PPGA PACKAGE Search Results

DS811

Contextual Info: data sheet CERAMIC / HERMETIC PPGA Plastic Pin Grid Array Package PPGA Amkor Technology incorporates the most advanced assembly processes for today and tomorrow's cost/performance applications. This IC package technology allows application and design engineers to optimize innovations while

UP124A

Abstract: UP159A UP175A
Contextual Info: Plastic Pin Grid Array PPGA 124 Pin Molded Plastic Pin Grid Array NS Package Number UP124A 159 Pin Molded Plastic Pin Grid Array NS Package Number UP159A 2000 National Semiconductor Corporation MS101166 www.national.com Plastic Pin Grid Array (PPGA) May 1999

PQFP 132 PACKAGE DIMENSION intel

Abstract: intel DOC pin grid array conductive trace ppga package PpGA jc thermal resistance PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: B 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 5/10/97 7:47 AM 97_13_1.doc INTEL CONFIDENTIAL (until publication date) B CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on

88 lead cpga

Abstract: JEDEC Matrix Tray outlines cpu Shipping Trays outline of the heat slug for JEDEC ceramic pin grid array package wire bond I 6506 PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: 2 13 An Introduction to Plastic Pin Grid Array PPGA Packaging 1/17/97 9:53 AM CH13WIP.DOC INTEL CONFIDENTIAL (until publication date) 2 CHAPTER 13 AN INTRODUCTION TO PLASTIC PIN GRID ARRAY (PPGA) PACKAGING 13.1. INTRODUCTION As Intel microprocessors become faster, more complex and more powerful, the demand on

Contextual Info: PERFORMANCE SEMICONDUCTOR 70^25^7 □□□23b? 10b « P S C SOE » PERFORMANCE PROGRAMMABLE GATE ARRAY PPGA SERIES ¿4- High performance field programmable gate

design ideas

Abstract: Q002 CP21200 TRANSISTOR ARRAY CP21600
Contextual Info: PERFORMANCE SEMI CONDUCTOR SOE » • 7 G b 2 S cì 7 D0G23fcj7 ID b «PSC PERFORMANCE PROGRAMMABLE GATE ARRAY PPGA SERIES T^ÿé —{*?—}/ ¿4 -

cqfp package outline

Abstract: ceramic
Contextual Info: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA Mini-BGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK

PQFP chip size

Abstract: transistor ZR cqfp package outline FLATPACK ceramic package cerdip z PACKAGE J-Lead, plcc package on package chips
Contextual Info: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA SOIC W-CerPACK CQFP SOJ

ppga package

Abstract: CPGA large cavity ceramic pin grid array package wire bond PLASTIC PIN GRID ARRAY PACKAGING
Contextual Info: Plastic Pin Grid Array PPGA Packaging 13.1 13 Introduction As Intel microprocessors become faster, more complex and more powerful, the demand on package performance increases. Improvements in microprocessor speed and functionality drive package design improvements in electrical, thermal and mechanical performance. Package electrical and

Contextual Info: The following is an index of Cypress Package Diagrams. Click on the appropriate package letter, to view package diagrams under that description. TQFP PPGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP QSOP W-LCC WPGA RTSOP SOIC W-CerPACK

2N7042

Abstract: ipos 150 3.3 CD100 transistor intel pentium 4 motherboard schematic diagram cd114b SOT-23 la22 CD102 cd110 capacitor CD85 cdqa2
Contextual Info: Intel Celeron Processor PPGA with the Intel® 440LX AGPset Design Guide February 1999 Order Number: 245088-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

BPNPA16P

Contextual Info: Data Sheet November 1997 microelectronics group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNGA, PNPA, and PPGA Features • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,

Contextual Info: March 1997 DataSheet microelectronics group * r Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNGA, PNPA, and PPGA Features Description • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,

Contextual Info: Data Sheet August 1997 microelectronics group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNGA, PNPA, and PPGA Features • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,

Contextual Info: MAIN INDEX GO TO WEB The following is an index of Cypress Package Diagrams. Click on the appropriate package letter to view package diagrams under that description. TQFP PPGA Mini-BGA Thin BGA BGA CerDIP CQFP CerSOJ CPGA WLCC PLCC CerPACK LCC PQFP SSOP PDIP

apic - s03

Abstract: APIC D06 active aa33 APIC S03 AH36 T04 943 AK32 AM32 AM34 AN33
Contextual Info: Pentium Processor with MMX Technology 8.0 Pentium Processor® with MMX™ Technology Packaging Information 8.1 Pinout Figure 31. Pentium® Processor with MMX™ Technology PPGA Package Pinout - Top Side View 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 20 19

Pentium Processors

Abstract: C 548 B 430TX 82430TX 296-Pin
Contextual Info: Low-Power Embedded Pentium Processors with MMX Technology PRODUCT HIGHLIGHTS • Low-power Pentium® processor with MMX™ technology for embedded applications: 166 and 266 MHz, PPGA and HL-PBGA packaging ■ Surface mount high thermal, low-profile Plastic Ball Grid Array

Contextual Info: Preliminary Data Sheet + March 1997 microelectronics ~ ~ group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNGA, PNPA, and PPGA Features Description • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,

t3055el

Abstract: 82443zX hd Intel 440ZX-66 AGPset philips HD6 series 82443ZX foxconn t15 intel pentium 4 motherboard schematic diagram what is the state name for 74HC112 CRYSTAL 14.318MHZ 440ZX-66
Contextual Info: Intel Celeron Processor PPGA with the Intel® 440ZX-66 AGPset Design Guide March 1999 Order Number: 245126-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual

Contextual Info: Data Sheet July 1998 group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNG A, PNPA, and PPGA Features • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption, and significantly lower levels of EMI

Pentium 166 MMX

Abstract: Pentium Processors Socket-7 296 430TX 82430TX Pentium MMX 166 Processor PPGA 296-Pin
Contextual Info: Low-Power Pentium Processors with MMX Technology for Embedded Applications PRODUCT HIGHLIGHTS • Low-power Pentium® processor with MMX™ technology for embedded applications: 166 and 266 MHz, PPGA and HL-PBGA packaging ■ Surface mount high thermal, low-profile

pentium MOTHERBOARD CIRCUIT diagram

Abstract: T40 N03 am24 "pin compatible" processor cross reference intel pentium MMX simd 1997 z02 surface mounted transistor
Contextual Info: Low-Power Embedded Pentium Processor with MMX Technology Datasheet Product Features • ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.9 V 166/266 MHz Core Supply for PPGA — 1.8 V (166 MHz) or 2.0 V (266 MHz)

Bulk Decoupling 430TX

Abstract: Socket-7 296 430TX Configuration 273232 SL Enhanced GC80503CSM66166 FV80503
Contextual Info: Low-Power Embedded Pentium Processor with MMX Technology Datasheet Product Features • ■ ■ ■ ■ Support for MMX™ Technology Low-Power 0.25 Micron Process Technology — 1.9 V 166/266 MHz Core Supply for PPGA — 1.8 V (166 MHz) or 2.0 V (266 MHz)

DG1A

Contextual Info: Data Sheet November 1997 m icro e le ctro n ics group Lucent Technologies Bell Labs Innovations Quad Differential Drivers DG1A, DP1A, DGLA, PNG A, PNPA, and PPGA Features • Pin-equivalent to the general-trade 26LS31 device, with improved speed, reduced power consumption,