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    PMC-90

    Abstract: PMC-90 leadframe material MP150SG pmc90 MP150s poongsan pmc 26 mold compound "leadframe material" DIP 20 plaskon poongsan pmc
    Text: TEXAS INSTRUMENTS Final Notification of New Mold Compound for TO-220 Packages; New Source for Leadframes and Au Wire May 7, 1998 Abstract Texas Instruments has qualified a new mold compound for the TO-220 packages. This new compound will be used in addition to the previously qualified compounds, and add flexibility to our


    Original     		PDF O-220 UA7808CKC, PMC-90 PMC-90 leadframe material MP150SG pmc90 MP150s poongsan pmc 26 mold compound "leadframe material" DIP 20 plaskon poongsan pmc