QFP 100 SOCKET Search Results

socket Yamaichi IC201

Abstract: IC201 IC201-1004-008
Contextual Info: QFP- PC Board Layouts IC200 to IC248 Series Top View from Socket Recommended PC Board Layouts Reference Only QFP IC201-1004-008 (100 Pins) QFP IC201-1004-050 (100 Pins) 34.67±0.05 28.67+0.05 29.59±0.05 5 - 0.65x29=18.85±0.1 29.59±0.05 QFP IC201-1004-016 (100 Pins)

ASTM-B16-85

Contextual Info: Part No. 96-100M65 - QFP to PGA Adapter for EIAJ 100 Position, .0256 [.65] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

ASTM-B16-85

Contextual Info: Part No. 95-100I25 - QFP to PGA Adapter for JEDEC 100 Position, .025 [.64] Pitch FEATURES: • Convert surface mount QFP packages to a 13 x 13 PGA footprint. • Reduce costs by using less expensive QFP packages to replace PGA footprints in existing designs.

RJ11 pin configuration

Abstract: telephone hybrid Z87000 Z8700000ZEM Z8700001ZCO Z8700016FSC Z8700016VSC Z87010 Z8701016FSC telephone
Contextual Info: SUPPORT PRODUCT 1 Z8700001ZCO 1 DEVELOPMENT KIT FEATURES • Supported Devices Packages Evaluation Programming/ Emulation 100-Pin QFP 84-Pin PLCC 44-Pin QFP 44-Pin PLCC Z8700016FSC Z8700016VSC Z8701016FSC Z870106VSC N/A N/A N/S N/A ■ Two Jumper Configurable Circuit Boards

IC149-100-025-B5

Abstract: IC149-100-125-B5 ICP-100-4-4 ICP-100-5
Contextual Info: Click here to go back to socket part number overview IC149 Series SMT QFP/TQFP - 100 Pins (25x25) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.:

TQFP 100 socket

Abstract: TQFP 100 pin Socket IC149-100-KS11113-0 IC149-100-KS11113-1 ICP-100-4-1 ICP-100-4-4 ICP-100-5 ICP-100-6
Contextual Info: IC149 Series SMT QFP/TQFP - 100 Pins (25x25) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):

TQFP IC-Socket

Abstract: IC149-100-KS11113-1 ICP-100-4-1 ICP-100-4-4 ICP-100-5 IC149-100-KS11113-0 TQFP 100 socket
Contextual Info: IC149 Series SMT QFP/TQFP - 100 Pins (25x25) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles: Solvent Durability: Allowable Torque (max.):

ICP-100-5

Abstract: IC149-100-025-B5 IC149-100-028-B5 IC149-100-125-B5 ICP-100-6
Contextual Info: CLICK HERE TO GO BACK TO PART NUMBER OVERVIEW IC149 Series SMT QFP/TQFP - 100 Pins (25x25) 0.5mm pitch Part Number (Details) Specifications Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temp. Range: Reflow-soldering Temp.: Mating Cycles:

Contextual Info: 2.54 x 10 = 25.4 15.67 0.50 x 24 = 12 2.54 0.50 30.48 15.67 30.48 0.635 2.54 2.54 0.50 . 6 5.0 0.635 MODIFICATIONS 1 6.50 30.48 TOLERANCE PART NUMBER WINSLOW ADAPTICS LTD WA10050P DESCRIPTION IC Socket Adaptor, QFP, PGA, two piece, 100 way, 0.50mm 0.0 +/- 0.1

100P6S-A

Abstract: SG-51P
Contextual Info: PCA7752B Converter Board from 100-pin 0.65-mm-pitch QFP 100P6S-A to 50-pin DIL Standard Pitch User's Manual Keep safety first in your circuit designs! • Renesas Technology Corporation and Renesas Solutions Corporation put the maximum effort into making semiconductor products better and more

304 MQFP

Abstract: MQ240 XC3030A
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

XC3020A

Abstract: XC3020L XC3030A XC3030L XC3042A XC3042L XC3064A XC3064L XC3090A XC3090L
Contextual Info: 44 48 64 68 84 100 120 132 144 156 160 164 24 175 176 184 191 196 208 223 225 228 240 299 304 352 411 432 475 560 PLASTIC LCC PLASTIC QFP PLASTIC VQFP CERAMIC LCC PLASTIC DIP PLASTIC VQFP PLASTIC LCC CERAMIC LCC CERAMIC PGA PLASTIC LCC CERAMIC LCC CERAMIC PGA

diode 5817 specifications

Abstract: 38C1 38K0 38K2 renesas 64 QFP IC-640 lcc 28 socket
Contextual Info: M38C29T-64LCA Converter Board for Connecting 100-pin RFS Type Emulator MCU to 64-pin 0.8-mm-pitch QFP/LQFP for 38000 Series 38C1, 38C2, 38K0 and 38K2 Groups User's Manual Keep safety first in your circuit designs! • Renesas Technology Corporation and Renesas Solutions Corporation put the maximum effort into making semiconductor products better and more

100P6S-A

Abstract: 100p6s touch screen connector AXN550045P AXN650545P AXS4002M2 AXS4003M295C J239
Contextual Info: M3T-DUMMY100S Dummy IC for 100-pin 0.65-mm-pitch QFP User's Manual Keep safety first in your circuit designs! • Renesas Technology Corporation and Renesas Solutions Corporation put the maximum effort into making semiconductor products better and more reliable, but there is always the possibility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property

TO-220 JEDEC

Abstract: ND-1420-2 QFP Package 80 lead 4-0308 4040 data sheet 9 pin socket nd-3232-3.4 parts detail of 5.1 sound pcb QFP 100 pin QFP Shipping Trays
Contextual Info: QFP Carrier & Development Socket August 1999, ver. 13 Features Data Sheet • ■ ■ ■ ■ General Description Quad flat pack QFP carriers protect fragile leads on QFP devices during shipping and device handling. QFP development sockets allow on-board electrical and mechanical

removal tool from EPLD socket

Contextual Info: QFP Carrier & Development Socket M a rc h 1995, ver. 7 Features D ata S h ee t • ■ ■ ■ General Description Q uad flat pack QFP carriers protect fragile leads on Altera QFP devices during shipping and device handling. Development sockets allow on-board electrical and mechanical

IC198-1001-210

Abstract: IC198A-1000-100 mark B2 1400E IC198
Contextual Info: QFP metal cover SMT IC198 Series Cover Ordering Information Socket Characteristics Current Rating: Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Mating Cycles: IC198- *- 2*0 * Socket Series No. of Contacts Design Number

Contextual Info: QFP Carrier & Development Socket Ju n e 1996, ver. 10 Features D ata S h e e t • ■ ■ ■ ■ General Description Q u a d flat p ac k Q FP c a rrie rs p ro te c t frag ile le a d s o n Q F P d ev ice s d u rin g sh ip p in g a n d d ev ic e h a n d lin g .

IC51-0484-806

Abstract: IC51-1284-1788 IC51-0324-1498 IC51-1764-1505-5 IC51-1284-1433 IC51-1844-1148 IC51-2564-1668-10 ic51-0804-795 ic51-0444-825 IC51-1604-1350
Contextual Info: QFP, PQFP, TQFP Clamshell IC51 Series IC51- 064 4- 038 Insulation Resistance: Withstanding Voltage: Contact Resistance: Operating Temperature: Socket Series No. of Leads No. of Sides with Contacts Design No. Characteristics 1,000M½minimum at 500 VDC 700 VAC for 1 minute

Contextual Info: ADVANCED QFP Sockets INTERCONNECTIONS. 5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850 / 401-823-5200 Fax 401-823-8723 Email advintC0rp@a0l.C0m Internet http://www.advintcorp.com QFP Sockets Preliminary - Consult Factory Features:

FPQ 208 0.5 10

Abstract: FPQ Package FPQ-256 FPQ 240 FPQ-240-0 FPQ-240-0.5 FPQ-48-0 FPQ-52-0.65-01A 52 FPQ-64 FPQ-44-0
Contextual Info: QFP QUAD FLAT PACKAGE ORDERING PROCEDURE FPQ □□□ □. □□ □□ Design NO. Pitch Pin Count Socket Series SPECIFICATIONS Contact resistance: Initial 30mΩ At 10 mA Maximum voltage: AC700V RMS (for 1 minute) Below 0.5mm Pitch

Z89371

Abstract: 40 pin DIP socket
Contextual Info: Z8937100ZDF S UPPOR TP RODUCT Z8937100ZDF QFP TO DIP PROGRAMMING ADAPTER DESCRIPTION KIT CONTENTS The Z8937100ZDF Programming Adapter is used in conjunction with the Z8937100ZEM Icebox . The adapter connects directly to the DIP programming socket to provide QFP programming capability.

Yamaichi IC51-0444-1568

Abstract: IC51-0444-1568 LCS-68 PQFP ALTERA 160 LCS-68-12 IC51-1444-1354-7 IC51-2084-1052-11 IC51-1004-809 Framatome Connectors IC51
Contextual Info: Selecting Sockets for Altera Devices January 1999, ver. 3 Introduction Application Note 80 Surface-mount assembly places unique demands on the development and manufacturing process by requiring different CAD symbols for printed circuit board PCB layout, different soldering processes for production

ic51-1604-845-4

Abstract: socket Yamaichi ic51 IC51 - 1052 - 13 LCS-68 fpq-240
Contextual Info: Selecting Sockets for Altera Devices A pplication Note 80 June 1996, ver. 1 Introduction Altera offers a number of surface-mount packages. Surface-mount assem bly places unique dem ands on the developm ent and manufacturing process by requiring different CA D sym bols for printed circuit board