PART 2 BA PRIVATE 2012 EXAM Search Results

Contextual Info: GS88237CB-xxx 119-Bump BGA Commercial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive

Contextual Info: GS88237CB-xxx 119-Bump BGA Commercial Temp 333 MHz–200 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive

Contextual Info: GS88237CB-xxxIV 119-Bump BGA Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply

Contextual Info: GS88218/36CB/D-xxxI 119- and 165-Bump BGA Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable

Contextual Info: GS88237CB-xxxIV 119-Bump BGA Industrial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply

Contextual Info: GS88237CB-xxxV 119-Bump BGA Commercial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply

Contextual Info: GS88237CB-xxxV 119-Bump BGA Commercial Temp 256K x 36 9Mb SCD/DCD Sync Burst SRAM Features • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan • ZQ mode pin for user-selectable high/low output drive • 1.8 V or 2.5 V core power supply

Contextual Info: GS88218/36C B/D -xxxIV 119- and 165-Bump BGA Industrial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS88218/36C B/D -xxxV 119- and 165-Bump BGA Commercial Temp 512K x 18, 256K x 36 9Mb SCD/DCD Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS816218/36D B/D -xxxV 1M x 18, 512K x 36 18Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS832218/36A B/D -xxxV 2M x 18, 1M x 36 36Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS816218/36D B/D -xxxV 1M x 18, 512K x 36 18Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS832218/36A B/D -xxxV 2M x 18, 1M x 36 36Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS816218/36D B/D -xxxV 1M x 18, 512K x 36 18Mb S/DCD Sync Burst SRAMs 119 & 165 BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Single/Dual Cycle Deselect selectable • IEEE 1149.1 JTAG-compatible Boundary Scan

Contextual Info: GS8321E18/32/36AD-xxxV 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation

Contextual Info: GS832118/32/36AD-xxxV 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply

Contextual Info: GS881E18/32/36C T/D -xxx 100-Pin TQFP & 165-bump BGA Commercial Temp 250 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect (DCD) operation

GS816136DD-200IV

Contextual Info: GS8161xxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply

Contextual Info: GS8161ExxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation

Contextual Info: GS8161ExxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation

Contextual Info: GS8321E18/32/36AD-xxxV 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • FT pin for user-configurable flow through or pipeline operation • Dual Cycle Deselect DCD operation

Contextual Info: GS8161ExxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • FT pin for user-configurable flow through or pipeline operation

Contextual Info: GS8161xxD GT/D -xxxV 100-Pin TQFP & 165-Bump BGA Commercial Temp Industrial Temp 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 1M x 18, 512K x 32, 512K x 36 18Mb Sync Burst SRAMs Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply

Contextual Info: GS832118/32/36AD-xxxV 333 MHz–150 MHz 2.5 V or 3.3 V VDD 2.5 V or 3.3 V I/O 2M x 18, 1M x 32, 1M x 36 36Mb Sync Burst SRAMs 165-Bump BGA Commercial Temp Industrial Temp Features • IEEE 1149.1 JTAG-compatible Boundary Scan • 1.8 V or 2.5 V core power supply