PTI 30 040 GA Search Results

DM51157-8

Abstract: 12f 5091 DM53740-5001 dm53740-16 DM53742-18 DM53742-5001 M24308/25-9F DCMA-37P CET-C6B M24308/24-25f
Contextual Info: D-SUBMINIATURE D*KL Series HTD/HPD Series D*A Series Overmold Kits D*U Series T* Series Basic D Series Series 1 - High Reliability Series 3 - High Reliability M24308 Series Backshells/Junctionshells/Hoods Accessories Application Tooling D-subminiature Connectors

PTI 30 040 pa

Abstract: BD585
Contextual Info: D R A W I N G M AD E THIS DRAWING IN T HIR D A N G LE P R O J E C T I O N □1ST RELEASED FOR PUBLICATION IS U N P U B L I S H E D . COPYRIGHT BY AMP INCORPORATED. BD ALL INTERNATIONAL RIGHTS RESERVED. REVI SI ON S 48 DESCRI PTI ON REDRAWN REV PER ECN BD5049

354500-1

Abstract: NSN LTE ECR-06-007950 C3170 2-22T33-8 T-466320 8-32x5 3545001 10-32x7
Contextual Info: DRAW I H G HA D E IN THIRD PART NNNBER 466320 466320 466320 466320 T-466320 AHGLE RFV -1 -S -3 -4 -T AN AN AN AA /home/us016926/DMTECmod P R O J E C T I OH N I RST NSFP TERM I NAN 854400-1 585435-5 MACHINE REF M-N-L GUARC PIN 354500-1 — NAME: 8 A S0CK5T

DC-37PTI

Abstract: ms24266r bacc63bn LGA 478 SOCKET PIN LAYOUT 94v-0 lcd display BACC45 BACC63CB bacc10gh BACC63BV MIL-C-27500
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

DIN 41529

Abstract: bacc10 MIL-C-83513 connector BACC45FT BACC10GH BACC45FN S2402D PTI 30 040 ga BACC45FM cd 1191 acb
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

BACC63CB

Abstract: bacc63bv m32029 BACC45 BACC45FT M22759/33-26-9 BACC45FN BACC63BP MIL-C-39029/31 Cinch Connectors bacc45ft
Contextual Info: Catalog No. C-865 CIN:APSE High Speed Interconnect Technology CIN:APSE ® FEATURES High-Speed Interconnect Technology • High signal speed capability enabling frequencies greater than 20 GHz. ■ Z-Axis, solderless, compression mount interconnect system.

05564

Abstract: D-71522 9127 diode AE23 AF23 MO-151 MXED102 MXED202 Micron ONFI 2.2 MICRONIX INTEGRATED SYSTEMS
Contextual Info: MXED202 128-Channel OLED Row Driver Preliminary FEATURES: OVERVIEW: • Clare Micronix’s MXED202 is a row-multiplexed display driver for OLED panel displays. The MXED202 directly supports up to 128-row OLED panel displays, or can be cascaded for controlling

2267.1

Abstract: 74385 68595 7686 drv 8807 MO-151 MXED102 MXED202 MXED203 R159
Contextual Info: Preliminary MXED203 160-Channel OLED Row Driver FEATURES: OVERVIEW: • Clare Micronix’s MXED203 is a row-multiplexed display driver for OLED panel displays. The MXED203 directly supports up to 160-row OLED panel displays, or can be cascaded for controlling

PTI 30 040 pa

Abstract: t04 68 3 pin diode sg ag20 LP1 K06 1LPN3 AC03 nec ae02 marking HT15 22 marking ag01 TWN AA 427
Contextual Info: User’s Manual µPD98412 NEASCOT-X15 Advanced ATM Switch LSI Document No. S14169EJ2V0UMJ1 (2nd edition) Date Published October 2000 N CP(K) Printed in Japan 1999 [MEMO] 2 User’s Manual S14169EJ2V0UM00 NOTES FOR CMOS DEVICES 1 PRECAUTION AGAINST ESD FOR SEMICONDUCTORS

LP1 K06

Abstract: AC03 nec marking ag01 TWN AA 427 epd driver ic epd source driver ic IC Marking M03 6 PIN
Contextual Info: To our customers, Old Company Name in Catalogs and Other Documents On April 1st, 2010, NEC Electronics Corporation merged with Renesas Technology Corporation, and Renesas Electronics Corporation took over all the business of both companies. Therefore, although the old company name remains in this document, it is a valid

V23148 -B0010-A101 18V

Abstract: rt33l012wg schrack SCHRACK RP 419 rt33l012wg V23061-A1004-A302 pe514f03 5-1393236-7 varistor k60 V23061-b1006-a401 RY551024
Contextual Info: Berger US 14R-Mont-JK.qxp 23.09.2008 22:46 Seite 1 Catalog 9-1773450-2 Revised 9-08 General Purpose Relays Tyco Electronics Austria GmbH Pilzgasse 33 1210 Vienna Austria Phone: +43 1 90560-0 Fax: +43 1 90560-1333 www.tycoelectronics.com % Tyco Electronics Corporation

taiko relay TB1 160

Abstract: taiko relay TB1 taiko relay TB1 - 160 NEC Relay MR31 taiko relay schrack ZF 132 omron g2v relay relay footprints omron relay G2L 113 V23106
Contextual Info: R E L AY SELECTION GUIDE A m e r i c a n Z e t t l e r, I n c . Revised 2/24/05 Relay Selection Guide 0.61 0.40 0.84 0.85 0.94 1.10 1.38 0.43 SERIES FEATURES 1.23 0.58 AZ8 AZ164–AZ166 • High sensitivity 110 mW • Class B (130°C) insulation standard

pcr 4063

Abstract: SN 104 SCR image 31136 modem 56k sram OP 8368 0x2f68 IDT77252 ATM machine working circuit diagram bottle filling circuit diagram pti 8504
Contextual Info: IDT77252 ABR SAR User Manual Version 2.3 September 8, 1998 Find IDT on the World Wide Web at: www.idt.com or call us at 1-800-345-7015 IDT is located at: 2975 Stender Way Santa Clara, California, USA 95054-3090 1998 Integrated Device Technology, Inc. Printed U.S.A.

CI EEPROM 2816

Abstract: 31136 modem 56k sram pcr 4063 12697 scd 9104 SN 104 SCR image top 2556 en CRC10 CRC-10
Contextual Info: IDT77222 Micro SAR User Manual Version 1.0 September 8, 1998 Find IDT on the World Wide Web at: www.idt.com or call us at 1-800-345-7015 IDT is located at: 2975 Stender Way Santa Clara, California, USA 95054-3090 1998 Integrated Device Technology, Inc.

M24308-1-3

Abstract: Cinch db25 Connectors dbc25p DB-51212-1 DEU9SFO "D-Subminiature Connector" 62 Pin High Density EP-580 ne 5532 dd dbc-25p m24308-2-5
Contextual Info: D-SUBMINMTURC D *K l Series HTD/HPD Series D*R Series Overmold Kits D*U Series T* Series Basic D Series Series 1 - High Reliability Series 3 - High Reliability M24308 Series Backshells/Junctionshells/Hoods Rccessories Rpplication Tooling C inch D-subm iniature

ALi m 3329

Contextual Info: 1 ABR SAR Overview The IDT77252 ABR SAR PCI ATM Controller is a member of IDT's family of products for Asynchronous Transfer Mode ATM networks. The ABR SAR performs both the ATM Adaptation Layer (AAL) Segmentation and Reassembly (SAR) function and the ATM layer

kb3926

Abstract: CR2940 NORTH BRIDGE Crestline ene kb3926 quanta ALPR365K05 max8724 82C557 Socket AM2 KB392
Contextual Info: 1 2 3 4 6 7 8 SW7 BLOCK DIAGRAM PCB STACK UP LAYER 1 : TOP LAYER 2 : SGND1 A 5 CPU THERMAL SENSOR CPU Merom LAYER 3 : IN1 LAYER 4 : IN2 FAN 14.318MHz A PG 5 479P uPGA /46W PG 3,4 LAYER 5 : VCC 01 CLK_CPU_BCLK,CLK_CPU_BCLK# CLOCK GEN CLK_MCH_BCLK,CLK_MCH_BCLK#

ITT Cannon cct

Abstract: 4h27 CHP-420
Contextual Info: o SUBMINIATURE RECTANGULAR CONNECTORS ITT CANNON CONNECTOR SELECTION GUIDE Continued CONNECTORS FOR PRINTED CIRCUIT BOARDS SHIELDED RIGHT ANGLE EDBL25SBA1 ED* Series Page 17 PIN AND SOCKET RIGHT ANGLE DDP-50SAA 0* P Series Page 20 VERTICAL MOUNT DBPF25 (P or S) Y4

JVC RX 320 V

Abstract: snes jvc rc-770 le
Contextual Info: Features • 533k Samples Per Second ■ Standard ±10V and ±5V Input ■ DC Performance Over Temp: No Missing Code* 1/2 LSB Integral Linearity Error 3/4 LSB Differential Linearity Error ■ AC Performance Over Temp: 72dB Signal-to-Noise Ratio 80dB Spurious-free Dynamic Range

manchester verilog decoder

Abstract: gt-48001a skip 24 evi 10 t3 "filtering database" R5000 mips 10BT 74AC86 GT-48002A GT-48003
Contextual Info: GT-48001A Switched Ethernet Controller for 10BaseX Preliminary Revision 1.6 12/29/97 Please contact Galileo Technology for possible updates before finalizing a design. FEATURES • Advanced address recognition - Intelligent address recognition mechanism enables

motorola mc1

Abstract: Nippon capacitors
Contextual Info: MOTOROLA O rd er this d o c u m e n t S E M I C O N D U C T O R TE CH N IC AL DATA b y M C l 45 01 2/ D MC145012 Advance Information Photoelectric Smoke Detector w ith I/O and Temporal Pattern Horn Driver P S U F F IX PLASTIC DIP CASE 648 1 For B a tte ry -P o w e re d A pplications

Contextual Info: DS1612 P R O D U C T PREVI EW D A L L A S D S 1 6 1 2 Lithium Battery Monitor SEMICONDUCTOR FE AT URES PIN A S S I G N M E N T • P r o g r a m m a b l e battery m onitor tracks v olt age of a lith­ ium cell and provid es advanced wa rning of an imp en d in g battery failure

LBR 84

Contextual Info: Edition 2.0 1. MB86687 OVERVIEW The ALC simultaneously supports autonomous segmentation and reassembly of user data packets on up to 1024 virtual circuits VCs . User data packets are transferred to and from shared data structure memory using a high speed intelligent DMA

3.3v to 5v use 34063

Abstract: led driver 34063 iTVC12 sm 34063 sae a14
Contextual Info:
   
         June 2000 2975 Stender Way, Santa Clara, California 95054-3090 Telephone: 800 345-7015 • TWX: 910-338-2070 • FAX: (408) 492-8674 Printed in U.S.A. 2000 Integrated Device Technology, Inc.