PQFP 132 PACKAGE DIMENSION Search Results

PQFP 132 PACKAGE DIMENSION intel

Abstract: Intel 100 pin PQFP dimension DIMENSIONS PQFP 132 DIMENSIONS pqfp 100 PQFP dimension intel
Contextual Info: Intel386 DX PQFP MICROPROCESSOR 2.0 MECHANICAL DATA 2.1 Package Dimensions The Intel386 DX is available in a 132 lead plastic quad flat pack PQFP package. Table 2.1 and Figures 2.1-2.5 show the physical dimensions of this package. Table 2.1. Intel Case Outline Dimensions for 132 Lead Plastic Quad Flat Pack 0.025 Inch Fitch

n03n

Abstract: DSP56002 ti31 58af S-8675 S-7641 TXC 40MHz xtal S7504 TXC 40MHz oscillator Nippon capacitors
Contextual Info: Order this document by DSP56002/D MOTOROLA - SEMICONDUCTOR TECHNICAL DATA Advance Information 24-Bit General Purpose Digital Signal Processor DSP56002 Pin Grid Array PGA Available in a 132 pin ceramic throughhoie package. Plastic Quad Flat Pack (PQFP) Available in a 132 pin, small footprint,

DIMENSIONS PQFP 132

Abstract: MO-069 TS-0361
Contextual Info: OEM PQFP Sockets • Accepts JEDEC MO-069 packages, lead counts 84, 100 and 132 • .025" 0.64mm center line contacts for high-density packaging • Lid design separates, maintains IC lead spacing • Lid acts as package carrier and transport protector • Lid is compatible with conventional package

MO-069

Abstract: TS-0361-13 2100-7243-00-1807 2132-7244-YY-1807 2132-7244-75-1807
Contextual Info: OEM PQFP Sockets • Accepts JEDEC MO-069 packages, lead counts 84, 100 and 132 • .025" 0.64mm center line contacts for high-density packaging • Lid design separates, maintains IC lead spacing • Lid acts as package carrier and transport protector • Lid is compatible with conventional package

b 87 af s 1080

Abstract: DB3-5D
Contextual Info: CMOS SyncFlFO 512x36,1,024x36 and 2,048 x 36 \dt ! IDT723631 IDT723641 IDT723651 Integrated Device Technology, Inc. • Available in 132-pin plastic quad flat package PQFP) or space-saving 120-pin thin quad flat package (TQFP) • Industrial temperature range ( ^ 0 ° C to +85°C) is available

DSP56001A

Abstract: PB10 PB12 1147 x motorola DIMENSIONS PQFP 132 FE 132-CQFP
Contextual Info: Pin-out and Package General Purpose I/O Pin Tables The DSP56001A signals which may be programmed as general purpose I/O are listed with their primary function in Table 18. Table 19 and Table 20 identify pins on each package in numeric order. Table 21 identifies each signal name in order while giving the pin number for each

MC68330

Abstract: MC68330FC16
Contextual Info: SECTION 9 ORDERING INFORMATION AND MECHANICAL DATA This section contains the pin assignments and package dimensions of the MC68330. In addition, detailed information is provided to be used as a guide when ordering. 9.1 STANDARD MC68330 ORDERING INFORMATION

LC4064V

Abstract: Lattice ispmach LC4064V ispMACH 4A5 flip chip bga 0,8 mm OR3T80 LC4064 OR3C80 OR3T20 OR3T30 OR3T55
Contextual Info: Lattice Package Offering Packages shown actual size. All dimensions refer to package body size. 32-Pin QFN 5 x 5 mm 0.5 mm pitch 6 x 6 mm 0.5 mm pitch 23 x 23 mm 1.0 mm pitch 27 x 27 mm 1.27 mm pitch 100-Ball fpBGA 132-Ball csBGA 56-Ball csBGA 11 x 11 mm 1.0 mm pitch

N1056

Abstract: D1589 A9422 DSP56002 PB10 PB12 a12e3 TQFP 144 PACKAGE DIMENSION
Contextual Info: Pin-out and Package General Purpose I/O The DSP56002/L002 signals which may be programmed as general purpose I/O are listed with their primary function in Table 22. Table 23-Table 25 identify pins on each package in numeric order. Table 26 identifies each signal name in order while giving the pin number for each

LFXP2-8E

Abstract: LFXP2-40E LFXP2-5E LFXP20C theta jc FCBGA LFXP2-17E LFE3-17 Theta JB LFXP15C LFXP2-8E 132
Contextual Info: Thermal Management July 2009 Introduction Thermal management is recommended as part of any sound CPLD and FPGA design methodology. To properly assess the thermal characteristics of the system, Lattice Semiconductor specifies a maximum allowable junction temperature in all device data sheets. The system designer should always complete a thermal analysis of their specific design to ensure that the device and package does not exceed the junction temperature requirements.

MACH4A

Abstract: JTAG jtag mhz jtag 14 PQFP-144 ispLSI 2128-A M4A5-64 M5A3-384
Contextual Info: 208-Ball BGA 256-Ball BGA 100-Ball BGA 49-Ball BGA 144-Ball BGA ® Fine Pitch BGA ispLSI, MACH, ispGDX & ispGAL Packages ® 7.00 x 7.00 mm 0.8 mm pitch 10.00 x 10.00 mm 0.8 mm pitch 13.00 x 13.00 mm 1.0 mm pitch 17.00 x 17.00 mm 1.0 mm pitch All dimensions refer to package body size

M68ICD32

Abstract: DIMENSIONS PQFP 132 68HC16Y1 ICD16 M68MPFB1632 Motorola 514 MEVB1632 M68MPB331B M68MEVB1632 ICD32 debugging
Contextual Info: MEVB1632/D Rev 1 A modular approach to product development - MEVB1632 Modular Evaluation Board The M68MEVB1632 Modular Evaluation Board MEVB provides an economical, integrated solution for designing, debugging, and evaluating MCU operations of the M68HC16 and M68300 MCU families.

actel 1240a

Abstract: TI1139 UI02 1280xl actel 1240xl 132 pga UJ-01 U1H-18 110E06 SI 1020A Actel A1225
Contextual Info: Actel Device Reliability Report Actel’s field programmable gate arrays FPGAs are currently available in five product families—ACT 1, ACT 2, 1200XL, 3200DX, and ACT 3. The ACT 1 family consists of the A1010 and A1020, which are 1200- and 2000-gate FPGAs,

Intel 8086 physical characteristics

Abstract: Intel 100 pin PQFP dimension 80286 microprocessor features 80286 microprocessor paging mechanism 8088 microprocessor DIMENSIONS PQFP 132 PQFP 132 PACKAGE DIMENSION intel 8088 microprocessor applications 241267 MOTHERBOARD CIRCUIT intel 8088
Contextual Info: Intel386 TM DX MICROPROCESSOR 32-BIT CHMOS MICROPROCESSOR WITH INTEGRATED MEMORY MANAGEMENT PQFP SUPPLEMENT Y Y Y Y Y Y Flexible 32-Bit Microprocessor 8 16 32-Bit Data Types 8 General Purpose 32-Bit Registers Very Large Address Space 4 Gigabyte Physical

Contextual Info: t r ä n S w it c h -X-TB-524 TECHNICAL BULLETIN QEIM VLSI Device, TXC-04252 PRODUCT PREVIEW Plastic Ball Grid Array Package Option for OE1M Device PURPOSE OF THTS TECHNICAL BULLETIN TranSwitch is introducing an additional package option for the QEIM Quad E l Mapper VLSI Device. The

PQFP 132 PACKAGE DIMENSION intel

Abstract: 82358 EISA chip set intel 82350 PQFP dimension intel DIMENSIONS PQFP 132 DIMENSIONS pqfp 100 82350 Intel PQFP 231369
Contextual Info: ¡ntéT M y M O N IM V 82350 MECHANICAL DATA Introduction PACKAGING INFORMATION See Packaging Spec. Order # 231369 The individual components of Intel’s EISA Chip Set come in JEDEC standard Gull Wing packages (25 MIL pitch), with "bumpers” on the corners for ease

land pattern PQFP 132

Abstract: PQFP 132 PACKAGE DIMENSION MO-112 N2979 land pattern PQFP 208
Contextual Info: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L

m0-112

Abstract: land pattern PQFP 132 MO-069 tc 4049 MO-112
Contextual Info: PACKAGE DIAGRAM OUTLINES PQFP Continued PACKAGE DIAGRAM OUTLINES PQFP (Continued) R E V ISIO N S DWG § s Y M B □ REV DESCRIPTION DATE 27649 04 REDRAW TO JEDEC FORMAT 01/24/92 APPROVED P Q 80- JEDEC VARIATION N □ B E -2 LAND PATTERN DIMENSIONS T E L

CERAMIC LEADLESS CHIP CARRIER LCC 24

Abstract: CERAMIC LEADLESS CHIP CARRIER LCC 124 MIL-STD-1835 CERAMIC LEADLESS CHIP CARRIER LCC 68 pad 20P3 TQFP 144 PACKAGE DIMENSION MS-018 CERAMIC LEADLESS CHIP CARRIER CERAMIC LEADLESS CHIP CARRIER LCC 68
Contextual Info: Packages Table of Contents Each Atmel data sheet includes an Ordering Information Section which specifies the package types available. This section provides size specifications and outlines for all package types. 1 Package Description See Page 44A 44 Lead, Thin (1.0 mm)

PQFP 132 PACKAGE DIMENSION intel

Contextual Info: intei G^dUKfflOIMOW DX MICROPROCESSOR 32-BIT CHMOS MICROPROCESSOR WITH INTEGRATED MEMORY MANAGEMENT PQFP SUPPLEMENT ln t e l 386 TM Flexible 32-Bit Microprocessor — 8, 16, 32-Bit Data Types — 8 General Purpose 32-Bit Registers Very Large Address Space

floppy drive emulator

Abstract: motorola 5118 motorola Base Station motorola Built in self-test 9pin rs232 motorola 3906 611 motorola data sheet mmds hi-light MC68332A M68HC12
Contextual Info: MMDS1632/D REV 1 A modular approach to product development - MMDS1632 Motorola Modular Development System The MMDS1632 provides high-speed, real-time hardware and software emulation for target systems based on Motorola’s M68HC16 and M68300 families. This full-featured development system uses

HP16505A

Contextual Info: Discontinued Product—Support Information Only This literature was published years prior to the establishment of Agilent Technologies as a company independent from Hewlett-Packard and describes products or services now available through Agilent. It may also refer to products/services no longer supported by Agilent.

Contextual Info: [ P f ô iy R i f l O l M G W in te i Intel386 DX MICROPROCESSOR 32-BIT CHMOS MICROPROCESSOR WITH INTEGRATED MEMORY MANAGEMENT PQFP SUPPLEMENT Flexible 32-Bit Microprocessor — 8, 16, 32-Bit Data Types — 8 General Purpose 32-Bit Registers Very Large Address Space

Contextual Info: in te i ß N iy B M M V Intel386 DX MICROPROCESSOR 32-BIT CHMOS MICROPROCESSOR WITH INTEGRATED MEMORY MANAGEMENT PQFP SUPPLEMENT Flexible 32-Blt Microprocessor — 8, 16, 32-Bit Data Types — 8 General Purpose 32-Bit Registers Very Large Address Space