PGA JEDEC TRAY Search Results

LA-072

Abstract: PGA JEDEC tray 216-0016
Contextual Info: Packing Name NEC Tray LA-072 JEDEC Tray PGA 21x21 528 pin Ceramic PGA Seam Weld A D (Bottom View) J I G H Index mark Orientation pin N K L φM E M F NOTE Each lead centerline is located within φ 0.254 mm (φ 0.010 inch) of its true position (T.P.) at maximum material condition.

PGA weight

Abstract: jedec bottom LA-072 PGA JEDEC tray
Contextual Info: Packing Name NEC Tray LA-072 JEDEC Tray PGA 21x21 528 pin Ceramic PGA Seam Weld (Bottom View) A D Index mark Index mark I V W L φM M F E G J NOTE Each lead centerline is located within φ 0.254 mm (φ 0.01 inch) of its true position (T.P.) at maximum material condition.

PGA weight

Abstract: PGA JEDEC tray
Contextual Info: Packing Name NEC Tray LA-A76 JEDEC Tray PGA 20x20 447 pin Ceramic PGA Seam Weld A B D P C Q (Bottom View) R H G S T J I Index mark K L φM N E M F NOTE Each lead centerline is located within φ 0.254 mm (φ 0.010 inch) of its true position (T.P.) at maximum material condition.

PGA weight

Abstract: NEC 1169
Contextual Info: Packing Name NEC Tray LA-A76 JEDEC Tray PGA 20x20 447 pin Ceramic PGA Metal Slug A V W2 (Bottom View) X D P W1 Q 2-10-32UNF 2-M3 R S I J Index mark H G N E K L φM M F X447RP-50A NOTE Each lead centerline is located within φ 0.254 mm ( φ 0.010 inch) of its true position (T.P.) at

JEDEC Package Code MS-026-AED

Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Contextual Info: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Contextual Info: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Contextual Info: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

JEDEC to 243

Abstract: PGA JEDEC tray
Contextual Info: 53.1 62.0 37.0 A A' 60.8 243.2 315.0 322.6 35.9 3M 21001-301 53.1 PGA 20x20 SECTION A – A' 53.1 12.2 8.6 10.2 135.9 UNIT : mm Applied Package Quantity (pcs) 447-pin ceramic PGA MAX. 10 Tray Material Heat Proof Temp. Surface resistance PGA 20×20 Carbon fiber PC

PGA JEDEC tray

Abstract: 3M 21001 528pin
Contextual Info: 37 55.7 62 135.9 UNIT : mm A A' 55.7 73.5 47.3 220.5 315.0 322.6 3M21001-302 PGA 21x21–155 SECTION A-A' 8.6 12.2 10.2 55.7 Applied Package Quantity (pcs) 528-pin •ceramic PGA MAX. 8 Tray Material Heat Proof Temp. PGA 21×21 Carbon fiber PC 105°C Surface resistance less than 1×1012 Ω /

PCB footprint cqfp 132

Abstract: schematic impulse sealer xc4010e-pq208 footprint pga 84 TSOP 54 PIN footprint 14mm x 20 mm .65mm bga land pattern QFP PACKAGE thermal resistance die down XC4013E-PQ240 XC7272A XC7318
Contextual Info: Packages and Thermal Characteristics  August 6, 1996 Version 1.2 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP JEDEC Package Code MS-026-AED BGA 11x11 junction to board thermal resistance QFP Package 128 lead .5mm .65mm bga land pattern MS-026-BGA Shipping Trays 16x16 XC4010E-PQ208
Contextual Info: Packages and Thermal Characteristics  June 1, 1996 Version 1.1 Number of Available I/O Pins Max 44 64 68 84 100 120 132 144 156 160 164 175 176 191 196 208 223 225 228 240 299 304 352 411 432 499 I/O XC7236A 36 XC7272A 72 XC7318 38 36 56 72 38 XC7336

trays

Abstract: QFN Shipping Trays PEAK TRAY bga
Contextual Info: S PEC I FI C AT I ON SHE E T Matrix Trays Matrix T r ay s UltraLite designs Available Now Open Tooling for all popular configurations Quick-tur n, custom tooling ser vices Peak Matrix Trays conform to JEDEC standards and are available in a number of tray types including Pin Grid Array, Plastic Quad

MIL-STD-81705

Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
Contextual Info: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes

CS5345-CQZ

Contextual Info: CS5345 104 dB, 24-Bit, 192 kHz Stereo Audio ADC A/D Features General Description  Multi-Bit Delta Sigma Modulator The CS5345 integrates an analog multiplexer, programmable gain amplifier, and stereo audio analog-to-digital converter. The CS5345 performs stereo analog-to-digital A/D conversion of up to 24-bit serial values at

LQFP Package tray

Contextual Info: CS5345 104 dB, 24-Bit, 192 kHz Stereo Audio ADC A/D Features General Description  Multi-Bit Delta Sigma Modulator The CS5345 integrates an analog multiplexer, programmable gain amplifier, and stereo audio analog-to-digital converter. The CS5345 performs stereo analog-to-digital A/D conversion of up to 24-bit serial values at

Contextual Info: CS5345 104 dB, 24-Bit, 192 kHz Stereo Audio ADC A/D Features General Description  Multi-Bit Delta Sigma Modulator The CS5345 integrates an analog multiplexer, programmable gain amplifier, and stereo audio analog-to-digital converter. The CS5345 performs stereo analog-to-digital A/D conversion of up to 24-bit serial values at

bp-1200 operator manual

Abstract: BP-1200 80 pin simm flash programmer BP 1200 users manual BP 4100 users manual Flash SIMM 80 programmer lcc 28 socket 40 pin eprom programmer circuit 80 lead flash simm programmer socket cpld
Contextual Info: BP MICROSYSTEMS UNIVERSAL DEVICE PROGRAMMER 520 BP-1200 The BP-1200 uses the newest technology to satisfy the programming requirements of both engineering and • New technology provides price and performance production users at a reasonable price. breakthrough

NEC A39A

Abstract: NEC A39A 240 SOP28 330 mil land pattern NEC A39A 8 PIN mjh 106 120-PIN 282 185 01 smd TRANSISTOR code b6 ED-7500 transistor a39a SIP 400B
Contextual Info: IC PACKAGE MANUAL 1991, 1992, 1994, 1996 Document No. C10943XJ6V0IF00 Previous No. IEI-635, IEI-1213 Date Published January 1996 P Printed in Japan CHAPTER 1 PACKAGE OUTLINES AND EXPLANATION CHAPTER 2 CHAPTER 3 1 THROUGH HOLE PACKAGES 2 SURFACE MOUNT PACKAGES

AES17-1991

Abstract: CDB5345 CS4245 CS5345 CS5345-CQZ CS5345-CQZR
Contextual Info: CS5345 104 dB, 24-Bit, 192 kHz Stereo Audio ADC A/D Features General Description  Multi-Bit Delta Sigma Modulator The CS5345 integrates an analog multiplexer, programmable gain amplifier, and stereo audio analog-to-digital converter. The CS5345 performs stereo analog-to-digital A/D conversion of up to 24-bit serial values at

CS5346DQZR

Contextual Info: CS5346 103-dB, 192-kHz, Stereo Audio ADC with 6:1 Input Mux ADC Features General Description  Multi-bit Delta Sigma Modulator The CS5346 integrates an analog multiplexer, programmable gain amplifier, and stereo audio analog-to-digital converter. The CS5346 performs stereo analog-to-digital A/D conversion of 24-bit serial values at sample

AFE5807

Abstract: AFE5808
Contextual Info: AFE5807 www.ti.com SLOS703 – SEPTEMBER 2010 Fully Integrated, 8-Channel Ultrasound Analog Front End for Ultrasound with Passive CW Mixer, 0.75 nV/rtHz, 12/14-Bit, 65 MSPS, 141 mW/CH FEATURES DESCRIPTION • The AFE5807 is a highly integrated Analog Front-End