PK458 Search Results

Contextual Info: PK458 v1.1 September 28, 2012 100% Material Declaration Data Sheet FF1759 Virtex-6 Average Weight: 21.0121 g Substance Description Component Silicon Die (FPGA) Doped silicon CAS Number or Description 7440-21-3 Percentage of Component 100.00 Solder Bump Use in Product

JEDEC tray standard dimension

Abstract: CN MEZZANINE r 3589 A789 WN 1451
Contextual Info: 10 5 0 L D E R C H A R G E D E T A IL 1. TIN L E A D HOUSING M A T E R IA L : PARTS HIGH P E R F O R M A N C E A L L O Y S O L D E R N A IL N A T L : S T A IN L E S S STEEL SO LD ER CHARGE N A T L: S E E CHART H A V E SO LD E R C H ANNELS TYP LCP, G L A S S F IL L E D , U L 9 4 V - 0 , B L A C K

fr 3709 z

Abstract: 4606 ic ic 4583 pin 4583
Contextual Info: tb _ fr a m e _ B _ P _ A M _ T R e v. E 2 0 0 6 /0 4 /1 5 SD MODEL: TM -4-5830-0000x 10 lo S T A C K HEIG HT: 8mm 9mm 10mm 11mm 12mm 13mm 14mm 15mm 17mm 18mm DIM B 10,41 11.41 12.41 13.41 14.41 15.41 16,41 17.41 19.41 20,41 DIM C 12.80 13.80 DIM A DIM D M A T E R IA L NO