P12* RF Search Results

12N6LE

Abstract: 12n06rle 630E1
Contextual Info: RFD12N06RLE, RFD12N06RLESM, RFP12N06RLE Data Sheet October 1999 File Number 2407.5 17A, 60V, 0.071 Ohm, N-Channel, Logic Level UltraFET Power MOSFET Title FD1 06R , D12 6RL M, P12 6RL bt A, V, 71 m, Packaging Features JEDEC TO-251AA JEDEC TO-252AA SOURCE DRAIN

transistor smd 12p

Abstract: transistor 12p smd smd transistor at t21 transistor smd t21 smd transistor 12p smd transistor 2x5 B7 smd transistor BLT81 transistor ft 960 smd 12p
Contextual Info: Philips Semiconductors ^ 711Dfi5b D0b^3flg P12 BlPHIN Product specification UHF power transistor BLT81 QUICK REFERENCE DATA FEATURES RF performance at Ts < 60 °C in a common emitter test circuit note 1 . • SMD encapsulation MODE OF OPERATION f (MHz) CW class-B, narrow band

DPSD16MX16TY5

Contextual Info: 16Mx16, 7.5 - 15ns, P12, M-Densus 30A232-00 A M-Densus 256 Megabit Synchronous DRAM DPSD16MX16TY5 High Density Memory Device ADVANCED INFORMATION DESCRIPTION: The M-Densus series is a family of interchangeable memory modules. The 256 Megabit SDRAM is a member of

Contextual Info: TECHNICAL DATA SHEET BNC 50  51Z107-108N CABLE FEED THROUGH All dimensions are in mm; tolerances according to ISO 2768 m-H Interface According to IEC 60169-8, MIL-PRF-39012, CECC 22120 Documents Assembly instruction Panel Piercing 51 P12 B2 Material and plating

11W150-108

Contextual Info: TECHNICAL DATA SHEET BNC 50 Ω 51Z107-108N CABLE FEED THROUGH All dimensions are in mm; tolerances according to ISO 2768 m-H Interface According to IEC 60169-8, MIL-PRF-39012, CECC 22120 Documents Assembly instruction Panel piercing 51 P12 B2 Material and plating

PH416

Contextual Info: TCA6416 LOW-VOLTAGE 16-BIT I C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT, RESET, AND CONFIGURATION REGISTERS 2 www.ti.com SCPS153 – DECEMBER 2007 FEATURES PW PACKAGE TOP VIEW RTW PACKAGE (TOP VIEW) 1 24 VCCP 2 23 SDA SCL ADDR P17 P16 P15 P14 P13 P12

PH416

Abstract: A115-A C101 TCA6416 TCA6416ZQSR
Contextual Info: TCA6416 LOW-VOLTAGE 16-BIT I C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT, RESET, AND CONFIGURATION REGISTERS 2 www.ti.com SCPS153 – DECEMBER 2007 FEATURES PW PACKAGE TOP VIEW RTW PACKAGE (TOP VIEW) 1 24 VCCP 2 23 SDA SCL ADDR P17 P16 P15 P14 P13 P12

Contextual Info: TCA6416 LOW-VOLTAGE 16-BIT I C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT, RESET, AND CONFIGURATION REGISTERS 2 www.ti.com SCPS153 – DECEMBER 2007 FEATURES PW PACKAGE TOP VIEW RTW PACKAGE (TOP VIEW) 1 24 VCCP 2 23 SDA SCL ADDR P17 P16 P15 P14 P13 P12

Contextual Info: TCA6416 LOW-VOLTAGE 16-BIT I C AND SMBus I/O EXPANDER WITH INTERRUPT OUTPUT, RESET, AND CONFIGURATION REGISTERS 2 www.ti.com SCPS153 – DECEMBER 2007 FEATURES PW PACKAGE TOP VIEW RTW PACKAGE (TOP VIEW) 1 24 VCCP 2 23 SDA SCL ADDR P17 P16 P15 P14 P13 P12

MAX8770

Abstract: ICS954310 motherboard samsung ba41 MDB41 PC87541 QUANTA C3229 C3198 PC87541 sil3512 quanta
Contextual Info: 1 2 3 4 5 CPU Yonah/Merom 478 PIN micro FC-PGA 1 RJ9 Block Diagram P3,4 14.318MHz FSB 667 MHz(166X4) A LVDS LCD A LVDS P7 CLOCK GEN DDRII 400/533/667 Calistoga DVI M56 UNBUFFERED DDRII SODIMM CRT P11 P2 P12 945GM/PM R/G/B ICS954310 R/G/B 1466 PIN (micro FCBGA)

sharp microwave oven 250

Abstract: sharp SM5k1 SM5* sharp SM5K1 42-PIN 48-PIN SHARP SM5 00011110H 4-bit microcomputer piezo electric buzzer
Contextual Info: SM5K1 4-Bit Microcomputer Microcomputer Data Sheet FEATURES PIN CONNECTIONS • CMOS Process 42-PIN SDIP TOP VIEW • RAM Capacity – 64 x 4-bits Data RAM – 16 × 4-bits Display RAM P20 1 42 VDD P21 2 41 P11 P22 3 40 P12 • 51 Instruction Sets P23 4 39

new bright R288-2

Abstract: new bright R288 K8T800 pc101 v8 quanta CADIN12 PHKD13N03LT C540 DIODE ldtstop QUANTA GD1
Contextual Info: 5 4 3 2 1 ZI5 SYSTEM BLOCK DIAGRAM H/W MONITOR D 2'nd FAN CRT 200/266/333MHZ AMD Althon 64 P3 P3, 4 LCD/INV CONN ATI M10/M11 P19 AGP BUS INTA P13, 14, 15, P16, 17, 18 DDR DIMM SMDDR_VTERM POWER IN Battery ChargerP29,30 P12 CK-GEN North Bridge VIA K8T800 ICS950405

DPSD8MX16RY5

Contextual Info: 8Mx16, 7.5 - 15ns, P12, M-Densus 30A220-00 B M-Densus 128 Megabit Synchronous DRAM DPSD8MX16RY5 High Density Memory Device DESCRIPTION: The M-Densus series is a family of interchangeable memory modules. The 128 Megabit SDRAM is a member of this family which utilizes the new and innovative space saving TSOP stacking technology. The modules are

DPSD8MX16RKY5

Contextual Info: 8Mx16, 7.5 - 15ns, P12, M-Densus 30A220-10 B M-Densus 128 Megabit Synchronous DRAM DPSD8MX16RKY5 High Density Memory Device DESCRIPTION: The M-Densus series is a family of interchangeable memory modules. The 128 Megabit SDRAM is a member of this family which utilizes the new and innovative space saving TSOP stacking technology. The modules are

u574

Abstract: IC BL 176A IF cable 8D-FB COAXIAL CABLE 5D-2V b11g 105j 250v 2DLF MQ 303A B177D B176D
Contextual Info: •W CONTEf S in c e 1978 s 1 Reg. No. Q8718 ISO -9001: 2000 - BT" É ? Jk 100MHz 300MHz * 400MHz P3 ~ P4 800MHz N ANTENNA 1 1» P6 144/430MHZ P7 ~ P10 TWO BAND P11 ~ P12 MIC ECHO AMP P13 I EARPHONE MIC P13 ANTENNA B A S E TRANSCEIVER A C C ESSO R IES P15 ~ P16

new bright R288

Abstract: new bright R266 A102 A106 A107 C103 C109 C114 lm3931 HT1320 MD334 ddr ic a109 up2782 HD110 quanta
Contextual Info: 1 2 3 4 5 1 N01 Block Diagram Intel BANIAS/Dothan 478 PIN micro FC-BGA A A P3, 4 System bus 4x100 MHz R/G/B CRT MCH P9 Memory Control Hub LVDS SIGNAL LCD Montara-GME ( Wide XGA ) DRAM SIGNAL P12 TV SIGNAL S-Video SO-DIMM 1/2 732 PIN (micro FCBGA) P8 P5, 6, 7

ens100

Abstract: 71ra
Contextual Info: VX-DvU-X /ffeMOSFET V X -n SERIES P0 H 4 MOSFET O U T L IN E D IM E N S IO N S Case I E-pack 2SK2177 F 1 E 5 0 V X 2 6.6 ±0 2 2.55 - 0.2 500V 1A 0. 5 t 0 1 0.5 0 .6 * ° 2 U ± 0 .2 [Unit '•mm] k O i t o P12, 7 - l £ c * i i < £ S i > „ Lead type is available. S e e P. 12, 7-1

NTE7057

Abstract: 712mW
Contextual Info: NTE7057 Integrated Circuit TV SIF/AFT/RF AGC Description: The NTE7057 is an integrated circuit in a 12−Lead SIP type package designed for providing a high performance SIF for a TV. This device adopts a quasi−parallel inter−carrier detection system for good

hipotronics model 205

Abstract: thermotron sm 32 p23 343 EIA-364-13 EIA-364-20 EIA-364-21 EIA-364-31 P8P1
Contextual Info: Project Number: Tracking Code: TC0541-0853 Requested by: Brandon Harpenau Date: 10/5/2005 Part #: GRF1-J-P-XX-E-ST-TH1 Product Rev: 1 Lot #: 1 Tech: Troy Cook Part description: Gang RF Board Plug/Jack Test Start: 10/19/2005 Eng: Mark Shireman Qty to test: 63

Contextual Info: DO ATEL IN N O V A T IO N a n d E X C E L L E N C E _ BWR M O DELS Dual Output High-Reliability, 2" x 1" 7-10 Watt, DC/DC Converters It’s hard to b e a t th e co m b in a tio n o f low co st, sm all size sta n d a rd 2" x 1" x Features 0.3 75 " p a cka g e proven re lia b ility a nd o u tsta n d in g e le ctrica l p e rfo rm a n ce offe re d

sh 2089

Contextual Info: & OATEL I N N O V A T IO N a n d E X C E L L E N C E BWR MODELS Dual Output High-Reliability, 2" x 1 " 7-10 Watt, DC/DC Converters A-SERIES It's h a rd to be a t th e c o m b in a tio n o f low cost, sm a ll size sta n d a rd 2" x 1" x Features 0 .3 7 5 “ p a c k a g e p ro ve n re lia b ility a nd o u tsta n d in g e le c tric a l p e rfo rm a n c e offered

CSWM9125

Abstract: P9P11 B7765 P1C10 CONNECTOR P4 p18 connectors rf in P1A4
Contextual Info: A d v a n c e d R e l e a s e FEATURES MODEL NO. CSWM9125 800 - 4200 MHz 45 dB Isolation 15 dB Insertion Loss Switch Matrix MFD 2X .800 15.323 .294 1.588 RF IN 1 8HP FRONT PANEL WITH INJECTOR / EJECTOR LOCKING HANDLES 15.567 RF IN 2 RF IN 3 RF IN 4 14.13 MAX COMPONENT

STQ-2016

Abstract: 0603 footprint
Contextual Info: STQ-2016 Z STQ-2016(Z) 700MHz to 2500MHz Direct Quadrature Modulator 700MHz to 2500MHz DIRECT QUADRATURE MODULATOR RFMD Green, RoHS Compliant, Pb-Free (Z Part Number) Package: TSSOP, 16-Pin, 5.0mmx6.4mmx1.0mm Product Description Features RFMD’s STQ-2016 is a direct quadrature modulator targeted for use in a wide range of communications systems, including cellular/PCS, CDMA2000, UMTS, and ISM datacom. This device

EB-23

Abstract: G930 EB2-3
Contextual Info: 2 : c rft-jra 1 REVISIONS « M i ar t i part tor n a M n «r M b bv n m r iw t a t a M C iw iH lH i M I b M k r m m w ì, t M n rtgM b «rantotf to f t i i n » » W f W É lM W i In W i <M— j SVM EGN B HK3749 Release to customer 3 /2 7 /0 6 C HKXXXX Modify Housing