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    PACKAGE OUTLINE BGA208 Search Results

    PACKAGE OUTLINE BGA208 Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TPH9R00CQH
    Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 150 V, 64 A, 0.009 Ohm@10V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH1R306PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 60 V, 100 A, 0.00134 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH9R00CQ5
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 150 V, 64 A, 0.009 Ω@10 V, High-speed diode, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPHR8504PL
    Toshiba Electronic Devices & Storage Corporation N-ch MOSFET, 40 V, 150 A, 0.00085 Ω@10 V, SOP Advance / SOP Advance(N) Visit Toshiba Electronic Devices & Storage Corporation
    TPH2R408QM
    Toshiba Electronic Devices & Storage Corporation MOSFET, N-ch, 80 V, 120 A, 0.00243 Ohm@10V, SOP Advance Visit Toshiba Electronic Devices & Storage Corporation

    PACKAGE OUTLINE BGA208 Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA208 package SOT595-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original
    BGA208 OT595-1 OT595-1 PDF

    package outline bga208

    Abstract: SOT-595 BGA208 MS-034
    Contextual Info: PDF: 2003 Jan 24 Philips Semiconductors Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 ∅v M C A B b 1/2 e e y y1 C ∅w M C T e R P N M L K J e2 H


    Original
    BGA208: OT595-1 MS-034 package outline bga208 SOT-595 BGA208 MS-034 PDF

    bga208

    Abstract: sot595 package outline bga208
    Contextual Info: PDF: 2000 Mar 07 Philips Semiconductors Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.20 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X k k e1 b e C v M B ∅w M y y1 C v M A T R e P N M L K J e1 H G F


    Original
    BGA208: OT595-1 1SOT595-1 bga208 sot595 package outline bga208 PDF

    Contextual Info: Package outline BGA208: plastic ball grid array package; 208 balls; body 17 x 17 x 1.2 mm SOT595-1 B D A D1 ball A1 index area A A2 E1 E A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C T e R P N M L K J e2 H G 1/2 e F E D C B A 1 shape optional 4x


    Original
    BGA208: OT595-1 MS-034 PDF