PEAK SOLDERING BODY TEMP Search Results

Contextual Info: P4KE 400W Unidirectional Transient Voltage Suppressor Diodes DO-41 Plastic Dimensions in mm. Peak Pulse Power Rating At 1ms. Exp. 400 W R • Glass passivated junction Mounting instructions 1. Min. distance from body to soldering point, 4 mm. 2. Max. solder temperature, 350 °C.

Contextual Info: P4KE 400W Unidirectional Transient Voltage Suppressor Diodes DO-41 Plastic Dimensions in mm. Peak Pulse Power Rating At 1ms. Exp. 400 W R • Glass passivated junction Mounting instructions 1. Min. distance from body to soldering point, 4 mm. 2. Max. solder temperature, 350 °C.

Contextual Info: BZW04P 400W Unidirectional Transient Voltage Suppressor Diodes Dimensions in mm. Ø 0.8 +- 00.1 Ø 2.6 ± 0.1 DO-41 Plastic Peak Pulse Power Rating At 1 ms. Exp. 400 W 5 +0.2 -0 58.5 ± 0.5 Mounting instructions 1. Min. distance from body to soldering point,

Contextual Info: BZW04P 400W Unidirectional Transient Voltage Suppressor Diodes Dimensions in mm. DO-41 Plastic Ø 0.8 +- 00.1 Ø 2.6 ± 0.1 Peak Pulse Power Rating At 1 ms. Exp. 400 W 5 +0.2 -0 58.5 ± 0.5 Mounting instructions 1. Min. distance from body to soldering point,

Contextual Info: BZW04PB 400W Bidirectional Transient Voltage Suppressor Diodes Dimensions in mm. DO-41 Plastic Ø 0.8 +- 00.1 Ø 2.6 ± 0.1 Peak Pulse Power Rating At 1 ms. Exp. 400 W 5 +0.2 -0 58.5 ± 0.5 Mounting instructions 1. Min. distance from body to soldering point,

JEDEC J-STD-020

Abstract: STMICROELECTRONICS MSL AN2033 J-STD-020B an2033 st STMICROELECTRONICS MSL PACKAGES
Contextual Info: AN2033 APPLICATION NOTE Soldering Resistance and Moisture Sensitivity Level MSL Classification of STMicroelectronics Lead-Free Devices The reliability of electronic components is validated using Moisture Sensitivity Level (MSL) tests because board mounting processes, especially solder reflow (for Surface Mount Devices - SMD), involve a highmoisture vapor pressure inside plastic packages and high temperatures.

pine alpha st-100s arakawa chemical

Abstract: JIS7032 750H ST-100S smd non marking diode two terminal TOSHIBA DIODE GLASS MOLD
Contextual Info: Mounting and storage conditions Diodes Mounting and storage conditions !Recommended storage conditions 1. Temperature 5 to 40°C Recommended : 20 to 30°C 2. Humidity 30 to 80% RH (Recommended : 40 to 60% RH ) 3.Recommended period One year after manufacturing

750H

Abstract: JIS7032 ST-100S TOSHIBA DIODE GLASS MOLD
Contextual Info: HANDLING PRECAUTIONS Diodes SURFACE MOUNTED MOLD DIODE HANDLING PRECAUTIONS 1. HANDLING PRECAUTIONS 2. HANDLING PRECAUTIONS FOR SOLDERING 3. RECOMMENDED SAFE TEMPERATURE RANGE FOR SOLDERING 4. RECOMMENDED SOLDERING CONDITIONS 5. RECOMMENDED WASHING CONDITIONS

washing machine circuit diagram

Abstract: washing machine circuit washing machine electric circuit circuit diagram of toshiba washing machine List of Zener diode washing machine about zener diode Z diode TOSHIBA DIODE CATALOG WASHING machine controller
Contextual Info: Mounting and storage conditions Diodes Mounting and storage conditions zRecommended storage conditions 5 to 40°C Recommended : 20 to 30°C 1. Temperature 2. Humidity 30 to 80% RH (Recommended : 40 to 60% RH ) 3.Recommended period One year after manufacturing

Contextual Info: Return to Specification Page Search! EMK32 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

Contextual Info: Return to Specification Page Search! EC29 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

Contextual Info: Return to Specification Page Search! EL13D8 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

Contextual Info: Return to Specification Page Search! EMK12 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

Contextual Info: Return to Specification Page Search! EL13C7 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

Contextual Info: Return to Specification Page Search! EMK31 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

Contextual Info: Return to Specification Page Search! E15D8 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

EB16E2

Contextual Info: Return to Specification Page Search! EB16E2 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

TOSHIBA DIODE GLASS MOLD

Abstract: DIODE SMD MARKING 5C
Contextual Info: HANDLING PRECAUTIONS Diodes SURFACE MOUNTED MOLD DIODE HANDLING PRECAUTIONS 1. HANDLING PRECAUTIONS 2. HANDLING PRECAUTIONS FOR SOLDERING 3. RECOMMENDED SAFE TEMPERATURE RANGE FOR SOLDERING 4. RECOMMENDED SOLDERING CONDITIONS 5. RECOMMENDED WASHING CONDITIONS

ecliptek eb13c3 series

Contextual Info: Return to Specification Page Search! EB13C3 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

Contextual Info: Return to Specification Page Search! EC39 Series Recommended Solder Reflow Methods High Temperature Infrared/Convection Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page

ll-41 foot print

Contextual Info: HANDLING PRECAUTIONS Diodes SURFACE MOUNTED MOLD DIODE HANDLING PRECAUTIONS 1. HANDLING PRECAUTIONS 2. HANDLING PRECAUTIONS FOR SOLDERING 3. RECOMMENDED SAFE TEMPERATURE RANGE FOR SOLDERING 4. RECOMMENDED SOLDERING CONDITIONS 5. RECOMMENDED WASHING CONDITIONS

Contextual Info: Application Notes 6 Peak value current Ordinary Diodes Limit of the peak value current must be set to 10 times of the average current Io or IF (AV under normal use. If the peak value increases. the diode’s forward loss also increases. In this case, check the temperature rise.

Contextual Info: Return to Specification Page Search! EH15 Series Recommended Solder Reflow Methods Low Temperature Infrared/Convection High Temperature Manual Soldering Low Temperature Manual Soldering Solder Reflow Profile Top of Page Low Temperature Infrared/Convection

Contextual Info: VISHAY SEMICONDUCTORS www.vishay.com Rectifiers Application Note Soldering Process Notes WAVE SOLDERING THROUGH HOLE ONLY Sn-Pb Wave Soldering Profile Lead (Pb)-free Wave Soldering Profile 235 °C to 260 °C wave temperature 250 300 Maximum temperature can not exceed 265 °C