PACKAGE DRAWINGS Search Results

SO20 Package

Abstract: SO8 package BGA and QFP Package 44 pin plcc package drawing fg676 packages pc44 plcc how package PQ304 SOIC package
Contextual Info: Package Drawings R Package Drawings Ceramic DIP Package - DD8 0-28 R Package Drawings Plastic DIP Package - PD8 11 0-29 R Package Drawings SOIC and TSOP Packages - SO8, VO8 0-30 R Package Drawings SOIC Package - SO20 11 0-31 R Package Drawings PLCC Packages - PC20, PC28, PC44, PC68, PC84

TO111 package

Abstract: TO61 package TO63 package MOSFET F24 S06 rectifier
Contextual Info: PACKAGE OUTLINE DRAWINGS TO-18 PACKAGE TO-5 PACKAGE —seâtaao h i m TO-33 PACKAGE 0Ct9 t?s 1 tf— II i-t 4'fiC> ?y H TO-72 PACKAGE TO-3 PACKAGE MODIFIED TO-3 PACKAGE 60mil pins SE* Ft t -L SEATU 'i "01I6 02' °’6 .225 205 JO -66 PACKAGE F-24 PACKAGE

PGA 1027

Abstract: SO20 Package SO8 package BGA and QFP Package bg22 transistor CB228 PG68 PQ304 TQ100 PC44
Contextual Info:  November 13, 1997 Version 1.2 Package Drawings 10* Package Drawings Ceramic DIP Package - DD8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Plastic DIP Package - PD8 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

TSOP 1138

Abstract: BG560 CS144 CS48 PC44 PC84 SO20 VQ44 HQ10 CB228
Contextual Info: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ceramic DIP Package - DD8 11-24 February 2, 1999 (Version 1.3) R Package Drawings Plastic DIP Package - PD8 11 February 2, 1999 (Version 1.3) 11-25 R Package Drawings SOIC and TSOP Packages - SO8, VO8

CC44

Abstract: packages
Contextual Info: Package Drawings February 2, 1999 Version 1.3 11 R Package Drawings Ceramic DIP Package - DD8 11-24 February 2, 1999 (Version 1.3) R Package Drawings Plastic DIP Package - PD8 11 February 2, 1999 (Version 1.3) 11-25 R Package Drawings SOIC and TSOP Packages - SO8, VO8

PLCC18

Contextual Info: Package Information Package Information Package Drawings Page Plastic Dual–In–Line Package PDIP 8–2 Plastic J–Lead Chip Carrier (PLCC) 8–2 Plastic Small Outline Package (SOIC) 8–3 Plastic Quad Flatpack 8–4 Plastic Very–Thin Quad Flatpack*1.0mm (VQFP)

Contextual Info: Q Packaging Information QSI uses a two character package code in the part numbers of its products to indicate the package. The package code is uniform over all part numbers unless otherwise noted. The following is a table of these package codes and their corresponding package. The package outline drawings for each of these packages

oki naming format

Abstract: DIP42-P-600-2 HQFP208-P-4040-0 R400 S115 0.65mm pitch BGA PLCC DIMENTIONS oki marking 20 soj
Contextual Info: 1. PACKAGE CLASSIFICATIONS 1-5. 1 1 Package Symbols and Codes Package code The package codes given on the outline view are those specified in ED-7401-2 General Rules for Preparation of Outline Drawings if Integrated Circuits Package Name and Code) established by

reflow soldering profile BGA

Abstract: FC-5312
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

EIA-556-A

Abstract: xilinx packaging label polystyrene EIA-556A
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

ipc-sm-786A

Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

EFTEC-64

Abstract: OPQ0014
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

FG676

Abstract: PCB footprint cqfp 132 741 smd ic cb228 footprint PCB footprint cqfp 100
Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Moisture Sensitivity Tape and Reel

AUGAT DIP SOCKETS

Contextual Info: DataSource CD-ROM Q1-02 Contents Packaging and Thermal Characteristics Package Drawings Thermal Application Note Package Information Package Electrical Characterization Component Mass by Package Type Thermally Enhanced Packaging Socket Manufacturers Table 1 lists manufacturers known to offer sockets for Xilinx Package types. This summary does not

CS48

Abstract: package drawings
Contextual Info: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Chip Scale Package - CS48 10-22 June 19, 1998 (Version 1.0)

Contextual Info: Package Drawings November 13, 1997 Version 1.2 10 Package Drawings Ceramic DIP Package - DD8 10-22 November 13, 1997 (Version 1.2)

SSOP20 300 mil

Abstract: DIP20 SC603 Package Outline philips ic06
Contextual Info: INTEGRATED CIRCUITS DATA SHEET Package outline drawings January 1996 File under Integrated Circuits, IC06 Philips Semiconductors Package outline drawings INDEX PACKAGE VERSIONS DESCRIPTION PAGE DIP SOT27-1 plastic dual in-line package; 14 leads 300 mil 3

land pattern for sot109-1

Abstract: TSSOP-8 footprint and soldering sot-23 SOD87 footprint
Contextual Info: Packages Package cross reference 88 Packing methods 90 Minimized outline drawings and reflow soldering footprint 96 Package overview 86 107 87 Package cross reference Package cross reference 88 types in bold represent new products types in bold represent new products

Contextual Info: Digital Attenuator Outline Drawings .625” Gullwing Package SG4 .800” x 1.37” DIP Package (DP5) .990” x 1.99” DIP Package (DP8) - 466 - Digital Attenuator Outline Drawings .775” Sq. DIP Package (DP11) Attenuator SMA Connectorized Housing 1

TO8 package

Abstract: SM19 TO -8 package
Contextual Info: Amplifier Outline Drawings TO-8 Package T4 TO-8B Package (T8) TO-12 Package (T7) TO-39 Package (T10) .500” Fiatpack (FP4) .625”Gullwing (SG4) - 460- Amplifier Outline Drawings .450” Sq. Surface Mount (SM-3) .375” Sq. Surface Mount (SM-11) .188 j— a ( .050 db.015

package drawings

Abstract: 16pin 617
Contextual Info: General Information Package Drawings UNITRODE CORPORATION • 5 FORBES ROAD LEXINGTON. MA 02173 • TEL. 617 861-6540 TWX (710) 326-6509 • TELEX 95-1064 12-27 P R IN T E D IN U .S A General Information Package Drawings 3-Pin TO-220 T Package TO-3 Metal K Package

Contextual Info: Package Drawings Unit = Inch mm Glass DO-35 DO7 DO-15 Glass / Plastic DO-41 D-1 Package Drawings Unit = Inch (mm) DO-201AD A-405 R-1 R-6 D-2 Package Drawings Unit = Inch (mm) HVM without Terminal Ends RA / SRA Mini MELF DL-41 / MELF D-3 Package Drawings

TO8 package

Abstract: Linearizer SQ package SG412
Contextual Info: Voltage Variable and Linearized Attenuators & Linearizer Outline Drawings 5 Pin TO-8 Package T5 .625” Sq. Package (SG4) 12 Pin TO-8B Package (T9) - 468- Voltage Variable and Linearized Attenuators & Linearizer Outline Drawings SMA Connectorized Housing