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    sram 1mbyte 3.3v

    Abstract: 16x16 bga Multi-Chip Package MEMORY TQFP 100 PACKAGE footprint with or without underfill PC755B PCX755B
    Text: PC755B Microprocessor + 1MByte L2-Cache Multi-Chip Module Fact Sheet Main Features • PC755B RISC microprocessor • 8 Mbit of Synchronous Pipelined Burst SRAM configured as 128Kx72 L2-Cache • Extended temperature modules 2.0V (Core)/3.3V (I/0) for industrial and military applications


    Original     		PDF PC755B 128Kx72 PCX745BVZFUxxxLE PC7410M16MGxxxLE PCX755B BP123 sram 1mbyte 3.3v 16x16 bga Multi-Chip Package MEMORY TQFP 100 PACKAGE footprint with or without underfill

    ATMEL 322

    Abstract: atmel 711 PC755B
    Text: 3& 0LFURSURFHVVRU  0%\WH /&DFKH 0XOWL&KLS 0RGXOH DFW 6KHHW 0DLQ )HDWXUHV • PC755B RISC microprocessor • 8 Mbit of Synchronous Pipelined Burst SRAM configured as 128Kx72 L2-Cache) • Extended temperature modules 2.0V (Core)/3.3V (I/0) for industrial and military applications


    Original     		PDF PC755B 128Kx72 PCX745BVZFUxxxLE PC7410M16MGxxxLE PCX755B BP123 ATMEL 322 atmel 711