QFN 8X8 Search Results

QFN 7X7

Abstract: qfn 8x8 56 qfn 7x7 QFN 7X7 package QFN-4x4 QFN 56 7x7
Contextual Info: Package Diagram QFN 20-Lead QFN 4x4 mm LF20 51-85163-* 48-Lead QFN (7x7 mm) LF48 51-85152-* 1 Package Diagram 56-Lead QFN (8x8 mm) 51-85144-*A 2

size 0204

Abstract: QFN PCB Layout guide TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
Contextual Info: GHz QFN Socket User Manual Tel: 800 404-0204 Fax: (952) 229-8201 www.ironwoodelectronics.com GHz QFN Socket User Manual Selecting QFN socket: You need to have the IC package drawing ready to select the correct QFN socket. Go to www.ironwoodelectronics.com. Select “Products” link, then under “Browse” menu, select

AN315

Abstract: an315 audio power an315 audio AN315 AUDIO AMPLIFIER QFN PACKAGE thermal resistance "thermal via" QFN 9X9 QFN PACKAGE Junction to PCB thermal resistance CS4525 Signal Path Designer
Contextual Info: AN315 Thermal Considerations for QFN Packaged Integrated Circuits Over the past few years, Quad Flat No-Lead QFN packages have become very popular for audio amplifier applications needing efficient power dissipation in small footprints. These packages, shown in Figure 1, are

QFN 64 8x8 dimension

Contextual Info: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

QFN 64 8x8 dimension

Abstract: WA13072DQAET QFN 64 9X9 dimension qfn 64 9x9 qfn 3x3 socket QFN 56 7x7
Contextual Info: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

QFN 76 9x9 footprint

Abstract: QFN 64 8x8 footprint qfn 44 PACKAGE footprint 7x7 DIe Size QFN 56 7x7 footprint DUAL ROW QFN leadframe qfn 44 PACKAGE footprint 7x7 qfn 44 7x7 PACKAGE footprint qfn 76 PACKAGE footprint QFN 48 7x7 footprint footprint mlf
Contextual Info: LEADFRAME data sheet Leadframe CSP MicroLeadFrame MLF®/QFN/SON/DFN Package High Performance, Cost Efficient Features Amkor's MicroLeadFrame® (QFN - Quad Flat No-Lead package) is a near CSP plastic encapsulated package with a copper leadframe substrate. This package uses

QFN 64 8x8 dimension

Abstract: 56 qfn 7x7 2x2 dfn qfn 52 6x6
Contextual Info: WINSLOW ADAPTICs Data Sheet QFN to PGA Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

QFN 64 8x8 dimension

Abstract: DFN 10 socket qfn 52 6x6 3x2 DFN 7x5 qfn venice venice 6
Contextual Info: WINSLOW ADAPTICs Data Sheet QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

QFN 64 8x8 dimension

Abstract: W13028 QFN 7x5 2x2 dfn Winslow qfn 3x3 socket
Contextual Info: WINSLOW ADAPTICs Data Sheet – QFN to DIP Generic Adapters These adapters allow the prototyping of QFN, DFN and UTDFN devices on a 2.54mm pitch development board. The top of the adapter has surface mount pads to which the surface mount device can be soldered.

jedec package MO-247

Abstract: qfn 88 stencil QN180 IEC-68-2-32 QFN PCB Layout guide QN108 Amkor TSCSP qfn 32 land pattern IPC-TM-650 2.6.9 QN180 outline
Contextual Info: Application Note AC322 Assembly and PCB Layout Guidelines for QFN Packages Introduction The dual-row or multi-row QFN package is a near Chip Scale, plastic-encapsulated package with a copper leadframe substrate. The exposed die attach paddle on the bottom efficiently conducts heat to the PCB

WAN0158

Abstract: X-RAY INSPECTION qfn 32 stencil WAN-0236 QFN PCB Layout guide die paddle 32-pin QFN PCB Layout guide 81-pin EH11 qfn 44 PACKAGE footprint
Contextual Info: w WAN-0236 Recommendations on Soldering a Dual Row QFN Package to a PCB INTRODUCTION The Quad Fine Pitch No Leads QFN package is a leadless plastic package, which obtains electrical contact via lands on the bottom surface of the device. Its compact nature and low profile makes the

DUAL ROW QFN leadframe

Abstract: QFN tray qfn 4x4 JEDEC qfn tray tray qfn 8x8 tray qfn 6x6 QFN tray 8x8 tray qfn 9x9 QFN 64 8x8 PACKAGE TRAY AN 7823 JEDEC qfn tray 5x5
Contextual Info: QFN Quad Flat No-Lead Package • Punch or Saw singulated formats • Body sizes from 2 x 2mm to 12 x 12mm • Pin counts from 4L to 156L • Square or rectangular body sizes • Leads on four sides of the body QFN • Leads on two opposing sides of the

Contextual Info: 19-3758; Rev 0; 8/05 KIT ATION EVALU E L B AVAILA High-Dynamic-Range, 16-Bit, 80Msps ADC with -82dBFS Noise Floor PART TEMP RANGE -40°C to +85°C 56 Thin QFN-EP MAX19586ETN+ -40°C to +85°C 56 Thin QFN-EP MAX19586ETN T5688-2 DVDD DGND DGND D0 D1 D5 D6 D7

QFN56

Contextual Info: FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARJ10510D QUAD FLAT NON-LEADED PACKAGE QFN CASE NUMBER: 1674-02 56 TERMINAL, 0.5 PITCH ( 8X8X0. 9) STANDARD: NON-JEDEC CASE-OUTLINE

Contextual Info: VIEW ROTATED 90° CW FREESCALE SEMICONDUCTOR, INC. ALL RIGHTS RESERVED. TITLE: MECHANICAL OUTLINE PRINT VERSION NOT TO SCALE DOCUMENT NO: 98ARJ10509D QUAD FLAT NON-LEADED PACKAGE QFN; CASE NUMBER: 1657-01 56 TERMINAL, 0.5 PITCH (8X8X1 STANDARD: NON-JEDEC

CHL8228G-00CRT

Contextual Info: CHL8225G/8G Digital Multi-Phase Buck Controller DESCRIPTION • Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN, MSL2 package APPLICATIONS  Multiphase GPU systems The CHL8225G/8G provides extensive OVP, UVP, OCP and OTP fault protection and includes thermistor based

56-L

Abstract: M0-220 TOP MARK AX
Contextual Info: IN D E X D /2 : TOP VIEW I DETAIL A SIDE VIEW y v i / \ x ij v \ PROPRIETARY TITLEi PACKAGE OUTLINE, 56L QFN, 8x8x0.8 MM APPROVAL DOCUMENT CONTROL NO. 21-0135 REV A ¥ NOTES: 1. DIE THICKNESS ALLOWABLE IS 0 .3 0 5 m m

Contextual Info: CHL8225G/8G Digital Multi-Phase Buck Controller FEATURES DESCRIPTION APPLICATIONS • Multiphase GPU systems RCSP IRTN1 ISEN1 IRTN2 ISEN2 IRTN3 ISEN3 IRTN4 ISEN4 IRTN5 ISEN5 PIN DIAGRAM 40 39 38 37 36 35 34 33 32 31 1 30 ISEN6  Pb-Free, RoHS, 6x6 40-pin & 8x8 56-pin QFN

QFN leadframe

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

CSR8615

Contextual Info: CSR8615 Description Key Features The BlueCore CSR8615 QFN single-chip Bluetooth audio ROM device targets mono speakers and headsets Bluetooth® v4.0 specification compliant Radio includes integrated balun and RF performance of 9dBm transmit power and -91dBm receive sensitivity

AK08D300-CLCC

Abstract: AK08D300-LFCSP2X3 .5mm AK08D300-LFCSP3x3 .5mm AK08D300-MLP.65mm AK10D300-8SON .65mm MLP 3X3 MLP 4X4 AK22D300-DFN AK24D300-LLP MLP 5X5
Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

CSR8635

Contextual Info: CSR8635 Description Key Features The BlueCore CSR8635 QFN single-chip Bluetooth audio ROM device targets stereo speakers and headsets Bluetooth® v4.0 specification compliant Radio includes integrated balun and RF performance of 9dBm transmit power and -91dBm receive sensitivity

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface

Contextual Info: ACCUTEK Chip Scale Packages LLP, DFN, QFN, MLP, CLCC DIP Adapters MICROCIRCUIT CORPORATION DIP ADAPTER MODULES ELIMINATE THE NEED TO REDESIGN MOTHERBOARDS OR MAY BE USED FOR BREADBOARD PROTOTYPING FEATURES Description This new family of Accutek DIP Adapter Modules converts surface