PBGA196 THERMAL RESISTANCE Search Results

PBGA196 THERMAL RESISTANCE Result Highlights (5)

Part	Manufacturer	Description
TCTH011AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type
TCTH022AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type / FLAG signal latch function
TCTH021AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=10μA / IDD=11.3μA / Push-pull type
TCTH012BE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Open-drain type / FLAG signal latch function
TCTH012AE	Toshiba Electronic Devices & Storage Corporation	Over Temperature Detection IC / VDD=1.7~5.5V / IPTCO=1μA / IDD=1.8μA / Push-pull type / FLAG signal latch function

PBGA196 THERMAL RESISTANCE Datasheets Context Search

Catalog Datasheet	MFG & Type	PDF	Document Tags
MPS OUTSIDE BOX PACKING SPECIFICATION Abstract: No abstract text available Text: Technical Data Advance Information DSP56321T/D Rev. 1, 8/2002 24-Bit Digital Signal Processor 3 16 6 6 Memory Expansion Area EFCOP Peripheral Expansion Area Program RAM 32 K x 24 bits or 31 K × 24 bits and Instruction Cache 1024 × 24 bits Address Generation	Original	PDF	DSP56321T/D 24-Bit DSP56321T DSP56300 196-lead DSP56321TFC220D DSP56321TFC240D SPAK321TFC240D MPS OUTSIDE BOX PACKING SPECIFICATION
sio lpc chip intel p4 motherboard Abstract: rdi-dmt-1206 980020 NAND RJMG-5312-11-01 Amphenol RJMG intel 810 MOTHERBOARD pcb CIRCUIT rdi DMT-1206 intel 810 MOTHERBOARD pcb CIRCUIT diagram c.i GD75232 smd 82801 g SCHEMATIC DIAGRAM Text: Intel 810 Chipset Design Guide June 1999 Order Number: 290657-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability	Original	PDF

Catalog Datasheet

MFG & Type

PDF

Document Tags

MPS OUTSIDE BOX PACKING SPECIFICATION

Abstract: No abstract text available
Text: Technical Data Advance Information DSP56321T/D Rev. 1, 8/2002 24-Bit Digital Signal Processor 3 16 6 6 Memory Expansion Area EFCOP Peripheral Expansion Area Program RAM 32 K x 24 bits or 31 K × 24 bits and Instruction Cache 1024 × 24 bits Address Generation

Original

PDF

DSP56321T/D 24-Bit DSP56321T DSP56300 196-lead DSP56321TFC220D DSP56321TFC240D SPAK321TFC240D MPS OUTSIDE BOX PACKING SPECIFICATION

sio lpc chip intel p4 motherboard

Abstract: rdi-dmt-1206 980020 NAND RJMG-5312-11-01 Amphenol RJMG intel 810 MOTHERBOARD pcb CIRCUIT rdi DMT-1206 intel 810 MOTHERBOARD pcb CIRCUIT diagram c.i GD75232 smd 82801 g SCHEMATIC DIAGRAM
Text: Intel 810 Chipset Design Guide June 1999 Order Number: 290657-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Intel's Terms and Conditions of Sale for such products, Intel assumes no liability