PAN1104081 Search Results
PAN1104081 Datasheets Context Search
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Contextual Info: Thermal Relief Doc ID: PAN1104081 By: Eddy van Keulen Date: 8-Apr-2011 The DFN and QFN packages of the PhaseLink IC’s have a large solder pad in the middle. The official function of this pad is to aid thermal conductivity from the chip to the PCB to lower the thermal resistance |
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PAN1104081 8-Apr-2011 QFN-16L 100mW. 100mW |