QFN-10 SOLDER PASTE Search Results
QFN-10 SOLDER PASTE Result Highlights (5)
Part | ECAD Model | Manufacturer | Description | Download | Buy |
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CN-AC3MMDZBAU |
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3-Pin XLR Male Panel Mount Connector - Amphenol AC3MMDZB-AU - Solder Type (Black + Gold Contacts) | Datasheet | ||
CN-DSUB50SKT0-000 |
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Amphenol CN-DSUB50SKT0-000 D-Subminiature (DB50 Female D-Sub) Connector, 50-Position Socket Contacts, Solder-Cup Terminals | Datasheet | ||
CN-DSUBHD62SK-000 |
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Amphenol CN-DSUBHD62SK-000 High-Density D-Subminiature (HD62 Female D-Sub) Connector, 62-Position Socket Contacts, Solder-Cup Terminals | Datasheet | ||
CN-DSUB37SKT0-000 |
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Amphenol CN-DSUB37SKT0-000 D-Subminiature (DB37 Female D-Sub) Connector, 37-Position Socket Contacts, Solder-Cup Terminals | Datasheet | ||
CN-DSUBHD44SK-000 |
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Amphenol CN-DSUBHD44SK-000 High-Density D-Subminiature (HD44 Female D-Sub) Connector, 44-Position Socket Contacts, Solder-Cup Terminals | Datasheet |
QFN-10 SOLDER PASTE Datasheets Context Search
Catalog Datasheet | Type | Document Tags | |
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QFN 76 9x9 footprint
Abstract: QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220
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AN1902 QFN 76 9x9 footprint QFN 64 8x8 footprint QFN PACKAGE thermal resistance JEDEC JESD51-8 BGA 4914 smd qfn 32 land pattern QFN 64 9x9 footprint QFN 9X9 AN1902 MO-220 | |
BD 4914
Abstract: QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8
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AN1902/D BD 4914 QFN 76 9x9 footprint qfn 48 7x7 stencil QFN 64 8x8 footprint QFN 64 9x9 footprint land pattern BGA 0.75 freescale QFN 56 7x7 footprint QFN PCB Layout guide Motorola MAP QFN MO-220 8x8 | |
FOOTPRINT MO-229 2X3 SOLDERING
Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
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AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220 | |
EndoScope
Abstract: ipc 610 AN-1133 IPC-A-610
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AN-1133 IR3800PbF) EndoScope ipc 610 AN-1133 IPC-A-610 | |
ipc 610
Abstract: AN-1137 IPC-A-610
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AN-1137 IRFH7932TRPbF) ipc 610 AN-1137 IPC-A-610 | |
IPC-7095B
Abstract: IPC-7095 7095B IPC 7095B EN5312QI en5312 qfn stencil
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EN5312QI IPC-7095B IPC-7095 7095B IPC 7095B en5312 qfn stencil | |
EP5382QIContextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5382QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP5382QI power converter packages are designed with a plastic leadframe |
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EP5382QI | |
EN5394QI
Abstract: QFN leadframe QFN PACKAGE thermal resistance qfn 44 PACKAGE footprint EN5394
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EN5394QI QFN leadframe QFN PACKAGE thermal resistance qfn 44 PACKAGE footprint EN5394 | |
EN5311Qi
Abstract: EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil
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EN5311QI EN5311 IPC-7095 IPC-7095B QFN PACKAGE thermal resistance "exposed pad" PCB via qfn 32 land pattern qfn stencil | |
EN5364QIContextual Info: Enpirion, Inc. 53 Frontage Road, Suite 210, Hampton, NJ 08827 Tel. 908.894.6000 Fax. 908.894.6090 www.enpirion.com EN5364QI QFN Package Soldering Guidelines 2/3/2010 1.0 INTRODUCTION Enpirion’s EN5364QI power converter packages are designed with a plastic leadframe |
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EN5364QI | |
en5337qi
Abstract: EN5337 qfn 32 stencil smd be
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EN5337QI EN5337 qfn 32 stencil smd be | |
EP5352QIContextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5352QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP5352QI power converter packages are designed with a plastic leadframe |
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EP5352QI | |
EN5335QI
Abstract: qfn stencil EN5335Q qfn 32 stencil Thermal vias
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EN5335QI qfn stencil EN5335Q qfn 32 stencil Thermal vias | |
QFN leadframe
Abstract: smt pcb ipc standard
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EP5362QI QFN leadframe smt pcb ipc standard | |
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EP53F8QIContextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP53F8QI QFN Package Soldering Guidelines 1.0 INTRODUCTION Enpirion’s EP53F8QI power converter packages are designed with a plastic leadframe |
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EP53F8QI | |
qfn 32 land pattern
Abstract: EN5396QI QFN footprint QFN leadframe qfn 32 stencil
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EN5396QI qfn 32 land pattern QFN footprint QFN leadframe qfn 32 stencil | |
EN5336QI
Abstract: stencil qfn stencil
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EN5336QI stencil qfn stencil | |
inspection mirror
Abstract: QFN leadframe QFN PACKAGE thermal resistance qfn stencil
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EN5395QI inspection mirror QFN leadframe QFN PACKAGE thermal resistance qfn stencil | |
EN5366QI
Abstract: en5366 stencil qfn stencil
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EN5366QI en5366 stencil qfn stencil | |
qfn 44 PACKAGE footprint
Abstract: EN5365QI EN5365 QFN PACKAGE thermal resistance
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EN5365QI qfn 44 PACKAGE footprint EN5365 QFN PACKAGE thermal resistance | |
EP5368QIContextual Info: Enpirion, Inc. 685 Route 202/206, Suite 305, Bridgewater, NJ 08807 Tel. 908.575.7550 Fax. 908.575.0755 www.enpirion.com EP5368QI QFN Package Soldering Guidelines John D. Weld, Ph.D. 9/27/2007 1.0 INTRODUCTION Enpirion’s EP5368QI power converter package is designed with a plastic leadframe |
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EP5368QI | |
pcb fabrication process
Abstract: EP53
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EP53XXXQI pcb fabrication process EP53 | |
qfn Substrate design guidelines
Abstract: 514 hg JEDEC QFN case outline QFN PACKAGE thermal resistance AN-1133 JESD22B111 IR3800
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AN-1132 IR3800PbF) qfn Substrate design guidelines 514 hg JEDEC QFN case outline QFN PACKAGE thermal resistance AN-1133 JESD22B111 IR3800 | |
slua271a
Abstract: SON PCB Attachment IPC-7525 qfn Substrate design guidelines ipc 7525 DUAL ROW QFN leadframe Service Manual smd rework station IPC7525 IPC7711 JESD51-7
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SLUA271A slua271a SON PCB Attachment IPC-7525 qfn Substrate design guidelines ipc 7525 DUAL ROW QFN leadframe Service Manual smd rework station IPC7525 IPC7711 JESD51-7 |