PQFP DIE SIZE Search Results

PQFP die size

Contextual Info: Thermal Data  PQFP 44 44 leads PACKAGE MATERIAL LIST item # material thickness thermal conductivity leadframe copper 0.25 mm 2.61 W/cm°C die attach epoxy glue silver filler 10-40 µm 0.01 W/cm°C molding compound epoxy resin 2.8 mm 0.0063W/cm°C Charts enclosed :

EPM7128SLC84-15

Abstract: EPF10K10LC84-4 EPM7064SLC44-10 ALTERA MAX 5000 programming vhdl code for booth encoder PLMQ7192/256-160NC bga 208 PACKAGE EPM7160 Transition EPF10K70RC240-4 teradyne flex
Contextual Info: Newsletter for Altera Customers ◆ Third Quarter ◆ August 1997 Altera Ships the New, Low-Cost FLEX 6000 Family Altera recently began shipping the new, low-cost FLEX 6000 programmable logic device family, which offers die size and cost that are directly comparable to

APA600

Abstract: APA450
Contextual Info: Application Note AC264 ProASICPLUS SSO and Pin Placement Guidelines Introduction Ground bounce and VDD bounce have always been present in digital integrated circuits. With the advance of technology and shrinking CMOS features, the speed of designs, I/O slew rates, and the size of I/O busses

MP7100

Abstract: 84-1MISR4 JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97114, VERSION 1.0 August, 1997 Peripheral Controller with USB Support CY82C693U in 208 Pins PQFP Cypress Semiconductor Peripheral Controller with USB Support Devices:CY82693U Package: 208 pins PQFP QTP# 97114/97135, V1.0

In-Sil-8

Abstract: 658-25AB 658-35AB
Contextual Info: Using Heat Sinks with Larger CPLDs Introduction Increasing operating frequencies and decreasing sizes of semiconductor devices have made heat dissipation and thermal management an important issue. Both the life expectancy and reliability of a device are inversely proportional to its operating temperature. Therefore, it is essential that the operating temperature of a device is kept within the limits set by the

PCN9619

Abstract: PQFP die size PQFP ALTERA 160 EPM7192E EPM7256E
Contextual Info: PRODUCT CHANGE NOTIFICATION EPM7192E AND EPM7256E DEVICES Overview The EPM7192E and EPM7256E devices are being transitioned to a 0.65-micron process. The new die will be pin-, function-, timing-, and programming-file compatible with existing die revisions. This notification addresses Altera’s intent to substitute 0.65micron die into the EPM7192E and EPM7256E devices that currently use larger criticaldimension die.

CY7C955

Abstract: CY7C955-NC JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 97105 VERSION 1.0 September, 1997 ATM-SONET/SDH TRANSCEIVER CY7C955 Cypress Semiconductor ATM-SONET/SDH Transceiver Device: CY7C955 Package: PQFP QTP# 97105, V. 1.0 Page 2 of 6 September, 1997 PRODUCT DESCRIPTION for qualification

ACT1020

Abstract: JH05 MARKING CODE N-CHANNEL MOS FIELD EFFECT TRANSISTOR 44 pin actel 1020b JEDEC-A113 ACTEL 1020B ACP55 smd U1p Jl03 JL-03
Contextual Info: Quality & Reliability Guide February 2001 2001 Actel Corporation All Rights Reserved. Actel and the Actel logo are trademarks of Actel Corporation. All other brand or product names are the property of their respective owners. Contents 1. Overview of Actel’s Quality and Reliability Guide . . . . . . . . . . . . . . . . . . . .1

Contextual Info: AT40K05, AT40K10, AT40K20, AT40K40 5K – 50K Gates Coprocessor FPGA with FreeRAM DATASHEET Features  Ultra high performance System speeds to 100MHz Array multipliers > 50MHz  10ns flexible SRAM  Internal tri-state capability in each cell  

D2863-77

Abstract: Plastic Encapsulate Diodes bond wire copper hermetic packages PCB land circuit for wind mill footprint plcc 208 cmos methane SENSOR land pattern PQFP 208
Contextual Info: GENERAL INFORMATION Packages INTRODUCTION P lastic surface-mount package designs were developed in the late 1970s in answer to the demand for costeffective solutions to achieving greater board density without sacriÞcing reliability or functionality. Recent developments in these

tqfp 44 thermal resistance

Abstract: tqfp 64 thermal resistance CPGA MQUAD PQFP-128 TQFP 132 PACKAGE Package 48 LCC CQFP 240
Contextual Info: Thermal Resistance of Packages 4401035 NC Thermal Resistance of Packages Similarly, thermal resistance from junction to case is denoted by θ JC , and defined by θ JC = T j – T c ⁄ P d ; here, T c is the case temperature (˚C) at the external surface of the package.

SUMITOMO EME6600

Abstract: EME6600 Compound 6600cs 3818 MIL-STD-883c-method 1010 6600CS
Contextual Info: Cypress Semiconductor Package Qualification Report QTP# 99234 VERSION 1.1 September 2000 52-208-pin Plastic Quad Flatpack Package PQFP Sumitomo 6600CS molding Compound ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director

99045

Abstract: CY37512P208-NC JESD22 ASE Cypress copper bond wire
Contextual Info: Cypress Semiconductor Qualification Report QTP# 99045 VERSION 1.0 September, 1999 208 Lead PQFP ASE Taiwan CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Manager 408 432-7068 Cypress Semiconductor Assembly: ASE Taiwan Package: 208 Lead PQFP

Nitto

Abstract: MOLDING MATERIAL MP8000 Nitto MP 8000 MP-8000 JEDEC22 mp8000 Nitto MP8000 CY7C611 84-1lmis JESD22
Contextual Info: Cypress Semiconductor Qualification Report QTP# 98422 VERSION 1.0 May, 1999 Nitto MP-8000 Molding Compound 160 Ld Plastic Quad Flat Pack PQFP (CY7C611) Asat, Hong Kong Assembly CYPRESS TECHNICAL CONTACT FOR QUALIFICATION DATA: Ed Russell Reliability Director

IS61SP25636

Abstract: s62lv256 256x16 sram 89C64 IS41LV16105 soj44 non-volatile SRAM 4KX8 issi 32kx16 IS80C31 64KX64
Contextual Info: ASYNCHRONOUS & APPLICATION SPECIFIC STATIC RAM Density Org. P/N Voltage Speeds ns Packages #Pins Status Comment Prod Prod Prod Prod Prod /CE 5V High Asyncronous SRAM 64K 256K 512K 1M 8Kx8 32Kx8 32Kx16 32Kx16 128Kx8 IS61C64B IS61C256AH IS61C3216 IS61C3216B

AF3 din 74

Abstract: PQFP-128 footprint AT40K AT40K05 AT40K05LV AT40K10 AT40K10LV AT40K20 AT40K20LV AT40K40
Contextual Info: Features • Ultra High Performance • • • • • • • • • – System Speeds to 100 MHz – Array Multipliers > 50 MHz – 10 ns Flexible SRAM – Internal Tri-state Capability in Each Cell FreeRAM – Flexible, Single/Dual Port, Synchronous/Asynchronous 10 ns SRAM

Sis 968

Abstract: EPF10K100GC503-4 EPM7160 Transition altera TTL library EPF6024AQC208 EPM7128 EPLD epm7192 PL-BITBLASTER PLMG7192-160 PLMQ7192/256-160NC
Contextual Info: Newsletter for Altera Customers ◆ First Quarter ◆ February 1998 Altera’s 3.3-V ISP-Capable MAX 7000A Devices In recent years, an increasing number of engineers have moved their designs to a 3.3-V supply voltage environment. See Figure␣ 1. However, because the

92121

Abstract: PQFP die size
Contextual Info: CLOCK DRIVER PACKAGE SPECIFICATIONS >M CC 52-PIN PQFP MECHANICAL DIMENSIONS Applied Micro Circuits Corporation 6195 Lusk Blvd., San Diego, CA 92121 • 619 450-9333 Page 10-181 JM A C C 52-PIN PQFP MECHANICAL DIMENSIONS 5 2 PQFP LANDPATTERN 14 x 14 x 2 . 0 x 3 .2 m m

atmel 0945

Abstract: atmel 428
Contextual Info: pkg-3.5-04/98 Packaging Introduction . 4-3 Package Options: Table . 4-3

ATMEL08

Contextual Info: AT40K05, AT40K10, AT40K20, AT40K40 5K – 50K Gates Coprocessor FPGA with FreeRAM DATASHEET Features  Ultra high performance System speeds to 100MHz Array multipliers > 50MHz  10ns flexible SRAM  Internal tri-state capability in each cell  

EPC16UI88

Abstract: PQFP-100 Package footprint Altera EPC
Contextual Info: Enhanced Configuration EPC Devices Datasheet CF52002-3.0 Datasheet This datasheet describes enhanced configuration (EPC) devices. Supported Devices Table 1 lists the supported Altera  EPC devices. Table 1. Altera EPC Devices Memory Size (bits) On-Chip

tqfp 44 thermal resistance datasheet

Abstract: tqfp 44 thermal resistance plcc junction to ambient resistance 500LFM QL12X16B QL16X24B QL24X32B QL8X12B Thermal Resistance Calculation TO
Contextual Info: THERMAL MANAGEMENT The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external environment. This is represented in

Theta-JC

Abstract: theta JA Theta-JC plcc tqfp 44 thermal resistance datasheet 500LFM QL12X16B QL16X24B QL2003 QL2005 QL2007
Contextual Info: 9 The thermal performance of a pASIC in its package is determined by many factors, including packaging materials, die size, package design and construction, etc. Thermal resistance is the measure of the ability of the package to conduct heat from the chip through the package to the external

JEDEC Matrix Tray outlines

Abstract: IspLSI PCMCIA copper bond wire micro semi BGD35
Contextual Info: Packages INTRODUCTION Vantis provides its programmable logic devices PLDs in a wide range of packages. These packages provide benefits such as high power dissipation capability, small footprint, and high I/O. This section provides details about the packages that Vantis supplies.