PACKAGE 12 Search Results

QTLP690-AG

Abstract: QTLP630C-IG QTLP630C-7 QTLP690C-Y QTLP650D-3 QTLP600C-2 PLCC-2 1210 QTLP600C-4 QTLP600C-7 QTLP600C-B
Contextual Info: Analog Discrete Interface & Logic Optoelectronics Surface Mount LED Lamps • 0603 Package • 0606 Package • Right Angle Package • 0805 Package • 1206 Package • 1210 Package • 1.8 mm Dome Lens Package • PLCC-2 Package • PLCC-4 Package • Reflector Package

PACKAGE DIMENSIONS

Contextual Info: Package Diagrams Index of Package Diagrams 100-Ball caBGA Package . 12 120-Pin PQFP Package . 12 128-Pin PQFP Package . 13 128-Pin TQFP Package . 13

16MM TAPE PACKAGE

Contextual Info: Package O rientation Feed D irection Feed D irection Typical SOIC Package Orientation 12mm, 16mm, 24mm Carrier Tape SOT-143 Package Orientation 8mm Carrier Tape Feed D irection Feed D irection SOT-23 Package Orientation 8mm Carrier Tape SOT-223 Package Orientation

SAMSUNG 834

Contextual Info: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm

pcb design 0,5 mm pitch

Abstract: PBGA 1515 D 4242 STD150 Samsung ASIC fbga 153
Contextual Info: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm

SAMSUNG 834

Abstract: pcb design 0,5 mm pitch STD130
Contextual Info: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm

D 4242

Abstract: pcb design 0,5 mm pitch Samsung 3232 STDH150 FBGA PACKAGE thermal resistance
Contextual Info: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm

pcb design 0,5 mm pitch

Abstract: SAMSUNG 834 QFP PACKAGE thermal resistance package tsop1 12 x 12 fbga thermal resistance
Contextual Info: Appendix Package Capabilities D Package Appendix D Package The most current package availability and capability can be obtained from your local Samsung Technology and Design Centers. • In-house ❏ Sub-contractor LQFP Package 0707 mm 1010 mm 1212 mm 1420 mm

R604A

Abstract: diode r207 R605A 60 diode R702 erg28 AF91-471 R205A R606A
Contextual Info: DIODE MODULES Dimensions mm ERG28-12 ERG78-12 2 in one-package R201 19.6m >•> 017" AF89-692 (AF88-456) + ERG28 4-ERG78 1 1n one-package R101 (AF91-473) 2 in one-package R204 1 in one-package R102 (AF91-471) 3 M5<10 p" 59 mm 2 in one-package R207 2 in one-package

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M15 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 48 PIN PLASTIC To Top / Package Lineup / Package Index FPT-48P-M16 48-pin plastic QFP Lead pitch 0.80 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold

Contextual Info: SMALL OUTLINE NON-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 46 PIN PLASTIC To Top / Package Lineup / Package Index LCC-46P-M02 46-pin plastic SON Lead pitch 0.50 mm Package width x package length 10.10 × 12.00 mm Sealing method Plastic mold LCC-46P-M02

TQFP 80 PACKAGE

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M15 80-pin plastic TQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold

QFP-120P

Abstract: 120-pin
Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M05 EIAJ code :∗QFP120-P-1414-1 120-pin plastic LQFP Lead pitch 0.40 mm Package width x package length 14 × 14 mm

120 M13

Abstract: FPT-120P-M13 QFP120 QFP120-P-2020-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M13 EIAJ code :∗QFP120-P-2020-1 120-pin plastic QFP Lead pitch 0.50 mm Package width x package length 20 × 20 mm Lead shape Gullwing

Contextual Info: THIN QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 100 PIN PLASTIC To Top / Package Lineup / Package Index FPT-100P-M18 100-pin plastic TQFP Lead pitch 0.40 mm Package width x package length 12 × 12 mm Lead shape Gullwing Sealing method Plastic mold

FPT-120P-M04

Abstract: QFP120
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M04 EIAJ code :∗QFP120-P-2828-4 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN CERAMIC To Top / Package Lineup / Package Index FPT-120C-C01 120-pin ceramic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing Sealing method Cerdip Length of flat

FPT-64P-M09

Abstract: fujitsu 64-Pin Plastic QFP QFP064-P-1212-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 64 PIN PLASTIC To Top / Package Lineup / Package Index FPT-64P-M09 EIAJ code :∗QFP064-P-1212-1 64-pin plastic QFP Lead pitch 0.65 mm Package width x package length 12 × 12 mm Lead shape Gullwing

FPT-120P-M03

Abstract: QFP120
Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 120 PIN PLASTIC To Top / Package Lineup / Package Index FPT-120P-M03 EIAJ code :∗QFP120-P-2828-3 120-pin plastic QFP Lead pitch 0.80 mm Package width x package length 28 × 28 mm Lead shape Gullwing

QFP080-P-1212-1

Contextual Info: LOW PROFILE SHRINK QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 80 PIN PLASTIC To Top / Package Lineup / Package Index FPT-80P-M05 EIAJ code :∗QFP080-P-1212-1 80-pin plastic LQFP Lead pitch 0.50 mm Package width x package length 12 × 12 mm

Ablebond 8380

Abstract: smema DA6523 nozzle heater X3304 Theta-JC 5th mechnical engineering date sheet alpha Resistors slide cut template DRAWING Die Attach epoxy stamping
Contextual Info: 2 12 Advanced Package Applications: Tape Carrier Package 1/17/97 9:18 AM CH12WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 12 ADVANCED PACKAGE APPLICATIONS: TAPE CARRIER PACKAGE 12.1. INTRODUCTION TO THE PACKAGE TECHNOLOGY As semiconductor devices become more complex, they are being introduced into products that

16MM TAPE PACKAGE

Contextual Info: Micrel Semiconductor Designing With LDO Regulators Package Orientation Feed Direction Feed Direction Typical SOIC Package Orientation 12mm, 16mm, 24mm Carrier Tape SOT-143 Package Orientation 8mm Carrier Tape Feed Direction Feed Direction SOT-23 Package Orientation

SSOP48W

Abstract: SSOP20N 18w sot23 transistor TSSOP16 MO-150 MO-187 MO-220 MS-013 SSOP20S 103001 for mouse
Contextual Info: Package Information Package Types The following are the package types and widths offered by Holtek. Pin Count DIP Dual In-line Package 80, 100, 128 14mm ´ 20mm 208 28mm ´ 28mm Pin Count Package Width 8, 14, 16, 18, 20 300mil 24, 28, 32, 40, 42 600mil 28, 32, 40 (Ceramic)