PACKAGE TRAY OUTLINE Search Results

Kostat tray

Abstract: KS-8308 CAMTEX Kostat DAEWON tray 48 DAEWON tray drawing JEDEC Kostat CERAMIC PIN GRID ARRAY CPGA AMD daewon D-12G-56LD-A13
Contextual Info: u Chapter 7 Trays CHAPTER 7 TRAYS Introduction Design and Materials Device Count per Tray and Box Tray Suppliers per Package Type Tray Dimensions Packages and Packing Publication Revision A 3/1/03 7-1 u Chapter 7 Trays INTRODUCTION Trays are used instead of tubes to protect higher

15d060

Abstract: E1000S G100D 1000rr 15D-060
Contextual Info: FUJI IGBT & FWD 600 V 15 A 1MB 15D-060 Fuji Discrete Package IGBT Outline Drawing • Features >Square RBSOA Saturation Voltage <Less Total Pow er Dissipation >M inim ized Internal S tray Inductance > Low I Applications > High Pow er Switching M otor Controls

Contextual Info: 31 — 7 0 0 4 0 — 100T NDTES: REVISIONS DRAWING NO. 3. 4. MATERIALS DF CONSTRUCTION; BODY 8« RETAINING RING = BRASS, NICKEL PLATED. CONTACT = BERRYLLIUM COPPER, GOLD PLATED. INSULATDR = TFE, FLUORCARBON. PACKAGE THIS CONNECTQR IN ANTI-STATIC TRAYS, 30 PIECES PER TRAY,

26000M

Contextual Info: VF Type Voltage Controlled Crystal Oscillator RoHS Compliant Optional FEATURE 1.Typical 20.4 x 12.8 x 7.8mm, standard package & 14-Pin dual in line. 2.Pulling range: ±150ppm max. 3.Aging: ±1ppm/year. 4.TTL/ CMOS output. 5.Packing: 25 pcs per Tube; 50pcs per Tray.

10.000000MHZ

Contextual Info: VH Type Voltage Controlled Crystal Oscillator RoHS Compliant Optional FEATURE 1.Typical 12.8 x 12.8 x 5.0mm, standard package & 8-Pin dual in line. 2.Pulling range: ±150ppm max. 3.Aging: ±1ppm/year. 4.TTL/ CMOS output. 5. Packing: 40 pcs per Tube; 50pcs per Tray.

Contextual Info: MCC Micro Commercial Components THROUGH HOLE - AXIAL LEADED Through Hole Package Quantity Case Style Box/Bag Qty Bulk Tube Qty Available Packaging pcs 13” Tape & Reel Tray Qty Qty 5000 Ammo Pack Qty A-405 DB-1 2500 50 DO-15 500 4000 3000 DO-201AD 500 1200

Marking DB1. SOT-143

Abstract: ST191 sot-23 MARKING CODE 54 sot-89 marking A5 MP5050 GBJ 1005 marking code 604 SOT23
Contextual Info: MCC Micro Commercial Components THROUGH HOLE - AXIAL LEADED Through Hole Package Quantity Case Style Box/Bag Qty Bulk Tube Qty Available Packaging pcs 13” Tape & Reel Tray Qty Qty 5000 Ammo Pack Qty A-405 DB-1 2500 50 DO-15 500 4000 3000 DO-201AD 500 1200

LY621024PL-70LL

Abstract: LY621024PL
Contextual Info:  LY621024 128K X 8 BIT LOW POWER CMOS SRAM Rev. 1.8 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 1.3 Rev. 1.4 Rev. 1.5 Rev. 1.6 Rev. 1.7 Rev. 1.8 Description Issue Date Initial Issue Jul.25.2004 Revised sym. b of 32 pin 450mil SOP package outline dimension Jan.17.2007

Contextual Info: LY62L12916 128K X 16 BIT LOW POWER CMOS SRAM Rev. 1.0 REVISION HISTORY Revision Rev. 0.1 Rev. 0.2 Rev. 0.3 Rev. 0.4 Rev. 0.5 Rev. 0.6 Rev. 1.0 Description Initial Issue Revised Package Outline Dimension TSOP-II Revised FEATURES & ORDERING INFORMATION Lead free and green package available to Green package

DAEWON tray tsop 48LD

Abstract: nikon v12B 6n1 tube IPC-J-STD-001 nikon GRAINGER TRAY TSOP 56LD daewon TRAY DAEWON TSOP venturi meter
Contextual Info: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.4 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Procedures

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

IPC-J-STD-001

Abstract: TRAY DAEWON TSOP 6n1 tube IPC-JSTD-001 VHH10-6N1 Intel Corporation esd flash small outline package guide DAEWON tray 48 optical Pick-Up head venturi meter R08-01-FOGO
Contextual Info: Intel-Recommended Manual Handling/Programming Process for Small Outline Packages Version 2.5 CONTENTS Section Title Page 1.0 Scope 2 2.0 Introduction 2 3.0 Applicable Documents 2 4.0 Work Area/Station Setup 2 5.0 5.1 5.2 5.3 5.4 5.5 5.6 5.7 Programming Process Procedures

Contextual Info: LY6125616 5V 256K X 16 BIT HIGH SPEED CMOS SRAM Rev. 2.4 REVISION HISTORY Revision Rev. 1.0 Rev. 1.1 Rev. 1.2 Rev. 2.0 Rev. 2.1 Rev. 2.2 Rev. 2.3 Rev. 2.4 Description Initial Issue Revised VIL = 0.6V => 0.8V Revised Package Outline Dimension TSOP-II Added LL Spec.

150PPS

Abstract: PEAK tray drawing
Contextual Info: Analog Resistive Touch Screen Controller TSC-40/IC product specification TSC-40/IC Product Specification Table of Contents 1. PRODUCTS OUTLINE . 2 1-1. Scope of Application .2

TSOP 48 thermal resistance

Abstract: TSOP 48 stacked die package MS-024 MO-142 TSOP 32 thermal resistance TSOP 48 package tray MO-183 marking code 56l jedec ms-024
Contextual Info: LEADFRAME data sheet TSOP Features: Thin Small Outline Package TSOP : Amkor offers a family of popular TSOP packages to serve the needs of IC designers, PCB/system engineers and component specifiers. Small and thin, these 1.0 mm thick packages were designed and introduced to operate

land pattern for TSOP 2-44

Abstract: Wells programming adapter TSOP 48 intel 44-lead psop land pattern for TSOP 56 pin F9232 E28F016SA70 tsop tray matrix outline wells 648-0482211 memory card thickness 29f200 tsop adapter
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

TSOP-48 pcb LAYOUT

Abstract: str 6654 pin details of str f 6654 pin details of str W 6654 amd socket 940 pinout str W 6654 land pattern tsop 66 56-Lead TSOP Package 28F002BC 28F010
Contextual Info: D Small Outline Package Guide 1996 296514-006 8/19/97 5:26 PM FRONT.DOC Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions

PAL 007 pioneer

Abstract: pioneer PAL 007 A PAL 008 pioneer sn 7600 n 648-0482211 sem 2106 Trays tsop56 TSOP 86 land pattern amd socket 940 pinout Meritec 980020-56
Contextual Info: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions

pioneer PAL 007 A

Abstract: PAL 007 pioneer str 6654 PAL 008 pioneer pin details of str W 6654 sem 2106 Yamaichi Electronics ic197 648-0482211 TSOP56 jackson
Contextual Info: D Small Outline Package Guide 1999 3/25/99 4:28 PM cvrpg.doc Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel’s Terms and Conditions

MC7884 S

Abstract: MC-7882 MC-7881 MC-7883 MC-7884 max 7882 7881 7883
Contextual Info: MC-7881 NEC's 870 MHz GaAs CATV MC-7882 POWER DOUBLER AMPLIFIER MC-7883 MC-7884 OUTLINE DIMENSIONS Units in mm FEATURES • GaAs ACTIVE DEVICES • LOW DISTORTION • HIGH LINEAR GAIN: MC-7881 - GL = 18 dB MIN at f = 870 MHz MC-7882 - GL = 20 dB MIN at f = 870 MHz

A84 diode

Abstract: PART NUMBER A04 IT1-168S-SV IT1-252S-SV IT1A-168S-SV IT1A-252S-SV
Contextual Info: NEW High Speed, Matched-Impedance, Parallel Board-to-board Connector System IT1 Series Receptacle 2 required IT1 Series Outline High-speed matched-impedance parallel board-to-board connector designed for applications requiring board-toboard spacing with transmission speeds exceeding

IT1-168S-SV

Abstract: IT1-252S-SV IT1A-168S-SV IT1A-252S-SV
Contextual Info: High Speed, Matched-Impedance, Parallel Board-to-board Connector System IT1 Series Receptacle 2 required IT1 Series Outline High-speed matched-impedance parallel board-to-board connector designed for applications requiring board-toboard spacing with transmission speeds exceeding

pin configuration of IC 1619

Abstract: pin diagram for IC 1619 30 pin PEAK tray drawing dmc touch screen
Contextual Info: Analog Resistive Touch Screen Controller TSC-30/IC product specification TSC-30/IC Product Specification Table of Contents 1. Products outline . 2

sop package tray

Abstract: 29754* intel weight of SOP package SOP JEDEC tray
Contextual Info: SMALL OUTLINE PACKAGE GUIDE OVERVIEW Intent This overview provides a quick reference for the Small Outline Package Guide, Intel literature order number 296514. Contents The table below details, in outline form, the type of information that can be found in the guide.