QFE80RE Search Results

Contextual Info: Top View Bottom View 1.333" 1.500" 0.100" typ. 1.600" Side View 1.931" socket for QFP IC Clam Shell style ZIF Ay 0.874" 1 Ax 2 0.124" 0.020"±0.001" dia. typ. Dim "Ay" mm 19.6 17.2 17.9 19.0 18.8 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating

Contextual Info: Bottom View Top View 1.500" 1.333" 0.100" typ. Side View 1.500" 1.931" socket for QFP IC Clam Shell style ZIF Ay 0.874" 1 Ax 2 0.124" 0.020"±0.001" dia. typ. Dim "Ay" mm 19.6 17.2 17.9 19.0 18.8 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating

CA-QFE80RA-M-Z-T-01

Contextual Info: 2.600" 0.575" 0.100" 0.300" 1.700" 1.333" 0.183" Top view 1.944" 2 0.936" 0.393" Side view 1 1 Substrate: 0.0625"±0.007" FR4/G10 or equivalent high temp material. 1/2 oz. Cu clad. SnPb plating 2 Pins: Material- Brass Alloy 360 1/2 hard; finish- 10µ" Au over 50µ" Ni min. .

QFJ-144

Contextual Info: Ironwood Electronics Appendix Pages AP-C.1 APPENDIX C • QFP Chip Package Specifications – Metric . . .page AP-C.2 thru AP-C.5 • QFP Chip Package Specifications – English . . . . . . . . . . . . .page AP-C.6 PO Box 21151, St Paul, MN 55121 • USA • Tel: 800 404-0204 • (651) 452-8100 • Fax:(651) 452-8400

CA-QFE80RA-L-Z-T-01

Contextual Info: 2.600" 0.575" 0.100" 0.300" Top view 1.333" 1.700" 0.183" 1.944" 1 0.936" 0.393" 2 1.266" assembled 3 SMT QFP emulator foot leadless 0.8 mm. pitch Side view X Footprint Y Bottom view; SMT base (only) Dim "X" QFE80RA Dim "Y" 0.690" 0.930" QFE80RB 0.630" 0.870"