PACKAGE QFP 68 Search Results

Contextual Info: PA711D3-QFP Data Sheet 44 pin QFP socket/28 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring Using this adapter, the Motorola 68HC711D3 in the QFP package can be programmed on 28 pin DIP programmers. The following chart shows the connections from the QFP device

an 819

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN CERAMIC To Top / Package Lineup / Package Index FPT-68C-A01 68-pin ceramic QFP Lead pitch 1.00 mm Lead shape Gullwing Sealing method Metal seal FPT-68C-A01 68-pin ceramic QFP (FPT-68C-A01)

81901

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN CERAMIC To Top / Package Lineup / Package Index FPT-68C-A02 68-pin ceramic QFP Lead pitch 1.00 mm Lead shape Gullwing Sealing method Metal seal FPT-68C-A02 68-pin ceramic QFP (FPT-68C-A02)

Contextual Info: PA552-QFP Data Sheet 80 pin QFP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Wiring This adapter allows programming of the Philips 87C552 and 87C554 in a QFP package on 40 pin DIP programmers capable of programming the 87C51Fx. The following chart shows the connections from the QFP device

P40G-80-F-2

Abstract: P44G-80-22 P48GH-80-2A5-4
Contextual Info: e Mounting pad of QFP The nominal dimensions of QFP (quad flat package) are determined by the dimensions of the plastic body. For example, “64-pin 14 x 20 QFP” means that the body dimensions are 14 mm × 20 mm. In designing the mounting pads of this package, therefore, the body dimensions and pin dimensions

Contextual Info: 80C196KB10/83C196KB10/80C196KB12/83C196KB12 PACKAGING The 80C196KB is available in a 68-pin PLCC package, an 80-pin QFP package and a 68-pin PGA package. Contact your local sales office to determine the exact ordering code for the part desired. Package Designators: N = 68-pin PLCC, S = 80-pin QFP and A = 68-pin PGA.

PALM LCD

Abstract: KS0084 KS0083 single chip computer lcd scientific calculator
Contextual Info: LCD PRODUCTS DEVICE KS0083 PACKAGE 100 QFP or Bare chip FUNCTION Dot matrix LCD common/segment driver with 80 channel output KS0084 100 QFP or Bare chip KS0086 100 QFP or Bare Chip Dot matrix LCD common/segment driver with 80 channel output Dot Matrix LCD

Contextual Info: HDD BUS INTERFACE 1C FOR PERSONAL COMPUTERS SEMICONDUCTOR Ne w s 16 STANDARD LOGIC ICs HOUSED IN A SINGLE 68-PIN QFP PACKAGE CONTRIBUTES TO CONSIDERABLE PCB SPACE SAVING M66802FP previously 16 standard logic ICs in a single 68-pin QFP package, thus re d u c­

FPT-144P-M05

Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M05 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold Mounting height 2.45mm MAX FPT-144P-M05 144-pin plastic QFP (FPT-144P-M05)

instruction set tms320c50

Abstract: TMS320C50 TMS320C51 VSS11
Contextual Info: Chapter 2 Pinouts and Signal Descriptions Both the TMS320C50 and the TMS320C51 are available in a 132-pin Quad Flat Pack QFP package and have identical pin-to-slgnal relationship. The QFP package conforms to JEDEC specifications for electrical/electronic com­

Contextual Info: QUAD FLAT L-LEADED PACKAGE 32 PIN CERAMIC FPT-32C-C02 Lead pitch 50mil Package width x package length 450 × 550mil Lead shape Gullwing Sealing method Cerdip Length of flat portion of pins 0.80mm 32-pin ceramic QFP FPT-32C-C02 32-pin ceramic QFP (FPT-32C-C02)

QFP144

Abstract: QFP144-P-2020-1
Contextual Info: QUAD FLAT L-LEADED PACKAGE 144 PIN PLASTIC FPT-144P-M03 EIAJ code : ∗QFP144-P-2020-1 144-pin plastic QFP Lead pitch 0.50mm Package width x package length 20 × 20mm Lead shape Gullwing Sealing method Plastic mold FPT-144P-M03 144-pin plastic QFP (FPT-144P-M03)

sd3-75

Abstract: FDC37C67X FDC37C93X cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference
Contextual Info: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and

UEI 15 SP 020

Abstract: 691 OHD 3 - 115 M VMUX to3a SAA7140A SAA7140B new 60 ypf UEI 20 SP 010
Contextual Info: Philips Semiconductors Objective specification High Performance Scaler HPS CONTENTS 1 FEATURES SAA7140A; SAA7140B 14 PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 3 ORDERING INFORMATION

GP62

Abstract: GP15 126-150 GP61 GP22 GP65 gp6*5 GP10 SA10 SA12
Contextual Info: APPLICATION NOTE 6.15 FDC37C68x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C68x and the FDC37C93x. The FDC37C68x is a 128 pin QFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C68x and FDC37C93x data

footprint plcc 208

Abstract: PLASTIC QUAD FLAT PACK 160 PINS DIMENSION LXT304A LXT305A LXT307 LXT310 LXT317 LXT318 LXT325 A 3120 8 Pins ICs
Contextual Info: Fall 1998 Communication ICs Data Book Table 1: Telecom Product/Packages Product Table 1: Telecom Product/Packages Product Package Package SXT6051 208 QFP SXT6251 208 QFP SXT6282 144-Pin LQFP LXT300Z/301Z 28-Pin DIP and 28-Pin PLCC LXT304A 28-Pin DIP and 28-Pin PLCC

GP11

Contextual Info: APPLICATION NOTE 6.15 FDC37C68x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C68x and the FDC37C93x. The FDC37C68x is a 128 pin QFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C68x and FDC37C93x data

Contextual Info: HDD BUS INTERFACE 1C FOR PERSONAL COMPUTERS bSl *1111 2 16 STANDARD LOGIC ICs HOUSED IN A SINGLE 68-PIN QFP PACKAGE CONTRIBUTES TO CONSIDERABLE PCB SPACE SAVING M66802FP p re vio u sly 16 stan dard logic ICs in a sin gle 6 8 -p in QFP package, th u s re d u c ­

T02I

Abstract: HP 1121 G1 SAA7140A SAA7140B TT 2222 Horizontal Output voltage horizontal prescaling LQFP128 SAA7140 VR029 VR07 135
Contextual Info: Philips Semiconductors Objective specification SAA 7140 A; SAA 7140 B High Performance Scaler HPS CONTENTS PACKAGE OUTLINE 15 SOLDERING Introduction Reflow soldering Wave soldering QFP SO Method (QFP and SO) Repairing soldered joints 1 FEATURES 2 GENERAL DESCRIPTION

SERIRQ

Abstract: cross PD6
Contextual Info: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and FDC37C93x data sheets for more information.

icx060ak

Abstract: sdfw0xxx CCD SENSORS OPB 715 44n30
Contextual Info: PRELIMINARY KS7213 CCD TIMING GENERATOR GENERAL DESCRIPTION 80-QFP-1212 The KS7213 is a timing generator IC which generates the timing pulses necessary for color CCD image sensors. ORERING INFORMATION Device KS7213 FEATURES Package 80-QFP-1212 Operating Temperature

Contextual Info: QUAD FLAT L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 68 PIN CERAMIC FPT-68C-A02 68-pin ceramic QFP Lead pitch 1.00 mm Lead shape Gullwing Sealing method Metal seal FPT-68C-A02 68-pin ceramic QFP (FPT-68C-A02) 1.65±0.30 (.065±.012) 1.40±0.15 (.055±.006)

FPT-68C-A02

Abstract: package QFP 68
Contextual Info: QUAD FLAT L-LEADED PACKAGE 68 PIN CERAMIC FPT-68C-A02 68-pin ceramic QFP Lead pitch 1.00mm Lead shape Gullwing Sealing method Metal seal FPT-68C-A02 68-pin ceramic QFP (FPT-68C-A02) 1.65±0.30 (.065±.012) 1.40±0.15 (.055±.006) 0.41(.016)MIN 19.61±0.25

Contextual Info: PA711D3-QD Data Sheet 44 pin QFP socket/40 pin DIP 0.6” plug Supported Device/Footprints Adapter Construction Using this adapter, the Motorola 68HC711D3 in the QFP package can be programmed on 40 pin DIP programmers. The adapter is made up of 3 sub-assemblies. They assemble via