PLCC JEDEC TRAY Search Results

Contextual Info: PLCC SOCKETS ADAM TECH PLASTIC LEADED CHIP CARRIER SOCKET THROUGH HOLE ADAM TECHNOLOGIES INC. PLCC SERIES INTRODUCTION: Adam Tech PLCC Sockets accept plastic leaded chip carriers conforming to EIA/JEDEC standards In registration M 0-047, AA through AH. They convert the .050" chip centerlines to throughboard leads on a .100" centerline grid. Our special contact design

Contextual Info: ADAM TECH ADAM TECHNOLOGIES INC. PLCC SOCKETS PLASTIC LEADED CHIP CARRIER SOCKET THROUGH HOLE PLCC SERIES INTRODUCTION: Adam Tech PLCC Sockets accept plastic leaded chip carriers conforming to EIA/JEDEC standards in registration MO-047, AA through AH. They convert the .050“ chip centerlines to throughboard leads on a .100" centerline grid. Our special contact design

JEDEC Package Code MS-026-AED

Abstract: EFTEC-64 schematic impulse sealer footprint jedec MS-026 TQFP PQ-208 footprint jedec MS-026 TQFP 128 QFP PACKAGE thermal resistance die down EIA standards 481 ipc-sm-786A VQ44
Contextual Info: • Packages and Thermal Characteristics  November 20, 1997 Version 2.0 10* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: XC4010E-PQ208 JEDEC Package Code MS-026-AED XC4013E-PQ240 JEDEC MS-026 footprint MS-026-ACB footprint jedec MS-026 TQFP 128 XC4013E-BG225 PG299-XC4025E bav 21 diode
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

footprint jedec MS-026 TQFP

Abstract: JEDEC MS-026 footprint qfp 64 0.5 mm pitch land pattern fine BGA thermal profile schematic impulse sealer HQ208 PQ100 land pattern QFP 208 PQ208 TQ100
Contextual Info: Packages and Thermal Characteristics R February 2, 1999 Version 2.1 11* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: leadframe C7025 MO-151-BAR PG223-XC4013E XC4010E-PQ208 BGA 31 x 31 mm footprint jedec MS-026 TQFP 128 footprint jedec mo-067 XC4013E-PQ240 EIA standards 481
Contextual Info: Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

schematic impulse sealer

Abstract: qfp 64 0.4 mm pitch land pattern Rotron pk100 power supply XC4013E-PQ240 EFTEC-64 XC4010E-PQ208 MO-151-AAN-1 PK100 land pattern for TSOP 2 86 PIN
Contextual Info: Packages and Thermal Characteristics: High-Reliability Products R 0 5 PK100 v1.0 June 15, 2000 Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or 0.100").

footprint jedec MS-026 TQFP 128

Abstract: schematic impulse sealer footprint jedec MS-026 TQFP TSOP 86 land pattern BAV 235 BGA and QFP Package xc4010e-pq208 leadframe C7025 QFP PACKAGE thermal resistance CB228
Contextual Info: 08 001-022_pkg.fm Page 1 Tuesday, March 14, 2000 2:15 PM Packages and Thermal Characteristics R February 15, 2000 Version 2.1 8* Package Information Inches vs. Millimeters The JEDEC standards for PLCC, CQFP, and PGA packages define package dimensions in inches. The lead spacing is specified as 25, 50, or 100 mils (0.025", 0.050" or

JEDEC TRAY PLCC

Abstract: PLCC JEDEC tray PLCC 84 tray Carbon PPO
Contextual Info: UNIT : mm A' 30.94 30.61 37.01 74.02 135.9 A 30.61 27.95 37.01 259.07 315 322.6 84 LEAD PLCC <SECTION A - A'> 30.61 7.77 7.79 12.19 25.78 Applied Package 84-pin QFJ PLCC Quantity (pcs) MAX. 24 Tray Material UNT-AMC-002 Carbon PPO Heat Proof Temp. 135°C

PLCC JEDEC tray

Abstract: JEDEC TRAY PLCC 7402 tray Carbon PPO plcc 68
Contextual Info: UNIT : mm A' 30.94 30.10 37.01 74.02 135.9 A 30.10 27.95 37.01 259.07 315 322.6 68 LEAD PLCC <SECTION A - A'> 30.10 7.77 5.25 12.19 20.57 Applied Package 68-pin QFJ PLCC Quantity (pcs) MAX. 24 Tray Material UNT-AMC-002 Carbon PPO Heat Proof Temp. 135°C

Contextual Info: www.we-online.com PLCC Socket WR-PLCC 10 09/08 10-1 www.we-online.com PLCC Socket WR-PLCC In the past IC socket were normally mounted on a PCB but upgrade and replacements were not so easy to make, that’s why PLCC socket became so popular. PLCC sockets are soldered to the plated through holes or to the SMT layout on a PCB,

JEDEC Matrix Tray outlines

Abstract: ATMEL EIA-481-x Packing JEDEC tray standard for PLCC ATMEL Packing Methods and Quantities EIA-481-x JEDEC TRAY PLCC ATMEL Tape and Reel tsop Shipping Trays JEDEC tray standard 13 ATMEL shipping label
Contextual Info: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also

tsop tray matrix outline

Abstract: tsop Shipping Trays JEDEC Matrix Tray outlines Atmel 918 EIA-481-x ATMEL Packing Methods and Quantities JEDEC Matrix Tray outlines soic ATMEL Tape and Reel PLCC JEDEC tray Shipping Trays
Contextual Info: Packages Available Packing Methods and Quantities Atmel provides four different packing methods to provide maximum protection for our product and to best suit our customer’s needs: 1 Shipping Tubes, 2) Shipping Trays, 3) Unit Packing, and 4) Tape and Reel. These first three methods are our standard pack, but we also

Contextual Info: PLCC 1.27mm SMT Sockets IC160 Series ORDERING INFORMATION P/N: IC160-0*4-*0* * Blank: Tray I 1: Tape & Reel 2: Tube 1: With Locator Pin _ 0: Without Locator Pin 1. 2: SMT Terminals See "Contact Area" Drawing Below Pin Count CHARACTERISTICS Insulation Resistance

footprint plcc 32

Contextual Info: Issue 5.0 April 2001 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined

Contextual Info: Issue 5.0 January 2000 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined upgrade

Contextual Info: Issue 5.0 December 1999 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined

CT2102

Contextual Info: PLCC Sockets Through Hole - M43 Series PART NUMBER LEGEND M43X-XX-XX NUMBER OF CONTACTS 20, 28, 32, 44, 52, 68, 84, 100 -10 Style 44, 52, 68, 84 (-11 Style) STYLE -10 Standard wall thickness, through hole -11 Thin wall design, through hole PLATING E = Tin/Lead

JED-STD-020

Contextual Info: Issue 5.0 December 1999 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined

Contextual Info: Issue 5.0 January 2000 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined

Contextual Info: Issue 5.0 January 2000 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined upgrade

J-STD-001B

Abstract: D1225
Contextual Info: TRAILING EDGE PRODUCT - MINIMUM ORDER APPLIES Issue 5.0 December 1999 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and

125OC

Contextual Info: Issue 5.1 April 2001 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined

Contextual Info: Issue 5.0 December 1999 Description The PUMA68 range of devices provide a high density surface mount industry standard memory solution which may accommodate various memory technologies including SRAM, EEPROM and Flash. The devices are designed to offer a defined