PRESSURE LOW DIE ATTACH Search Results

SM5430

Abstract: SM5470 MEDICAL PRESSURE die
Contextual Info: SILICON MICROSTRUCTURES INCORPORATED • SM5430/SM5470 Low Cost Packaged Pressure Sensors SURFACE MOUNT AND DIP PRESSURE SENSORS LOW-COST PACKAGED DIE DESCRIPTION Silicon Microstructures provides its two most popular pressure sensor die in surface mount dual in-line package SO-16

Contextual Info: Surface Mount and DIP Pressure Sensors Low-cost packaged die Model Model Model Model 5310 standard pressure surface m ount 5350 ( low-pressure surface m ount) 5410 ( standard pressure DIP) 5450 ( low-pressure D IP) Description Silicon Microstructures provides its

Contextual Info: SILICON MICROSTRUCTURES DIVISION SM5310 Std. Pressure SMT SM5350 Low Pressure SMT SM5410 Std. Pressure DIP SM5450 Low Pressure DIP October 1997-1 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres­

5310

Abstract: barometric pressure sensor SM5310
Contextual Info: SILICON MICROSTRUCTURES DIVISION SM-5310 Std. Pressure SMT SM-5350 Low Pressure SMT SM-5410 Std. Pressure DIP SM-5450 Low Pressure DIP April 1997-4 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres­

Contextual Info: Z *EX A R SILICON MICROSTRUCTURES DIVISION SM5310 SM5350 SM5410 SM5450 Std. Pressure SMT Low Pressure SMT Std. Pressure DIP Low Pressure DIP O cto b e r 1997-1 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres­

Contextual Info: SM-5310 Std. Pressure SMT SM-5350 Low Pressure SMT SM-5410 Std. Pressure DIP SM-5450 Low Pressure DIP I N C O R P O R A T E D an company Surface Mount and DIP Pressure Sensors Low-cost packaged die Description Silicon Microstructures provides its two most popular pressure sensor

MEDICAL PRESSURE die

Abstract: consumer LOW PRESSURE SENSOR pressure low die attach Exar cross low PRESSURE die pressure low die bond sensor SM5310 Silicon Microstructures
Contextual Info: ær EXAR SILICON MICROSTRUCTURES SM5310 Std. Pressure SMT ImSi n Z . Low Pressure SMT Std. Pressure DIP SM5450 d iv is io n Low Pressure DIP O cto b e r 1997-1 Surface Mount and DIP Pressure Sensors Low-cost packaged die DESCRIPTION EXAR provides its two most popular pres­

SENSYM SX7100D

Abstract: span zero circuits working SX7030D SX7100D SX7150D RTV 730 SX7300D SENSYM 150 SX7015D SENSYM
Contextual Info: 1 to 300 psig Pressure Sensors in a Button Package APPLICATIONS Medical Equipment Computer Peripherals Pneumatic Controls HVAC FEATURES Button Package High Pressure Small Size Low Noise RTV 730 Die Attach EQUIVALENT CIRCUITS Vs The SX7 Series sensors offer a high pressure sensor

CPR3-AN03

Abstract: pressure low die attach UP78 silicon carbide LED cree AuSn eutectic ejector 0.5um silicon carbide LED bonding wire cree
Contextual Info: APPLICATION NOTE XThinTM Sn Die Attachment Recommendations This applications note provides the user with a basic understanding of Cree’s new low temperature attach version XThin chips, information on the recommended packaging, and an overview of some constraints to be considered when packaging the chips.

SX7100D

Abstract: SX7300D RTV 730 SX7300 SX7001D SX7005D SX7015D SX7030D SX7150D
Contextual Info: SX7 Series 1 psig to 300 psig Button Package Plastic Silicon Pressure Sensors DESCRIPTION The SX7 Series sensors offer a high pressure sensor in a very small “button” style package. These special devices use an RTV 730 for die attach to allow measurement of gauge pressures of 1 psi SX7001D to 300

RSK-401

Abstract: Thomas Betts wt RSK-201 RSK-301 MIL-F-21608 WT-740 trap connector RSK401 301JG RSK101
Contextual Info: Connector for Shielded Wire SHIELD-KON “Wrap-Around” RSK Connector for Shielded Pair Wire This solderless wrap-around connector provides a quick means of attaching a ground lead to shielded pair wire…without soldering. The low profile crimping tool and connector make grounding in crowded central offices much quicker, cleaner and easier.

Contextual Info: Chip Mounting and Handling of GaAs MMIC Chips CHIP DIE DOWN BONDING TECHNIQUES Die Attach The important considerations for die attach are to have low thermal resistance, strong mechanical bond over the desired temperature range, and no damage occurring to the chip

SMT330

Contextual Info: SX SMT Series Microstructure Pressure Sensors 0 psi to 1 psi through 0 psi to 150 psi The SX SMT Series provides a most cost-effective method of ported device offers a tube attachment port that is particularly measuring absolute and gage pressures in a fully packaged

Contextual Info: SX SMT Series Microstructure Pressure Sensors 0 psi to 1 psi through 0 psi to 150 psi The SX SMT Series provides a most cost-effective method of ported device offers a tube attachment port that is particularly measuring absolute and gage pressures in a fully packaged

Contextual Info: SX SMT Series Microstructure Pressure Sensors 0 psi to 1 psi through 0 psi to 150 psi The SX SMT Series provides a most cost-effective method of ported device offers a tube attachment port that is particularly measuring absolute and gage pressures in a fully packaged

MPX10DP motorola

Abstract: pressure low die bond sensor RTV MPXL10
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA 10 kPa Uncompensated Silicon Pressure Sensors The MPX10 and MPXL10 series devices are silicon piezoresistive pressure sensors providing a very accurate and linear voltage output — directly proportional to the applied

MPX5010

Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPX5010 MPXL5010 SERIES Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, INTEGRATED PRESSURE SENSOR 0 to 10 kPa 0 to 1.45 psi 0.2 to 4.7 V Output Temperature Compensated and Calibrated The MPX5010 and MPXL5010 series piezoresistive

MEMS blood pressure sensor

Abstract: mems brake pressure ptc fuel level sensor Capacitive Pressure Transducer MLX90807-0 PTC-04 mems brake pressure chip capacitive pressure sensor washing MLX90807 Q100
Contextual Info: MLX90807/90808 Integrated Relative and Absolute Pressure Sensors Features and Benefits Application Examples Compact monolithic single die solution Absolute and Relative pressure sensors for different ranges Fully programmable through the connector with OTP memory

MPX200DP application notes

Abstract: MPX200 circuit 344C-01
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPX200 SERIES 200 kPa Uncompensated Silicon Pressure Sensors The MPX200 series device is a silicon piezoresistive pressure sensors provide a very accurate and linear voltage output — directly proportional to the applied pressure. This

Motorola MPX100

Abstract: Motorola MPX100A MPX100 Application notes Motorola MPX100A Pressure Sensor pressure transducer MPX100A motorola MPX100A Pressure Sensor MPX100 application note STRAIN GAUGE
Contextual Info: MOTOROLA SEMICONDUCTOR TECHNICAL DATA MPX100 SERIES 100 kPa Uncompensated Silicon Pressure Sensors The MPX100 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output — directly proportional to the applied pressure. This

KTH-1000

Abstract: KTH-1000 tools and dies KTH-1000 dies KTH1000 KTH-2000 SERIES DIE SETS KTM-5000 KTH-5000 Kings Electronics KTH-2000 CRIMP TOOLS
Contextual Info: Winchester Electronics Presents. Crimp Tools Machine Crimp Tool Product Benefits Portable, bench-mounted with no permanent airline attached. Designed for use with KINGS KTH-1000 and KTH-2000 die sets. Ideal for long or short production runs. Convenient foot control frees operator

Kings kth-1000 dies

Abstract: KTH-2000 SERIES DIE SETS KTM-5000 KTH-1000 KTH-1000 dies KTH-5000 KTH-1000 tools and dies KTH-2000 kth1000 pneumatic crimping tools
Contextual Info: Crimp Tools Product Benefits - KTM-5000 KTM-5000, KTH-1000, KTH-5000 Portable, bench-mounted with no permanent air line attached Designed for use with KINGS KTH-1000 and KTH-2000 die sets Ideal for long or short production runs Convenient foot control frees

pressure low die bond sensor RTV

Abstract: 344C 10 pin MPX10 MPX10DP pressure sensor strain gauge 344C Pressure Sensor MPXV10GC7U MPXV10GC6T1 pressure sensor response time ms Piezoresistive pressure sensors
Contextual Info: Freescale Semiconductor Technical Data MPX10 10 kPa Uncompensated Silicon Pressure Sensors The MPX10 and MPXV10GC series devices are silicon piezoresistive pressure sensors providing a very accurate and linear voltage output — directly proportional to the applied pressure. These standard, low cost, uncompensated

Contextual Info: Freescale Semiconductor Technical Data MPX12 Rev 4, 05/2005 10 kPa Uncompensated Silicon Pressure Sensors MPX12 SERIES The MPX12 series device is a silicon piezoresistive pressure sensor providing a very accurate and linear voltage output — directly proportional to the applied