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    PRECONDITIONING Search Results

    PRECONDITIONING Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF PDF Size Page count
    PRECONDITIONING OF SMT PACKAGES
    		National Semiconductor Preconditioning of SMT Packages Original PDF 16.36KB 2

    PRECONDITIONING Datasheets Context Search

    Catalog Datasheet Type Document Tags PDF

    P-18585

    Abstract: DS1233
    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1233 Oct-96 9644 A5 CARSEM DM635839AAA 1.2µ NITRIDE 03 SOT223 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase


    Original     		DS1233 Oct-96 DM635839AAA OT223 P-18585 P-18652 P-18653, P-18764 P-18765 P-18585 DS1233 PDF

    16875

    Abstract: ds1232 P-16852 16876
    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1232 Jan-96 9547 C1 ANAM, K. DN537172ABA 3.0µ OX/NI 16 SOIC STRESS/JOB NO. Preconditioning P/C : HTC Vapor Phase P-16818 READPOINT (Sample Size/No. of Fails)


    Original     		DS1232 Jan-96 DN537172ABA P-16818 P-16852 P-16853, P-16875 P-16876 16875 ds1232 P-16852 16876 PDF

    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS5002 Apr-97 9712 M3 ANAM, K. DN507374ABY 1.2µ OX/NI 80 PQFP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase


    Original     		DS5002 Apr-97 DN507374ABY P-19491 P-19494 P-19495, P-19530 P-19531 PDF

    an 17820

    Abstract: DS2107A
    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2107A Jul-96 9623 A6 ANAM, K. DN604282AAB1 1.2µ NITRIDE 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase


    Original     		DS2107A Jul-96 DN604282AAB1 P-17820 P-17863 P-17864, P-17904 P-17905 an 17820 DS2107A PDF

    P-20460

    Abstract: 20461 DS2181A
    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2181A Aug-97 9728 A2 ANAM, K. DN722742ABB 2.0µ OXIDE 44 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): T/C: -55°C to +125°C, 10~


    Original     		DS2181A Aug-97 DN722742ABB P-20243 P-20302 P-20303, P-20458 P-20459 P-20460 20461 DS2181A PDF

    LTM4602

    Abstract: LTM4600 LTM4601 15X15 0623 IPC-9701 IPC 9701 power one date code
    Contextual Info: RELIABILITY DATA LTM4600 / LTM4601 / LTM4602 1/15/2007 • OPERATING LIFE TEST PACKAGE TYPE SAMPLE SIZE OLDEST DATE CODE NEWEST DATE CODE DEVICE HOURS 1 EQV to +100°C LGA 15X15 551 0452 0645 2,820,404 551 2,820,404 • J-STD-020 LEVEL 4 PRECONDITIONING4 (96 HOURS 30°C/60%RH + 3X IR REFLOW +245°C)


    Original     		LTM4600 LTM4601 LTM4602 15X15 J-STD-020 LTM4600/4601/4602 LTM4600 LTM4602 15X15 0623 IPC-9701 IPC 9701 power one date code PDF

    DS2165

    Abstract: APR97
    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2165 Apr-97 9651 B1 HYUNDAI DL622720AAA 1.2µ OXIDE 24 PDIP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning: T/C: -55°C to +125°C, 10~


    Original     		DS2165 Apr-97 DL622720AAA P-19489 P-19488 P-19489, P-19534 P-19535 DS2165 APR97 PDF

    DS12885

    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS12885 Nov-95 9538 A2 ANAM, K. DN531869AAD1 1.2µ OX/NI 24 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase


    Original     		DS12885 Nov-95 DN531869AAD1 P-16605 P-16649 P-16650, P-16679 P-16680 DS12885 PDF

    21103

    Abstract: transistor HR DS1267 p21105 HR 250 P21103 P-21105
    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1267 Nov-97 9737 A1 ANAM, PI. DK727730AAA 1.2µ OX/NI 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): 0 Hr


    Original     		DS1267 Nov-97 DK727730AAA P-20871 P-20990 P-20991, P-21102 P-211JOB 21103 transistor HR DS1267 p21105 HR 250 P21103 P-21105 PDF

    DS1267

    Abstract: P-17298
    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1267 Apr-96 9612 A1 HYUNDAI DL603183AAL 1.2µ OX/NI 16 SOIC STRESS/JOB NO. Preconditioning P/C : HTC Vapor Phase P-17251 READPOINT (Sample Size/No. of Fails)


    Original     		DS1267 Apr-96 DL603183AAL P-17251 P-17298 P-17299, P-17411 P-17412 DS1267 P-17298 PDF

    1754-3

    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS12885 May-96 9617 A2 HYUNDAI DL607533AAI 1.2µ OX/NI 24 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase


    Original     		May-96 P-17523 P-17543 P-17544, P-17640 P-17641 P-17642 C/100% P-17643 DL607533AAI 1754-3 PDF

    Contextual Info: Implementing FIR Filters January 1996, ver. 1 Introduction in FLEX Devices Application Note 73 The finite impulse response FIR filter is used in many digital signal processing (DSP) systems to perform signal preconditioning, antialiasing, band selection, decimation/interpolation, low-pass filtering, and


    Original     		PDF

    74 HTC 08

    Abstract: 74 HTC 00 P-20606
    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Sep-97 9737 A6 CARSEM DM718527ABB 1.2µ OX/NI EPROM 08 SOIC 150 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):


    Original     		DS2502 Sep-97 P-20518 P-20556, P-20606 DM718527ABB P-20607 P-20608 P-20609 74 HTC 08 74 HTC 00 PDF

    40 RH 304

    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1267 Oct-95 9544 A1 HYUNDAI DL508411AAK 1.2µ OX/NI 16 SOIC STRESS/JOB NO. Preconditioning P/C : 85°C/85% RH, 168 hours HTC Vapor Phase, 3 Passes


    Original     		DS1267 Oct-95 P-16441 P-16440 P-16685, P-16695 P-16696 P-16697 C/100% P-16698 40 RH 304 PDF

    18704

    Abstract: P-18701
    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS21S07A Nov-96 9627 B2 ANAM, PI. DK623631ABA2 0.8µ NITRIDE 20 TSSOP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):


    Original     		Nov-96 P-18596 P-18639 P-18640, P-18701 P-18702 P-18703 C/100% P-18704 DK623631ABA2 18704 PDF

    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2180A May-97 9712 B3 ANAM, K. DN704701AAJ 2.0µ OXIDE 44 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): T/C: -55°C to +125°C, 10~


    Original     		May-97 P-19660 P-19695 P-19696, P-19774 P-19775 P-19776 C/100% P-19777 DN704701AAJ PDF

    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS1620 Dec-96 9639 C2 OMEDATA DD631336AAA 1.2µ OX/NI 08 SOIC 208 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase


    Original     		Dec-96 P-18887 P-18931 P-18932, P-18988 P-18989 P-18990 DD631336AAA DS1620 PDF

    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2181A Aug-97 9728 A2 ANAM, K. DN722742ABB 2.0µ OXIDE 44 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): T/C: -55°C to +125°C, 10~


    Original     		Aug-97 P-20243 P-20302 P-20303, P-20458 P-20459 P-20460 C/100% P-20461 DN722742ABB PDF

    dk52

    Abstract: P17318
    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2165 Apr-96 9534 B1 ANAM, PI DK523559AAC 2.0µ OXIDE 24 PDIP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning: T/C: -55°C to +125°C, 10~


    Original     		Apr-96 P-17245 P-17244 P-17245, P-17318 P-17319 P-17320 C/100% P-17321 DK523559AAC dk52 P17318 PDF

    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS12885 Dec-95 9501 A2 ANAM, K. DN444456AAG 1.2µ OX/NI 28 PLCC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Cum % 0.0% Preconditioning (P/C):


    Original     		Dec-95 P-16742 P-16771 P-16772, P-16785 P-16786 P-16787 C/100% P-16788 DN444456AAG PDF

    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2502 Dec-95 9546 A6 CARSEM DM534661ANA 1.2µ OX/NI EPROM 08 SOIC 150 STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C):


    Original     		DS2502 Dec-95 P-16744 P-16774, P-16894 P-16895 P-16896 P-16897 DM534661ANA 27ditioning PDF

    16889

    Abstract: B/TDA 16840
    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS2107A Jan-96 9552 A6 CARSEM DM510561AAA 1.2µ NITRIDE 16 SOIC STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase


    Original     		Jan-96 P-16840 P-16873 P-16874, P-16887 P-16888 P-16889 C/100% P-16890 DM510561AAA 16889 B/TDA 16840 PDF

    P-18366

    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS5002 Oct-96 9546 M3 ANAM, K. DN531428AAA1 1.2µ OX/NI 80 PQFP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Preconditioning (P/C): HTC Vapor Phase


    Original     		Oct-96 P-18338 P-18366 P-18367, P-18399 P-18400 P-18401 C/100% P-18402 DN531428AAA1 PDF

    Contextual Info: RELIABILITY MONITOR PRODUCT MONITOR DATE DATE CODE ASSEMBLY FACILITY ASSEMBLY LOT NO PROCESS TYPE PACKAGE TYPE DS5002 Oct-97 9738 B3 CARSEM DM722224AAB 1.2µ OX/NI 80 PQFP STRESS/JOB NO. READPOINT Sample Size/No. of Fails Electrical Cum % 203/0 0.0% Preconditioning (P/C):


    Original     		Oct-97 DM722224AAB DS5002 P-20706 P-20757 P-20758, P-20837 P-20838 P-20839 C/100% PDF