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Contextual Info: PK582 v1.0 September 21, 2012 100% Material Declaration Data Sheet FGG400 XC3S400AN Average Weight: 2.0000 g Component Silicon Die (FPGA) Silicon Die (PROM) Substance Description Silicon (Si) CAS# or Description 7440-21-3 % of Component 100.00 Component Weight/ |
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PK582 FGG400 XC3S400AN 12visions |