURES: • A cost effective means of upgrading to MSOP .5MM package SOIC. without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		1111841-X C36000 ASTM-B16085 MIL-P-81728 QQN-290. OZ 9966 QQN-290 PDF

    OZ 9966

    Abstract: MC12009
    Contextual Info: 16-304633-18 20 PIN PLCC TO 16 PIN DIP ADAPTER FOR MOTOROLA MC12009 AND OTHERS FEATURES: • A cost effective means of upgrading to PLCC Package without changing your PCB layout. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper traces, both sides.


    Original     		MC12009 C36000 ASTM-B-16-85. MIL-P-81728 QQ-N-290. OZ 9966 PDF

    Aromat hb2e

    Abstract: hb2e AROMAT HB2E RELAY aromat
    Contextual Info: 08-305984-10 Adapter for Replacing Old Aromat HB2E Relay w/ SM Type TXSS FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		C36000 ASTM-B16085 MIL-P-81728 QQN-290. Aromat hb2e hb2e AROMAT HB2E RELAY aromat PDF

    hb2e

    Abstract: Aromat relay pcb layout Aromat relay hb2e AROMAT HB2E RELAY AROMAT
    Contextual Info: 08-305984-10 Adapter for Replacing Old Aromat HB2E Relay w/ SM Type TXSS FEATURES: • A cost effective means of upgrading to SOIC . without changing your PCB layout. • Available on .300 [7.62] centers. SPECIFICATIONS: • Board Material is .062 thick FR-4 with 1 oz. Copper


    Original     		C36000 ASTM-B16085 MIL-P-81728 QQN-290. hb2e Aromat relay pcb layout Aromat relay hb2e AROMAT HB2E RELAY AROMAT PDF