PROCESS INSPECTION Search Results
PROCESS INSPECTION Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
---|---|---|---|---|---|
TMP89FM42LUG |
![]() |
8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80B |
![]() |
||
TMP89FS28LFG |
![]() |
8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP176-P-2020-0.40D |
![]() |
||
TMP89FS62BUG |
![]() |
8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/P-LQFP44-1010-0.80-003 |
![]() |
||
TMP89FM42KUG |
![]() |
8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP44-P-1010-0.80B |
![]() |
||
TMP89FH46LDUG |
![]() |
8-bit Microcontroller/Processing Performance Equivalent to a 16-bit MCU/LQFP48-P-0707-0.50D |
![]() |
PROCESS INSPECTION Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
---|---|---|---|
MIL-STD-883 Method 2010
Abstract: MIL-STD-883 method 2003
|
Original |
MIL-STD-883, MIL-STD-883 Method 2010 MIL-STD-883 method 2003 | |
Mil-Std-883 Wire Bond Pull Method 2011
Abstract: mil-std-883 mil-std-883 2015 MIL-STD883 MIL-STD-883 Method 2010 MIL-STD-883 method 2011 mil-std-883* 2015 centrifuge
|
Original |
Mil-STD-883 MIL-STD-883, Mil-Std-883 Wire Bond Pull Method 2011 mil-std-883 2015 MIL-STD883 MIL-STD-883 Method 2010 MIL-STD-883 method 2011 mil-std-883* 2015 centrifuge | |
CS1D-PA207RContextual Info: PLC-based Process Control Series Programmable Controllers CS1W-LC Loop Control Boards/Units Ver. 3.0 Version Upgrade CS1D-CPU P CS1D Process CPU Units (for Duplex-CPU Systems) WS02-LCTC1-EV5 CX-Process Tool Ver. 5.0 (Version Upgrade) CS1W-P Process Analog I/O Units 8-input Models Added to Series |
Original |
WS02-LCTC1-EV5 16-input NL-2132 CS1D-PA207R | |
wafer fab control plan
Abstract: SPC3 SPC2 LINEAR TECHNOLOGY flowchart
|
Original |
||
Contextual Info: Philips Semiconductors Surface Mounted Semiconductors General QUALITY • In-line quality assurance to m onitor process reproducibility during m anufacture and initiate any necessary corrective action. C ritical process steps are 100% under statistical process control |
OCR Scan |
MBB439 | |
statistical process control
Abstract: wafer fab control plan pareto process control system spc data sheet SPC Technology TIONA wafer fab control SPC-2 SPC-3
|
Original |
||
Contextual Info: EMI Chip Filters 4.13 to 4.16 4.13 - Production process flowchart Ceramic powder preparation 4.15 - Tests conducted during batch manufacture Syfer reliability SM product group Electrode ink material Multilayer build wet process Fire Rumble DPA inspection |
Original |
MIL-STD-123) AEC-Q200. AN0009. | |
Sample form for INCOMING Inspection of RAW MATERIAL
Abstract: INCOMING RAW MATERIAL INSPECTION form INCOMING PACKAGING MATERIAL INSPECTION form MATERIAL INSPECTION QUALITY QUANTITY inspection sampling plan
|
Original |
||
thermistor ptc 10d
Abstract: INCOMING INSPECTION PROCEDURE thermistors book 28591
|
Original |
||
visual inspection of raw materials
Abstract: quality control assurance and reliability
|
Original |
OA-003 visual inspection of raw materials quality control assurance and reliability | |
in-process quality inspections
Abstract: process flow diagram
|
Original |
||
INCOMING MATERIAL FLOW PROCESS
Abstract: outgoing quality
|
OCR Scan |
QSC-4321 INCOMING MATERIAL FLOW PROCESS outgoing quality | |
sn63pb37 solder SPHERES
Abstract: J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D
|
Original |
AN-353-4 AN-353 AN-81. sn63pb37 solder SPHERES J-STD-020 SAC305 JEDEC J-STD-020d.1 Altera Flip Chip BGA warpage reflow profile SAC305 bga ALTERA AN81 sn63pb37 solder wire sn63pb37 solder wire shelf life pcb warpage in ipc standard J-STD-020D | |
Contextual Info: CRITICAL DIMENSION INSPECTION INSTRUCTION TABLE ASSEMBLY OPERATION IN-PROCESS INSPECTION IN PROCESS 2 C3 TRIM STIFFENER C1, C2, C4 REVISION M NOTE: 1. C FJH-XX-X-XX.XX-X REPRESENTS A CRITICAL DIMENSION. LENGTH SPECIFY IN -XX INCHES .125 .0118 REF DO NOT |
Original |
002SPECIFY | |
|
|||
corcomContextual Info: i Z A jBO UL RECOGNIZED CSA CERTIFIED VDE APPROVED 0 .7 8 0 MAX LIN E IN PROCESS IN PROCESS IN PROCESS OPERATING SPECIFICATIONS, LINE VOLTAGE/CURRENT, LINE FREQUENCY, MAX. LEAKAGE CURRENT. EACH LINE TO GROUND OPERATING AMBIENT TEMP. RANGE, 0 .B 8 9 ± .0 0 B |
OCR Scan |
AMP/40 50-60HZ corcom | |
MA4GM2Contextual Info: GaAs FET MMIC Control Product Process Screening and Quality Procedures In processing G aAs FE T MMIC Control Products, consistency and reproducibility is ensured by measuring key electrical parameters on each wafer at the main steps and using the results for statistical process control. If a process goes out |
OCR Scan |
||
Contextual Info: Application Report Accurate cutting process Precision up to the second decimal place Accurate guiding of label webs during the cutting process Label webs are guided through the cutting process at a speed of up to 200 meters per minute, which is far beyond the operator’s ability to capture |
Original |
DE-01454 | |
Contextual Info: CRITICAL DIMENSION INSPECTION INSTRUCTION TABLE ASSEMBLY OPERATION IN-PROCESS INSPECTION IN PROCESS 2 C3 TRIM STIFFENER C1, C2, C4 REVISION L NOTE: L 1. C FJH-XX-X-XX-X REPRESENTS A CRITICAL DIMENSION. LENGTH SPECIFY IN -XX INCHES .125 DO NOT SCALE FROM |
Original |
||
termistor NTC
Abstract: Thermistor ntc termistor marking code Quality Thermistor SENSOR INCOMING RAW MATERIAL INSPECTION INCOMING RAW MATERIAL specification NTC Thermistor termistor plastic raw material NTC Termistor
|
Original |
||
Contextual Info: February 10, 2005 CN-502101 Product Change Notification Die Sales Production Process Change Dear Valued Customer: This notice is to inform you that Mindspeed Technologies has been notified of a process change by our die sales subcontract supplier. Reject die identified at the post-saw inspection |
Original |
CN-502101 mXX-PCN-001-A E09-901 02XXX-PCN-001-A | |
Contextual Info: Temic S e m i c o n d u c t o r s Quality Information TEMIC’s Continuous Improvement Activities • • T EM IC qualifies m aterials, processes and process changes • T EM IC uses Process FM EA Failure M ode and Effects Analysis for all processes. Process and |
OCR Scan |
||
reliability data analysisContextual Info: 1 GENERAL INFORMATION Reliability INTRODUCTION Vantis’ and AMD’s Qualification Maintenance Program QMP is used to measure the reliability of all process technologies on a regular basis. This is an extensive effort that is aimed at providing generic fab process coverage for all fab process technologies. Typically about 30,000 devices per |
Original |
||
A -1123* test
Abstract: Family of Testability Products process flow diagram
|
Original |
||
Contextual Info: Temperature & Process Controller Operator’s Manual NEWPORT Electronics, Inc. http://www.newportUS.com/i Additional products from ® NEWPORT Electronics, Inc. Counters Frequency Meters PID Controllers Clock/Timers Printers Process Meters On/Off Controllers |
Original |
1-800-NEWPORT 800-NEWPORTSM D-75392 M3355/N/1102 |