P-LCC-44 TRAY Search Results

SMD BOOK

Abstract: smd 842 SMD Packages TQFP Package 44 lead 20B40 P-MQFP-44-2 P-MQFP-144-1 SMD Devices smd transistor marking 26 MARKING BOOK
Contextual Info: Package Outlines Plastic Package, P-DIP-40 Plastic Dual In-Line Package 20B40 DIN 41870 T10 Plastic Package, P-LCC-28-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-44-1 (Plastic Leaded Chip Carrier) – SMD Plastic Package, P-LCC-68 (Plastic Leaded Chip Carrier) – SMD

Motorola SMD code

Abstract: PSB21525-N
Contextual Info: SIEMENS High-Level Serial Communications Controller Extended HSCX-TE PSB 21525 Version 2.1 1 CMOS Features Package Besides P-LCC-44-1 and P-MQFP-44-2, the HSCX-TE PSB 21525 is available also in P-TQFP-64-1 package. Type Ordering Code Package PSB 21525 N Q67100-H6672

schematic diagram 50 VDC POWER SUPPLY

Abstract: TL14575
Contextual Info: TL14575 Dual OP AMP/Dual Comparator GENERAL DESCRIPTION The TL 14575 includes two internally compen­ sated low power operational amplifiers plus two comparators in a single monolithic device. Operating current may be programmed by choosing the value of an external resistor. This

huawei microwave Antennas

Abstract: HUAWEi antenna IP clock* huawei Huawei MW Antenna
Contextual Info: HUAWEI MG323-B GSM LCC Module Hardware Guide Issue 04 Date 2012-07-02 Huawei Technologies Co., Ltd. provides customers with comprehensive technical support and service. For any assistance, please contact our local office or company headquarters. Huawei Technologies Co., Ltd.

tray 20 x 14

Abstract: BGA 31 x 31 tray bga trays tray bga 17 bga tray
Contextual Info: Tube and Tray Packing TUBE PACKING STANDARDS Tubes are made from clear, rigid polyvinyl chloride PVC or clear polycarbonate (PC). Tubes are dipped in antistatic solution to increase surface resistivity. Tube quantities are specified below. Table I. Tube Quantities by Package Type

CERAMIC CHIP CARRIER LCC 68 socket

Abstract: INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE LCCs 68 socket ic 7912 64 ceramic quad flatpack CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC LEADLESS CHIP CARRIER LCC 32 socket PCB footprint cqfp 132 Single Edge Contact (S.E.C.) Cartridge: 7912 pin configuration
Contextual Info: Introduction 1.1 1 Overview Of Intel Packaging Technology As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power. Today’s products can feature more than seven million transistors and device count is expected to increase to 100 million by the year 2000. With a

philips diode PH 33J

Abstract: UM61256FK-15 sem 2106 inverter diagram IDT7024L70GB um61256 UM61256ak sram um61256fk15 HIGH VOLTAGE ISOLATION DZ 2101 C5584 IDT74LVC1G07ADY
Contextual Info: QUICKSWITCH PRODUCTS HIGH-SPEED LOW POWER CMOS 10-BIT BUS SWITCHES QS3L384 QS3L2384 FEATURES/BENEFITS DESCRIPTION • • • • • • • • • The QS3L384 and QS3L2384 provide a set of ten high-speed CMOS TTL-compatible bus switches. The low ON resistance of the QS3L384 allows inputs to be connected to outputs without

UM61256FK-15

Abstract: YD 6409 philips diode PH 33J um61256 um61256ak-15 PZ 5805 PHILIPS UM6164 KM6264BLS-7 UM61256ak sram IDT8M624
Contextual Info: QUICKSWITCH PRODUCTS HIGH-SPEED CMOS QUICKSWITCH QUAD 2:1 MUX/DEMUX QS3257 QS32257 FEATURES/BENEFITS DESCRIPTION • • • • • • • • The QS3257 is a high-speed CMOS LVTTL-compatible Quad 2:1 multiplexer/demultiplexer. The QS3257 is a function and pinout compatible QuickSwitch

d021

Contextual Info: KA3032 CDP PRODUCTS 5-CH MOTOR DRIVER 48QFP-1010E The KA3032 is a m onolithic integrated circuit suitable for a 5-ch m otor d river w hich drives the tracking actuator, focus actuator, sled motor, spindle motor, and tray m otor of the CDP system . FEATURES

74 CDP

Abstract: 1010E KA3032 KSB772
Contextual Info: KA3032 CDP PRODUCTS 5-CH MOTOR DRIVER 48QFP-1010E The KA3032 is a m onolithic integrated circuit suitable for a 5-ch m otor d river w hich drives the tracking actuator, focus actuator, sled motor, spindle motor, and tray m otor of the CDP system . FEATURES

Contextual Info: SIEM EN S Device Specifications C501 10 Device Specifications 10.1 Absolute Maximum Ratings Ambient temperature under bias TA . - 40 to 85 °C Storage temperature (rstg) .- 65 °C to 150 °C

1R40

Abstract: C501
Contextual Info: Device Specifications SIEM EN S Absolute Maximum Ratings Ambient temperature under bias f A . Storage temperature ( r ST). - 40 to + 85 ‘C - 6 5 to + 150 'C Voltage on Vcc pins with respect to ground (Vss)

KA3031

Abstract: KSB772 transistor d032
Contextual Info: CDP PRODUCTS KA3031 6-CH MOTOR DRIVER The KA3031 is a monolithic integrated circuit suitable for a 6-ch motor driver which drives the tracking actuator, focus actuator, sled motor, tray motor, change motor and spindle motor of the CDP/CAR-CD systems. FEATURES

CP-52

Contextual Info: DEVICE PACKING 1 . SHIPPING CONTAINERS AND HANDLING 1 .1 SHIPPING CONTAINER FORMS Figures 1 and 2 illustrate the shipping container forms for ordinary IC devices. Within the outer corrugated cardboard carton there are one or more inner cartons. These inner carton contain

LGA 1155 Socket PIN diagram

Abstract: marking code smd fujitsu Yamaichi ic354 marking code smd semiconductor fujitsu pitch 0.4 QFP 256p SMD transistor M05 YAMAICHI ic234 smd code 38P fpq-144-0.5-03 smd p08
Contextual Info: Preface Thank you for your continuing loyalty to Fujitsu's semiconductor products. Electronic equipment is continually becoming smaller, lighter, and less expensive while also growing more advanced in terms of function and performance. As a result, applications for semiconductor devices such as IC and

TSOP 56 socket

Abstract: 64 CERAMIC LEADLESS CHIP CARRIER LCC CERAMIC LEADLESS CHIP CARRIER ic packages QFP 64 Cavity dip QFP 64 Cavity package INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE 80SM 50 mil pitch ceramic package 240817
Contextual Info: CHAPTER 1 INTRODUCTION OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex electronics designers are challenged to fully harness their computing power Today’s products can feature more than three million transistors and device count is expected to increase to one hundred million by the

TL8023

Abstract: ICL8023
Contextual Info: IR" . . :9S2 TL 8023 Triple OP AMP GENERAL DESCRIPTION FEATURES The TL 8023 includes three internally compen­ sated low power operational amplifiers in a sin­ gle 16 pin package. • Replaces ICL8023 ■ Low noise ■ Input current relatively independent of tem­

intel packaging

Abstract: CERAMIC PIN GRID ARRAY CPGA lead frame CERAMIC CHIP CARRIER LCC 68 socket INTEL 24 PIN CERAMIC DUAL-IN-LINE PACKAGE PLCC 68 intel package dimensions 68 CERAMIC LEADLESS CHIP CARRIER LCC INTEL CDIP 40 PIN INTEL PLCC 68 dimensions tape tsop Shipping Trays QFP Shipping Trays
Contextual Info: 2 1 Introduction 1/20/97 6:22 PM CH01WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 1 INTRODUCTION 1.1. OVERVIEW OF INTEL PACKAGING TECHNOLOGY As semiconductor devices become significantly more complex, electronics designers are challenged to fully harness their computing power.Today’s products can feature more than

5962-9076502MFA

Abstract: DS96F174 96F174
Contextual Info: DS96F172M/DS96F174C/DS96F174M EIA-485/EIA-422 Quad Differential Drivers General Description Features The DS96F172 and the DS96F174 are high speed quad differential line drivers designed to meet EIA-485 Standards. The DS96F172 and the DS96F174 offer improved performance due to the use of L-FAST bipolar technology. The use

LM324 PINOUT DIAGRAM

Abstract: LM124j
Contextual Info: LM124/LM224/LM324/LM2902 Low Power Quad Operational Amplifiers General Description Advantages The LM124 series consists of four independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single

TL103

Abstract: LM103 packages case to 18
Contextual Info: MAR % C ]9§2 TL103 Voltage Reference GENERAL DESCRIPTION FEATURES The TL 103 is a precision monolithic two-terminal fixed voltage reference. The TL 103 comes in volt­ ages ranging from 4.0V to 5.6V. It is available in a variety of standard packages and in die form.

LED Lamp Driver circuit diagrams

Abstract: LM324 ic LM224 spice model DS009299-2 tube 0B2 5962R9950401QCA RETS124X
Contextual Info: LM124/LM224/LM324/LM2902 Low Power Quad Operational Amplifiers General Description Advantages The LM124 series consists of four independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single

Contextual Info: LM124/LM224/LM324/LM2902 Low Power Quad Operational Amplifiers General Description Advantages The LM124 series consists of four independent, high gain, internally frequency compensated operational amplifiers which were designed specifically to operate from a single

fairchild 45g

Contextual Info: CDP PRODUCTS KA3031 6-CH MOTOR DRIVER The KA3031 is a m onolithic integrated circuit suitable for a 6-ch m otor d river w hich drives the tracking actuator, focus actuator, sled m otor, tray motor, change m otor and spindle m otor of the C D P /C A R -C D system s.