PPF LEADFRAME Search Results

Ablecube

Abstract: ATM-0018 Ablestik ATM-0087 ablebond ablebond technical 8200C ATM-0089 ablebond ablestik ablestik ablebond
Contextual Info: PILOT TECHNICAL DATASHEET ABLEBOND 8200C ELECTRICALLY CONDUCTIVE DIE ATTACH ADHESIVE DESCRIPTION ABLEBOND® 8200C low bleed die attach adhesive is designed for small and medium sized dies across a variety of leadframes including PPF, Cu and Ag. This electrically conductive adhesive offers improved JEDEC

MO-153

Abstract: MO-187 MO-194 PPF leadframe MO153 MO-153 Packages JEDEC MO-187 JEDEC MO-153 38 Amkor mold compound tssop
Contextual Info: LEADFRAME data sheet TSSOP Features: Thin Shrink Small Outline Package TSSOP : With the evolution of smaller, denser, faster and lighter end products, Amkor not only shrunk the SOP by decreasing the lead pitch, but also made it thin - 0.9 mm thin! Amkor invested time and research

Contextual Info: Data Sheet LEADFRAME SOT-223 Test Services ● Program generation/conversion ● Wafer probe ● Burn-in ● -55°C to +165°C test available ● Strip test available Small Outline Transistor SOT-223 SOT-223 is a leadframe based, plastic encapsulated package

TO 92 leadframe

Contextual Info: Data Sheet LEADFRAME TO-92 Test Services ● Program generation/conversion ● Wafer probe ● Burn-in ● -55°C to +165°C test available ● Strip test available Transistor Outline TO-92 TO-92 is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum

MO-166

Abstract: PPF leadframe MO166 psop3 outline of the heat slug for JEDEC
Contextual Info: LEADFRAME data sheet PowerSOP 3 Features Power Small Outline Package, PowerSOP® PSOP3 : PSOP3 is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package utilizes a thick copper heat slug to

ic packages

Abstract: MO-137
Contextual Info: LEADFRAME data sheet ExposedPad SOIC/SSOP Features: ExposedPad SOIC/SSOP Packages: This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power-constrained standard SOIC and SSOP packages. The ExposedPad SOIC/ SSOPs can increase heat dissipation by

LD128

Abstract: PPF leadframe
Contextual Info: LEADFRAME data sheet SOIC Features Small Outline IC Package SOIC : SOIC is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. This industry standard package runs in very high volume and

Ablestik 8290

Abstract: C194 G600 MS-013 Amkor Wafer level mold compound PPF leadframe
Contextual Info: LEADFRAME data sheet SOIC Features: Small Outline IC Packages: Amkor has a broad portfolio of Small Outline ICs SOIC packages, including .150", .208" and .300" body sizes. Statistically controlled and refined assembly processes coupled with very high quality materials assure the best

MO-150

Abstract: C194 MP8000AN G600 MO-137 amkor
Contextual Info: LEADFRAME data sheet SSOP Features: Shrink Small Outline SSOP Packages: How do you reduce an SOP size and its board footprint demand? Amkor did it by taking a family of SOPs and shrinking them. The body size was compressed and the lead pitch tightened to obtain a smaller

MO-112

Abstract: MS-029 MATRIX TRAY MS-022 LD240
Contextual Info: LEADFRAME data sheet MQFP Features: Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced

JEDEC MO-153

Abstract: 78 mo 5 MO-153 tip55 JEDEC MO-187
Contextual Info: LEADFRAME data sheet TSSOP/MSOP Features Thin Shrink Small Outline Package, Micro Small Outline Package TSSOP/MSOP : TSSOP and MSOP are leadframe based, plastic encapsulated packages that are well suited for applications requiring less than 1 mm mounted height.

JEDEC MO-187

Abstract: JEDEC MO-153
Contextual Info: LEADFRAME Data Sheet TSSOP/MSOP/VSSOP Thermal Performance Forced Convection, Single-layer PCB Pkg Thin Shrink Small Outline Package, Micro Small Outline Package, Very-Thin Shrink Small Outline Package TSSOP/MSOP/ VSSOP TSSOP, MSOP and VSSOP are leadframe based, plastic

Contextual Info: Data Sheet LEADFRAME ExposedPad TSSOP/MSOP/SOIC/SSOP Thermal Performance Forced Convection, Single-layer PCB ExposedPad Thin Shrink Small Outline Package TSSOP , Micro Small Outline Package (MSOP), Small Outline IC Package (SOIC), Shrink Small Outline (SSOP)

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Contextual Info: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses

DUAL ROW QFN leadframe

Abstract: amkor mlf qfn QFN 56 7x7 footprint qfn 44 PACKAGE footprint 7x7 DIe Size qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint qfn 48 7x7 footprint QFN Shipping Trays qfn 44 PACKAGE footprint 7x7 156 qfn
Contextual Info: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features: Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This

MO-166

Abstract: PPF leadframe MO166 MS-013 tip 142
Contextual Info: LEADFRAME data sheet PowerSOP 2&3 Features: Thermal Resistance: PowerSOP® Packages: PSOP This Amkor-developed family of power IC packages significantly increases the thermal efficiency of power constrained standard SOIC packages. The PowerSOP (PSOP) improves

SEMICONDUCTOR PACKAGING ASSEMBLY TECHNOLOGY

Abstract: amkor
Contextual Info: service green packaging Green / Pb Free Technology Solution A combination of governmental legislation and consumer sentiment has driven the Electronics Industry in general and Semiconductor Packaging specifically to adopt more environmentally friendly materials and processes. Amkor is a leader in the

LD 337

Abstract: LD128 amkor copper bond wire amkor JEDEC Matrix Tray outlines mo-112 MQFP 32 32
Contextual Info: LEADFRAME data sheet MQFP Features Metric Quad Flat Pack MQFP Packages: Amkor’s MQFP package affords the designer or systems engineer the flexibility of growing or shrinking IC package size based upon application need. Amkor employs the most up-to-date, advanced equipment, material

Contextual Info: Reportable Substances in Components Package Type : QFN5032 Component Weight : Document No : 20 Process Type : Lead #: No 1 Content in % Material 0.0210376 Silica Fused 40.28% 6 % to % to Unit Content PPM 60676-86-0 0.0192914 91.700% 47.633% Trade secret 0.0008415

Contextual Info: Reportable Substances in Components Package Type : DFN75 Component Weight : Document No : 4 Process Type : Lead #: No 1 Content in % Material 0.0507958 Silica Fused 39.62% 6 % to % to Unit Content PPM 60676-86-0 0.0465797 91.700% 53.974% Trade secret 0.0020318

Contextual Info: Reportable Substances in Components Package Type : CDFN2520 Component Weight : Document No : 6 Process Type : Lead #: No 1 Content in % Material 0.0049499 Silica Fused 47.24% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0045391 91.700% 36.903% Trade secret

Contextual Info: Reportable Substances in Components Package Type : CDFN5032 Component Weight : Document No : 4 Process Type : Lead #: No 1 Content in % Material 0.0247989 Silica Fused 35.67% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0227406 91.700% 56.150% Trade secret

Contextual Info: Reportable Substances in Components Package Type : CDFN3225 Component Weight : Document No : 6 Process Type : Lead #: No 1 Content in % Material 0.0087735 Silica Fused 47.07% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0080453 91.700% 41.258% Trade secret

Contextual Info: Reportable Substances in Components Package Type : CDFN2520 Component Weight : Document No : 4 Process Type : Lead #: No 1 Content in % Material 0.0052512 Silica Fused 47.24% Epoxy 2 6 % to % to Unit Content PPM 60676-86-0 0.0048153 91.700% 39.149% Trade secret